JP5595196B2 - 圧電デバイス - Google Patents

圧電デバイス Download PDF

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Publication number
JP5595196B2
JP5595196B2 JP2010207861A JP2010207861A JP5595196B2 JP 5595196 B2 JP5595196 B2 JP 5595196B2 JP 2010207861 A JP2010207861 A JP 2010207861A JP 2010207861 A JP2010207861 A JP 2010207861A JP 5595196 B2 JP5595196 B2 JP 5595196B2
Authority
JP
Japan
Prior art keywords
crystal
base
frame
wafer
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010207861A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012065155A5 (enExample
JP2012065155A (ja
Inventor
岳寛 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Dempa Kogyo Co Ltd
Original Assignee
Nihon Dempa Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Dempa Kogyo Co Ltd filed Critical Nihon Dempa Kogyo Co Ltd
Priority to JP2010207861A priority Critical patent/JP5595196B2/ja
Priority to CN2011102453996A priority patent/CN102403982A/zh
Priority to US13/232,118 priority patent/US8896185B2/en
Priority to TW100132934A priority patent/TWI469513B/zh
Publication of JP2012065155A publication Critical patent/JP2012065155A/ja
Publication of JP2012065155A5 publication Critical patent/JP2012065155A5/ja
Application granted granted Critical
Publication of JP5595196B2 publication Critical patent/JP5595196B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/0595—Holders or supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2010207861A 2010-09-16 2010-09-16 圧電デバイス Expired - Fee Related JP5595196B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010207861A JP5595196B2 (ja) 2010-09-16 2010-09-16 圧電デバイス
CN2011102453996A CN102403982A (zh) 2010-09-16 2011-08-22 压电装置
US13/232,118 US8896185B2 (en) 2010-09-16 2011-09-14 Piezoelectric device
TW100132934A TWI469513B (zh) 2010-09-16 2011-09-14 壓電裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010207861A JP5595196B2 (ja) 2010-09-16 2010-09-16 圧電デバイス

Publications (3)

Publication Number Publication Date
JP2012065155A JP2012065155A (ja) 2012-03-29
JP2012065155A5 JP2012065155A5 (enExample) 2013-09-19
JP5595196B2 true JP5595196B2 (ja) 2014-09-24

Family

ID=45817118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010207861A Expired - Fee Related JP5595196B2 (ja) 2010-09-16 2010-09-16 圧電デバイス

Country Status (4)

Country Link
US (1) US8896185B2 (enExample)
JP (1) JP5595196B2 (enExample)
CN (1) CN102403982A (enExample)
TW (1) TWI469513B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5325151B2 (ja) * 2010-03-31 2013-10-23 日本電波工業株式会社 水晶デバイス、及びその製造方法
JP2012034086A (ja) * 2010-07-29 2012-02-16 Nippon Dempa Kogyo Co Ltd 圧電デバイスの製造方法及び圧電デバイス
JP2012060628A (ja) * 2010-08-07 2012-03-22 Nippon Dempa Kogyo Co Ltd 圧電デバイス及びその製造方法
JP5646367B2 (ja) * 2011-02-25 2014-12-24 日本電波工業株式会社 水晶デバイス
JP5999833B2 (ja) * 2011-06-08 2016-09-28 日本電波工業株式会社 水晶デバイス
JP5788728B2 (ja) * 2011-07-21 2015-10-07 日本電波工業株式会社 圧電振動片、圧電デバイス、及び圧電デバイスの製造方法
US20130043770A1 (en) * 2011-08-17 2013-02-21 Nihon Dempa Kogyo Co., Ltd. Piezoelectric vibrating piece and piezoelectric device
JP2013051512A (ja) * 2011-08-30 2013-03-14 Nippon Dempa Kogyo Co Ltd 水晶振動子
DE102012202727B4 (de) * 2012-02-22 2015-07-02 Vectron International Gmbh Verfahren zur Verbindung eines ersten elektronischen Bauelements mit einem zweiten Bauelement
JP2013258519A (ja) * 2012-06-12 2013-12-26 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP2014060245A (ja) * 2012-09-18 2014-04-03 Mitsubishi Electric Corp 半導体装置
US10103709B2 (en) * 2013-11-05 2018-10-16 Kyocera Corporation Crystal unit
KR101575800B1 (ko) * 2014-08-19 2015-12-08 주식회사 이노칩테크놀로지 압전 소자 및 이를 구비하는 전자기기
US10938375B2 (en) 2015-03-31 2021-03-02 Murata Manufacturing Co, Ltd. Resonator
WO2016158048A1 (ja) 2015-03-31 2016-10-06 株式会社村田製作所 共振子
US10778182B2 (en) * 2015-03-31 2020-09-15 Murata Manufacturing Co., Ltd. Resonator
US10888009B2 (en) * 2018-10-26 2021-01-05 Medtronic, Inc. Method of forming a sealed package
WO2021220544A1 (ja) * 2020-04-30 2021-11-04 株式会社村田製作所 圧電振動子及びそれを備える圧電発振器
TWI788669B (zh) 2020-05-28 2023-01-01 台灣晶技股份有限公司 振子晶體的晶圓級封裝結構
TWI776445B (zh) * 2021-03-30 2022-09-01 台灣晶技股份有限公司 晶體振子封裝結構

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3137836A (en) * 1955-08-25 1964-06-16 Clyde P Glover Support for electro-acoustic transducer
JPS5693412A (en) * 1979-12-26 1981-07-29 Seiko Instr & Electronics Ltd Superthin quartz oscillator
US4641054A (en) * 1984-08-09 1987-02-03 Nippon Ceramic Company, Limited Piezoelectric electro-acoustic transducer
JPS61138275A (ja) 1984-12-10 1986-06-25 Nippon Denki Kanji Syst Kk フラツシユ定着装置
JPS61138275U (enExample) * 1985-02-15 1986-08-27
JPS61256656A (ja) * 1985-05-08 1986-11-14 Fujitsu Ltd 半導体装置
JPS6457738A (en) * 1987-08-28 1989-03-06 Sumitomo Electric Industries Package for semiconductor device
JP2712602B2 (ja) * 1989-08-10 1998-02-16 株式会社村田製作所 圧電共振子の製造方法
JP2547787Y2 (ja) * 1991-04-27 1997-09-17 株式会社トーキン 圧電振動子
JPH0559951U (ja) * 1992-01-09 1993-08-06 株式会社村田製作所 圧電部品
JP2580471B2 (ja) 1993-07-28 1997-02-12 調和工業株式会社 ア―ム式作業機用杭打装置
JPH08125050A (ja) * 1994-10-21 1996-05-17 Mitsubishi Electric Corp 半導体装置
JP3301262B2 (ja) * 1995-03-28 2002-07-15 松下電器産業株式会社 弾性表面波装置
JP2000150687A (ja) * 1998-11-18 2000-05-30 Matsushita Electric Ind Co Ltd 電子部品とその製造方法
JP2001119795A (ja) * 1999-08-10 2001-04-27 Murata Mfg Co Ltd 圧電型電気音響変換器
JP2002170895A (ja) * 2000-11-30 2002-06-14 Kyocera Corp 電子部品収納用パッケージおよびその封止方法
JP3669431B2 (ja) * 2001-08-20 2005-07-06 株式会社村田製作所 圧電型電気音響変換器
TW567664B (en) * 2001-10-09 2003-12-21 Ebauchesfabrik Eta Ag Piezoelectric resonator and assembly comprising the same enclosed in a case
JP2003163560A (ja) * 2001-11-27 2003-06-06 Kyocera Corp 圧電振動子収納用容器
JP3968782B2 (ja) * 2002-07-15 2007-08-29 株式会社大真空 電子部品用パッケージおよび当該パッケージを用いた圧電振動デバイスおよび圧電振動デバイスの製造方法
JP2004222053A (ja) 2003-01-16 2004-08-05 Seiko Epson Corp 圧電デバイス、携帯電話装置及び電子機器
JP4003686B2 (ja) * 2003-04-10 2007-11-07 株式会社村田製作所 圧電型電気音響変換器
JP2005109886A (ja) * 2003-09-30 2005-04-21 Seiko Epson Corp 圧電デバイスとその製造方法ならびに圧電デバイスを利用した携帯電話装置および圧電デバイスを利用した電子機器
JP2005216932A (ja) * 2004-01-27 2005-08-11 Kyocera Corp 配線基板及びその製造方法並びに電気部品
JP2007073713A (ja) * 2005-09-06 2007-03-22 Epson Toyocom Corp 圧電デバイス用パッケージ
JP2007258918A (ja) * 2006-03-22 2007-10-04 Epson Toyocom Corp 圧電デバイス
JP2007274071A (ja) * 2006-03-30 2007-10-18 Daishinku Corp 圧電振動デバイス用のベースおよび圧電振動デバイス
WO2008018222A1 (fr) * 2006-08-10 2008-02-14 Daishinku Corporation Dispositif piézoélectrique de vibrations
JP2009278612A (ja) * 2008-04-18 2009-11-26 Nippon Dempa Kogyo Co Ltd 表面実装用の水晶デバイス

Also Published As

Publication number Publication date
TWI469513B (zh) 2015-01-11
US20120068578A1 (en) 2012-03-22
TW201214961A (en) 2012-04-01
CN102403982A (zh) 2012-04-04
US8896185B2 (en) 2014-11-25
JP2012065155A (ja) 2012-03-29

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