JP5590906B2 - 液体吐出ヘッド用基板の製造方法 - Google Patents
液体吐出ヘッド用基板の製造方法 Download PDFInfo
- Publication number
- JP5590906B2 JP5590906B2 JP2010026488A JP2010026488A JP5590906B2 JP 5590906 B2 JP5590906 B2 JP 5590906B2 JP 2010026488 A JP2010026488 A JP 2010026488A JP 2010026488 A JP2010026488 A JP 2010026488A JP 5590906 B2 JP5590906 B2 JP 5590906B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- protective layer
- substrate
- manufacturing
- discharge head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/36—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases using ionised gases, e.g. ionitriding
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/80—After-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010026488A JP5590906B2 (ja) | 2010-02-09 | 2010-02-09 | 液体吐出ヘッド用基板の製造方法 |
| US13/022,975 US8846162B2 (en) | 2010-02-09 | 2011-02-08 | Manufacturing method for liquid-discharge head substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010026488A JP5590906B2 (ja) | 2010-02-09 | 2010-02-09 | 液体吐出ヘッド用基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011161760A JP2011161760A (ja) | 2011-08-25 |
| JP2011161760A5 JP2011161760A5 (enExample) | 2013-03-28 |
| JP5590906B2 true JP5590906B2 (ja) | 2014-09-17 |
Family
ID=44352730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010026488A Expired - Fee Related JP5590906B2 (ja) | 2010-02-09 | 2010-02-09 | 液体吐出ヘッド用基板の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8846162B2 (enExample) |
| JP (1) | JP5590906B2 (enExample) |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3247426B2 (ja) * | 1991-07-11 | 2002-01-15 | キヤノン株式会社 | ヘッドおよびその製造方法 |
| JP3229146B2 (ja) * | 1994-12-28 | 2001-11-12 | キヤノン株式会社 | 液体噴射ヘッドおよびその製造方法 |
| JP3402865B2 (ja) * | 1995-08-09 | 2003-05-06 | キヤノン株式会社 | 液体噴射記録ヘッドの製造方法 |
| US5999379A (en) * | 1997-12-11 | 1999-12-07 | International Business Machines Corporation | Spin valve read head with plasma produced metal oxide insulation layer between lead and shield layers and method of making |
| US6265318B1 (en) * | 1998-01-13 | 2001-07-24 | Applied Materials, Inc. | Iridium etchant methods for anisotropic profile |
| US6398349B1 (en) * | 1998-03-04 | 2002-06-04 | Seiko Epson Corporation | Piezoelectric device, ink-jet printing head, and method for manufacturing same, and printer |
| JP2001246753A (ja) * | 2000-03-02 | 2001-09-11 | Casio Comput Co Ltd | インクジェットプリンタヘッドとその製造方法 |
| JP2004146614A (ja) * | 2002-10-24 | 2004-05-20 | Sony Corp | 磁気抵抗効果素子および磁気メモリ装置 |
| US6893978B1 (en) * | 2002-12-03 | 2005-05-17 | Silicon Magnetic Systems | Method for oxidizing a metal layer |
| US7195343B2 (en) * | 2004-08-27 | 2007-03-27 | Lexmark International, Inc. | Low ejection energy micro-fluid ejection heads |
| JP2007052311A (ja) * | 2005-08-19 | 2007-03-01 | Sanyo Epson Imaging Devices Corp | 電気光学装置および電子機器 |
| JP4926669B2 (ja) * | 2005-12-09 | 2012-05-09 | キヤノン株式会社 | インクジェットヘッドのクリーニング方法、インクジェットヘッドおよびインクジェット記録装置 |
| JP2007230127A (ja) * | 2006-03-02 | 2007-09-13 | Canon Inc | インクジェット記録ヘッド用基体の製造方法 |
| JP2008270380A (ja) * | 2007-04-18 | 2008-11-06 | Matsushita Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP5312202B2 (ja) * | 2008-06-20 | 2013-10-09 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
-
2010
- 2010-02-09 JP JP2010026488A patent/JP5590906B2/ja not_active Expired - Fee Related
-
2011
- 2011-02-08 US US13/022,975 patent/US8846162B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011161760A (ja) | 2011-08-25 |
| US20110192498A1 (en) | 2011-08-11 |
| US8846162B2 (en) | 2014-09-30 |
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