JP5549958B2 - アルミニウム部材と銅部材との接合構造 - Google Patents

アルミニウム部材と銅部材との接合構造 Download PDF

Info

Publication number
JP5549958B2
JP5549958B2 JP2013193431A JP2013193431A JP5549958B2 JP 5549958 B2 JP5549958 B2 JP 5549958B2 JP 2013193431 A JP2013193431 A JP 2013193431A JP 2013193431 A JP2013193431 A JP 2013193431A JP 5549958 B2 JP5549958 B2 JP 5549958B2
Authority
JP
Japan
Prior art keywords
copper
aluminum
plate
intermetallic compound
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013193431A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014076486A (ja
Inventor
伸幸 寺▲崎▼
義幸 長友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP2013193431A priority Critical patent/JP5549958B2/ja
Publication of JP2014076486A publication Critical patent/JP2014076486A/ja
Application granted granted Critical
Publication of JP5549958B2 publication Critical patent/JP5549958B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/12—Copper or alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/1266—O, S, or organic compound in metal component
    • Y10T428/12667—Oxide of transition metal or Al

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013193431A 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造 Active JP5549958B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013193431A JP5549958B2 (ja) 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012208578 2012-09-21
JP2012208578 2012-09-21
JP2013193431A JP5549958B2 (ja) 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造

Publications (2)

Publication Number Publication Date
JP2014076486A JP2014076486A (ja) 2014-05-01
JP5549958B2 true JP5549958B2 (ja) 2014-07-16

Family

ID=50341440

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013193431A Active JP5549958B2 (ja) 2012-09-21 2013-09-18 アルミニウム部材と銅部材との接合構造

Country Status (8)

Country Link
US (1) US10011093B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP2898979B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP5549958B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR102051697B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CN (1) CN104661785B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IN (1) IN2015DN02361A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TWI589382B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
WO (1) WO2014046130A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180074201A (ko) * 2016-12-23 2018-07-03 저지앙 캉성 컴퍼니 리미티드 구리 알루미늄 연결부재의 면-면 삼투용접 공정 및 제조방법

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104661785B (zh) * 2012-09-21 2017-05-03 三菱综合材料株式会社 铝部件与铜部件的接合结构
EP2911192B1 (en) 2012-10-16 2021-05-05 Mitsubishi Materials Corporation Substrate for power module with heat sink, power module with heat sink, and method for producing substrate for power module with heat sink
JP6428327B2 (ja) * 2015-02-04 2018-11-28 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、パワーモジュール、及び、ヒートシンク付パワーモジュール用基板の製造方法
JP6572810B2 (ja) * 2016-03-15 2019-09-11 三菱マテリアル株式会社 接合体の製造方法、及び、パワーモジュール用基板の製造方法
US10242932B2 (en) 2016-06-24 2019-03-26 Infineon Technologies Ag LDMOS transistor and method
US9960229B2 (en) 2016-06-24 2018-05-01 Infineon Technologies Ag Semiconductor device including a LDMOS transistor
US10622284B2 (en) * 2016-06-24 2020-04-14 Infineon Technologies Ag LDMOS transistor and method
US10050139B2 (en) 2016-06-24 2018-08-14 Infineon Technologies Ag Semiconductor device including a LDMOS transistor and method
CN106077937B (zh) * 2016-06-24 2018-08-03 西安理工大学 一种铝-铜双金属复合材料的制备方法
US9875933B2 (en) 2016-06-24 2018-01-23 Infineon Technologies Ag Substrate and method including forming a via comprising a conductive liner layer and conductive plug having different microstructures
CN106475679B (zh) * 2016-11-30 2018-07-27 山东大学 一种铜与铝合金的无中间层非连续加压真空扩散连接工艺
CN106583914B (zh) * 2016-12-23 2019-03-05 浙江康盛股份有限公司 一种铜铝连接件面-面渗溶接工艺
JP6819385B2 (ja) * 2017-03-17 2021-01-27 三菱マテリアル株式会社 半導体装置の製造方法
EP3605601B1 (en) * 2017-03-29 2023-09-13 Mitsubishi Materials Corporation Method for producing insulated circuit board with heat sink
JP6972627B2 (ja) * 2017-04-05 2021-11-24 株式会社アイシン カーボンナノチューブ複合体の製造方法及び積層体
US11322424B2 (en) * 2018-03-28 2022-05-03 Mitsubishi Materials Corporation Insulation circuit board with heat sink
JP7342371B2 (ja) * 2019-02-14 2023-09-12 三菱マテリアル株式会社 絶縁回路基板、及び、絶縁回路基板の製造方法
KR20210127009A (ko) 2020-04-13 2021-10-21 주식회사 엘지에너지솔루션 전지 모듈 및 그 제조 방법
JP7643163B2 (ja) 2021-04-27 2025-03-11 三菱マテリアル株式会社 ヒートシンク、および、ヒートシンク一体型絶縁回路基板
TWI800244B (zh) * 2022-01-28 2023-04-21 奇鋐科技股份有限公司 具有熱管之散熱器總成

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04315524A (ja) 1991-04-10 1992-11-06 Kobe Steel Ltd 銅材とアルミニウム材との接合用部材及びその製造方法
JP3240211B2 (ja) * 1993-04-12 2001-12-17 旭化成株式会社 銅−アルミニウム異種金属継手材
TW252061B (en) 1994-07-20 1995-07-21 Dong-Hann Chang Process of undergoing diffusion bonding under low pressure
JPH08255973A (ja) 1995-03-17 1996-10-01 Toshiba Corp セラミックス回路基板
US6033787A (en) 1996-08-22 2000-03-07 Mitsubishi Materials Corporation Ceramic circuit board with heat sink
US6124635A (en) 1997-03-21 2000-09-26 Honda Giken Kogyo Kabushiki Kaisha Functionally gradient integrated metal-ceramic member and semiconductor circuit substrate application thereof
JPH11156995A (ja) 1997-09-25 1999-06-15 Daido Steel Co Ltd クラッド板とこれを用いた電池用ケース並びにこれらの製造方法
JP3752830B2 (ja) 1998-03-31 2006-03-08 マツダ株式会社 接合金属部材及び該部材の接合方法
JP2001148451A (ja) 1999-03-24 2001-05-29 Mitsubishi Materials Corp パワーモジュール用基板
JP2001252772A (ja) 2000-03-10 2001-09-18 Showa Denko Kk アルミニウム−銅クラッド材およびその製造方法
JP2002064169A (ja) 2000-08-21 2002-02-28 Denki Kagaku Kogyo Kk 放熱構造体
JP2002203942A (ja) 2000-12-28 2002-07-19 Fuji Electric Co Ltd パワー半導体モジュール
JP2002231865A (ja) 2001-02-02 2002-08-16 Toyota Industries Corp ヒートシンク付絶縁基板、接合部材及び接合方法
JP2003078086A (ja) 2001-09-04 2003-03-14 Kubota Corp 半導体素子モジュール基板の積層構造
JP2003092383A (ja) 2001-09-19 2003-03-28 Hitachi Ltd パワー半導体装置およびそのヒートシンク
JP2003258170A (ja) 2002-02-26 2003-09-12 Akane:Kk ヒートシンク
JP3917503B2 (ja) 2002-04-05 2007-05-23 住友精密工業株式会社 アルミニウム部材と銅部材の接合方法及びその接合構造物
TW540298B (en) 2002-09-04 2003-07-01 Loyalty Founder Entpr Co Ltd Composite board forming method for heat sink
JP3938079B2 (ja) 2003-03-20 2007-06-27 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
AU2003257838A1 (en) * 2003-08-07 2005-02-25 Sumitomo Precision Products Co., Ltd. Al-Cu JUNCTION STRUCTURE AND METHOD FOR MANUFACTURING SAME
EP1737034A4 (en) 2004-04-05 2010-11-03 Mitsubishi Materials Corp AI / AIN CONNECTING MATERIAL, BASE PLATE FOR A POWER MODULE, POWER MODULE AND PROCESS FOR PRODUCING AN AI / AIN COMPOUND MATERIAL
JP2006100770A (ja) 2004-09-01 2006-04-13 Toyota Industries Corp 回路基板のベース板の製造方法及び回路基板のベース板並びにベース板を用いた回路基板
JP4759384B2 (ja) 2005-12-20 2011-08-31 昭和電工株式会社 半導体モジュール
US20100243458A1 (en) * 2007-10-25 2010-09-30 Katsuhiro Kojima Stamper, Method for Producing the Same, Method for Producing Molded Material, and Prototype Aluminum Mold for Stamper
JP5067187B2 (ja) 2007-11-06 2012-11-07 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板及びヒートシンク付パワーモジュール
JP4747315B2 (ja) 2007-11-19 2011-08-17 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール
JP5163199B2 (ja) 2008-03-17 2013-03-13 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板及びヒートシンク付パワーモジュール
JP2010034238A (ja) * 2008-07-28 2010-02-12 Shin Kobe Electric Mach Co Ltd 配線板
JP2010137251A (ja) 2008-12-11 2010-06-24 Mitsubishi Electric Corp 金属接合体およびその製造方法
US8159821B2 (en) 2009-07-28 2012-04-17 Dsem Holdings Sdn. Bhd. Diffusion bonding circuit submount directly to vapor chamber
CN102498564B (zh) * 2009-09-09 2015-08-26 三菱综合材料株式会社 带散热器的功率模块用基板的制造方法、带散热器的功率模块用基板及功率模块
EP2662179B1 (en) 2009-10-26 2014-07-30 Neomax Materials Co., Ltd. Aluminum bonding alloy made of an Nickel-Magnesium alloy
KR101419627B1 (ko) 2010-02-05 2014-07-15 미쓰비시 마테리알 가부시키가이샤 파워 모듈용 기판 및 파워 모듈
CN102947043B (zh) 2010-06-08 2014-04-23 株式会社新王材料 铝铜复合材料及其制造方法
CN101947689B (zh) 2010-09-21 2012-10-03 河南科技大学 铜铝复合板的连续复合成形方法及其复合成形装置
DE102010041714A1 (de) 2010-09-30 2011-08-25 Infineon Technologies AG, 85579 Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls
JP5736807B2 (ja) 2011-02-02 2015-06-17 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール用基板の製造方法及びパワーモジュール
JP5403129B2 (ja) 2012-03-30 2014-01-29 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、及びパワーモジュール用基板の製造方法
CN104661785B (zh) 2012-09-21 2017-05-03 三菱综合材料株式会社 铝部件与铜部件的接合结构

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180074201A (ko) * 2016-12-23 2018-07-03 저지앙 캉성 컴퍼니 리미티드 구리 알루미늄 연결부재의 면-면 삼투용접 공정 및 제조방법
KR101925119B1 (ko) * 2016-12-23 2019-02-27 저지앙 캉성 컴퍼니 리미티드 구리 알루미늄 연결부재의 면-면 삼투용접 공정 및 제조방법

Also Published As

Publication number Publication date
CN104661785B (zh) 2017-05-03
US20150251382A1 (en) 2015-09-10
CN104661785A (zh) 2015-05-27
WO2014046130A1 (ja) 2014-03-27
KR20150056534A (ko) 2015-05-26
EP2898979B1 (en) 2019-03-06
TWI589382B (zh) 2017-07-01
IN2015DN02361A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2015-09-04
KR102051697B1 (ko) 2019-12-03
EP2898979A1 (en) 2015-07-29
JP2014076486A (ja) 2014-05-01
EP2898979A4 (en) 2016-06-08
US10011093B2 (en) 2018-07-03
TW201433392A (zh) 2014-09-01

Similar Documents

Publication Publication Date Title
JP5549958B2 (ja) アルミニウム部材と銅部材との接合構造
JP5614485B2 (ja) ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール、及びヒートシンク付パワーモジュール用基板の製造方法
KR102422607B1 (ko) 접합체, 히트 싱크가 부착된 파워 모듈용 기판, 히트 싱크, 및 접합체의 제조 방법, 히트 싱크가 부착된 파워 모듈용 기판의 제조 방법, 히트 싱크의 제조 방법
JP5991102B2 (ja) ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール、及びヒートシンク付パワーモジュール用基板の製造方法
JP5918008B2 (ja) 冷却器の製造方法
JP5725060B2 (ja) 接合体、パワーモジュール用基板、及びヒートシンク付パワーモジュール用基板
JP5991103B2 (ja) ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール、及びヒートシンク付パワーモジュール用基板の製造方法
US20230022285A1 (en) Copper/ceramic joined body and insulated circuit board
WO2021033421A1 (ja) 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
JP6908173B2 (ja) 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
JP6939973B2 (ja) 銅／セラミックス接合体、及び、絶縁回路基板
JP6432208B2 (ja) パワーモジュール用基板の製造方法、及び、ヒートシンク付パワーモジュール用基板の製造方法
JP6327058B2 (ja) ヒートシンク付パワーモジュール用基板、接合体の製造方法、パワーモジュール用基板の製造方法、及び、ヒートシンク付パワーモジュール用基板の製造方法
WO2023008562A1 (ja) 銅／セラミックス接合体、および、絶縁回路基板
JP7739805B2 (ja) 銅／セラミックス接合体、および、絶縁回路基板
JP2019087608A (ja) 接合体、絶縁回路基板、ヒートシンク付絶縁回路基板、ヒートシンク、及び、接合体の製造方法、絶縁回路基板の製造方法、ヒートシンク付絶縁回路基板の製造方法、ヒートシンクの製造方法
JP2007044701A (ja) 鉛フリー化はんだ材
WO2023286860A1 (ja) 銅／セラミックス接合体、および、絶縁回路基板
WO2023008565A1 (ja) 銅／セラミックス接合体、および、絶縁回路基板
WO2020096040A1 (ja) 接合体、ヒートシンク付絶縁回路基板、及び、ヒートシンク
CN117222608A (zh) 铜-陶瓷接合体及绝缘电路基板
CN117500769A (zh) 铜-陶瓷接合体及绝缘电路基板
WO2016143631A1 (ja) 接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、及び、ヒートシンクの製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140131

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140203

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20140203

TRDD Decision of grant or rejection written
A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20140421

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140425

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140508

R150 Certificate of patent or registration of utility model

Ref document number: 5549958

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250