JP5545488B2 - プラズマ処理装置 - Google Patents
プラズマ処理装置 Download PDFInfo
- Publication number
- JP5545488B2 JP5545488B2 JP2010227239A JP2010227239A JP5545488B2 JP 5545488 B2 JP5545488 B2 JP 5545488B2 JP 2010227239 A JP2010227239 A JP 2010227239A JP 2010227239 A JP2010227239 A JP 2010227239A JP 5545488 B2 JP5545488 B2 JP 5545488B2
- Authority
- JP
- Japan
- Prior art keywords
- tray
- temperature
- plasma processing
- wafer
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000006243 chemical reaction Methods 0.000 claims description 46
- 239000000758 substrate Substances 0.000 claims description 42
- 238000001514 detection method Methods 0.000 claims description 21
- 230000007246 mechanism Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 81
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000009832 plasma treatment Methods 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000005530 etching Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010227239A JP5545488B2 (ja) | 2010-10-07 | 2010-10-07 | プラズマ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010227239A JP5545488B2 (ja) | 2010-10-07 | 2010-10-07 | プラズマ処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012084574A JP2012084574A (ja) | 2012-04-26 |
| JP2012084574A5 JP2012084574A5 (fr) | 2013-08-15 |
| JP5545488B2 true JP5545488B2 (ja) | 2014-07-09 |
Family
ID=46243179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010227239A Active JP5545488B2 (ja) | 2010-10-07 | 2010-10-07 | プラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5545488B2 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014139980A (ja) * | 2013-01-21 | 2014-07-31 | Hitachi High-Technologies Corp | 試料処理装置およびその方法並びに荷電粒子線装置 |
| JP6363927B2 (ja) * | 2014-10-07 | 2018-07-25 | 大陽日酸株式会社 | 気相成長装置における基板搬送方法及び装置 |
| CN106505017B (zh) * | 2016-10-25 | 2019-06-25 | 通富微电子股份有限公司 | 用于面板级扇出表面处理的工艺系统及方法 |
| WO2018185835A1 (fr) * | 2017-04-04 | 2018-10-11 | 株式会社Ｆｕｊｉ | Système de génération de plasma |
| CN111489994A (zh) * | 2019-01-25 | 2020-08-04 | 上海和辉光电有限公司 | 一种上料机构、邦定机和上料方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2988167B2 (ja) * | 1992-11-27 | 1999-12-06 | 安藤電気株式会社 | 高温槽に加熱キャリアが循環するｉｃ搬送機構 |
| JP3404608B2 (ja) * | 1994-09-28 | 2003-05-12 | 東芝機械株式会社 | 荷電ビーム描画装置等の試料温度調整装置及びこの装置に用いられる試料ホルダ |
| JP4083306B2 (ja) * | 1998-08-28 | 2008-04-30 | 松下電器産業株式会社 | プラズマ処理後におけるリンス方法 |
| JP2001345313A (ja) * | 2000-05-31 | 2001-12-14 | Ebara Corp | 基板処理装置 |
| JP2007109771A (ja) * | 2005-10-12 | 2007-04-26 | Matsushita Electric Ind Co Ltd | プラズマ処理装置用のトレイ |
| JP5145126B2 (ja) * | 2008-06-11 | 2013-02-13 | 株式会社アルバック | 接着装置及び接着方法 |
| JP5417751B2 (ja) * | 2008-06-30 | 2014-02-19 | 株式会社ニコン | 接合装置および接合方法 |
-
2010
- 2010-10-07 JP JP2010227239A patent/JP5545488B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2012084574A (ja) | 2012-04-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5545488B2 (ja) | プラズマ処理装置 | |
| KR101849450B1 (ko) | 기판 처리 장치, 반도체 장치의 제조 방법, 기록 매체 | |
| JP5860431B2 (ja) | 接合装置、接合システムおよび接合方法 | |
| JP5106331B2 (ja) | 基板載置台の降温方法、コンピュータ読み取り可能な記憶媒体および基板処理システム | |
| JP5208800B2 (ja) | 基板処理システム及び基板搬送方法 | |
| JP7106681B2 (ja) | デュアルロードロックチャンバ | |
| JP6213487B2 (ja) | 縦型熱処理装置の運転方法、記憶媒体及び縦型熱処理装置 | |
| JP6104700B2 (ja) | 接合方法、接合装置および接合システム | |
| JP6045972B2 (ja) | 接合装置、接合システムおよび接合方法 | |
| KR102325772B1 (ko) | 기판처리장치 | |
| JP2012195427A (ja) | 基板処理装置及び基板処理方法 | |
| US20170221738A1 (en) | Substrate processing apparatus | |
| JP5882939B2 (ja) | 接合方法、接合装置および接合システム | |
| JP2005259858A (ja) | 基板処理装置 | |
| US20230143372A1 (en) | Substrate transfer apparatus and substrate transfer method | |
| JP6554387B2 (ja) | ロードロック装置における基板冷却方法、基板搬送方法、およびロードロック装置 | |
| JP2022017840A (ja) | 真空搬送装置および基板処理システム | |
| US9848461B2 (en) | Methods and apparatus for thermally treating a substrate | |
| JP5825948B2 (ja) | 基板処理装置及び半導体装置の製造方法 | |
| JP6105035B2 (ja) | 接合装置、接合システムおよび接合方法 | |
| KR102641232B1 (ko) | 기판 처리 시스템 및 기판 처리 시스템의 제어 방법 | |
| JP6496919B2 (ja) | ベルヌーイハンド及び半導体製造装置 | |
| JP7176361B2 (ja) | 基板処理方法及び基板処理装置 | |
| TWI633570B (zh) | 離子植入系統以及將離子植入工件的方法 | |
| JP6140624B2 (ja) | 基板保持方法、基板保持装置および接合装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130628 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130628 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140212 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140401 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140430 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 5545488 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |