JP5548106B2 - 半導体プロセスツール用の圧力下流体を混合する方法及び装置 - Google Patents
半導体プロセスツール用の圧力下流体を混合する方法及び装置 Download PDFInfo
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- G—PHYSICS
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
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Description
本願は、米国特許出願番号10/133,237(2002年4月26日出願)に対して優先権を主張する。
本発明は、一般に、半導体デバイスの製造に関し、そしてより具体的には、半導体加工ツールに供給されるオゾン化脱イオン水の制御に関する。
半導体製造におけるオゾン化脱イオン水の使用は、比較的単純な、安全な加工工程(例えば、ウエハ表面クリーニング、パシベーション、ネイティブ酸素除去、およびフォトレジストの除去)を提供し得る。
本発明は、改善されたオゾン化水供給システムにおいて使用するための、オゾン化水制御ユニットに関する。この制御ユニットは、プロセスツールへの引き続く送達のために、オゾン化水発生器から受容されたオゾン化水の流量および/または濃度を改変し得る。1つ以上の制御ユニットが、単一の発生器と共に使用されて、別々のオゾン化水の必要性に合わせて、1つより多いツールに供給し得る。
t=r(P/σmax);
σmax=(1/s)σy;
ここで、tは、必要とされる壁厚であり、rは、容器の内部半径であり、Pは内圧であり、σmaxは、最大の許容され得る張力壁応力であり、σyは、容器部品を形成するために用いられた特定の材料についての降伏強度であり、そしてsは、安全係数である。特定の容器材料について、より大きな安全係数(すなわち、特定の最大許容可能張力壁応力)を用いることにより、所定の作動圧力Pについて、より大きな厚さtがもたらされる。
例示的な実施形態では、制御ユニット1400は、約0〜35リットル/分の範囲の流量を有するオゾン化水および約0〜42リットル/分の範囲の流量を有するDI水を受容する。好ましい廃液流れは、約0〜2リットル/分の範囲である。排出オゾン化水中のオゾン濃度は、投入オゾン化水濃度の0%〜100%の範囲であり得る。排出オゾン化水中の0%オゾン濃度が、DI水のみを制御ユニットの排出へ送達することによって入手され得ることが本明細書中で理解される。
Claims (16)
- 半導体プロセスツール(40A-40C)用の圧力下流体を混合する方法であって、流体中に溶解したガスの脱気を回避する前記方法であって、
第1の流量及び第1の濃度を有する溶解したガスを含む第1の流体を受け取って、該第1の流体を第1の半導体プロセスツール(40A)へ供給する前記第1の流体を受容する工程と、
前記第1の流体と、第2の流量及び第2の濃度を有する第2の流体とを受容して、該第1及び第2の流体を圧力下で混合することにより、第3の流量及び第3の濃度を有する溶解したガスを含む第3の流体を製造する工程であって、該第3の流体を第2の半導体プロセスツール(40B又は40C)へ供給し、前記圧力下での混合により第3の流体内に溶解したガスの脱気を回避する、前記混合する工程と、
を具備する方法。 - 請求項1に記載の方法であって、前記第1の流体がオゾン化水であり、前記第2の流体は水である、方法。
- 請求項1に記載の方法であって、前記混合する工程において、前記受け取られた第1の流体又は前記受け取られた第2の流体の流量又は容積の少なくとも一つを調節する、方法。
- 請求項1に記載の方法であって、前記受け取られた第1の流体又は前記受け取られた第2の流体の流量又は容積の少なくとも一つを調節する工程を更に備え、これにより前記第1及び第2のプロセスツールへ供給される流体と関連したパラメータを独立に制御する、方法。
- 請求項1に記載の方法であって、前記第3の流体の流量又は容積の少なくとも一つを調節する工程を更に備える、方法。
- 請求項1に記載の方法であって、前記第1及び第2の流体を混合して、第4の流量及び第4の濃度を有する第4の流体を製造し、該第4の流体は第3のプロセスツールへ供給される、方法。
- 請求項1に記載の方法であって、前記第1又は第3の流体の流量又は濃度を設定する工程を更に含む、方法。
- 請求項7に記載の方法であって、前記流量又は濃度は、制御ユニットの制御パネルを介して設定されるか、またはコンピュータ制御を介して遠隔設定される、方法。
- 請求項8に記載の方法であって、前記第1の流体を発生する発生器から、第1の濃度の値を有する該第1の流体を受容する、方法。
- 請求項1に記載の方法であって、閉ループプロセスを介して少なくとも一つの弁を調節することにより、第3の流体の第3の濃度又は第3の流量を制御する、方法。
- 請求項1に記載の方法であって、圧力センサを監視して、もし安全な圧力レベルを超過した場合の緊急停止を許容し得る前記監視工程を更に有する、方法
- 請求項1に記載の方法であって、前記第1又は第2のプロセスツールに対して前記第2の流体のみを送達する、方法。
- 半導体プロセスツール用の圧力下流体を混合する装置であって、流体中に溶解したガスの脱気を回避する前記装置であって、該装置は、
第1の濃度及び第1の流量を有する溶解したガスを含む第1の流体を受容する第1の流体入力ポートであって、該第1の流体は第1の半導体プロセスツール(40A)へ供給される第1の流体投入ポートと、
前記第1の流体と、第2の流量及び第2の濃度を有する第2の流体とを受容して、該第1及び第2の流体を圧力下で混合することにより、第3の流量及び第3の濃度を有する溶解したガスを含む第3の流体を製造する少なくとも一つの制御ユニット(1400)であって、該第3の流体を第2の半導体プロセスツール(40B又は40C)へ供給する前記少なくとも一つの制御ユニット(1400)とを具備し、
該制御ユニット(1400)において、第1及び第2の流体を前記圧力下で混合させることにより、第3の流体内に溶解したガスの脱気を回避させる、装置。 - 請求項13に記載の装置であって、前記制御ユニット(1400)は、前記第1の流体又は第2の流体の流量又は濃度の少なくとも一つを制御し、第3のプロセスツールへ供給される第4の流量及び第4の濃度を有する第4の流体を製造する、装置。
- 請求項13に記載の装置であって、前記複数の流体の少なくとも一つの流量又は濃度を設定するための前記制御ユニットの制御パネル部分を備える、装置。
- 請求項13に記載の装置であって、前記制御ユニット(1400)は、前記第1又は第3の流体の濃度又は流量を制御する、装置。
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US10/133,237 US6805791B2 (en) | 2000-09-01 | 2002-04-26 | Ozonated water flow and concentration control apparatus |
US10/133,237 | 2002-04-26 |
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JP2004500127A Division JP2005523809A (ja) | 2002-04-26 | 2003-04-25 | オゾン化水の流れおよび濃度を制御する装置および方法 |
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JP2004500127A Pending JP2005523809A (ja) | 2002-04-26 | 2003-04-25 | オゾン化水の流れおよび濃度を制御する装置および方法 |
JP2010253473A Expired - Lifetime JP5548106B2 (ja) | 2002-04-26 | 2010-11-12 | 半導体プロセスツール用の圧力下流体を混合する方法及び装置 |
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JP (2) | JP2005523809A (ja) |
KR (1) | KR100985087B1 (ja) |
CN (2) | CN101676220B (ja) |
AU (1) | AU2003239180A1 (ja) |
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JP2021171696A (ja) * | 2020-04-24 | 2021-11-01 | 三菱電機株式会社 | 浄化装置および浄化方法 |
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- 2003-04-25 AU AU2003239180A patent/AU2003239180A1/en not_active Abandoned
- 2003-04-25 CN CNB038114046A patent/CN100549894C/zh not_active Expired - Lifetime
- 2003-04-25 DE DE60321157T patent/DE60321157D1/de not_active Expired - Lifetime
- 2003-04-25 JP JP2004500127A patent/JP2005523809A/ja active Pending
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CN100549894C (zh) | 2009-10-14 |
AU2003239180A1 (en) | 2003-11-10 |
CN1653400A (zh) | 2005-08-10 |
US7264006B2 (en) | 2007-09-04 |
CN101676220B (zh) | 2013-04-24 |
KR100985087B1 (ko) | 2010-10-04 |
US20030164338A1 (en) | 2003-09-04 |
US20060107969A1 (en) | 2006-05-25 |
EP1962165A1 (en) | 2008-08-27 |
US20050029202A1 (en) | 2005-02-10 |
JP2011062694A (ja) | 2011-03-31 |
WO2003091815A1 (en) | 2003-11-06 |
US20080002518A1 (en) | 2008-01-03 |
EP1962165B1 (en) | 2016-11-30 |
DE60321157D1 (de) | 2008-07-03 |
US7622037B2 (en) | 2009-11-24 |
EP1499934A1 (en) | 2005-01-26 |
KR20050005459A (ko) | 2005-01-13 |
JP2005523809A (ja) | 2005-08-11 |
EP1499934B1 (en) | 2008-05-21 |
US6805791B2 (en) | 2004-10-19 |
US6948504B2 (en) | 2005-09-27 |
CN101676220A (zh) | 2010-03-24 |
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