JP5539759B2 - 印刷回路基板製造方法 - Google Patents
印刷回路基板製造方法 Download PDFInfo
- Publication number
- JP5539759B2 JP5539759B2 JP2010063215A JP2010063215A JP5539759B2 JP 5539759 B2 JP5539759 B2 JP 5539759B2 JP 2010063215 A JP2010063215 A JP 2010063215A JP 2010063215 A JP2010063215 A JP 2010063215A JP 5539759 B2 JP5539759 B2 JP 5539759B2
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- Prior art keywords
- carrier
- circuit board
- printed circuit
- insulating layer
- circuit pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09545—Plated through-holes or blind vias without lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0733—Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Description
102 金属層
104 第1キャリア
106 層間連結体
108 絶縁層
112 第2キャリア
114 回路パターン
116 ソルダレジスト
118 ソルダボールパッド
120 ワイヤボンディングパッド
130 コア基板
132 第1回路パターン
134 第2回路パターン
Claims (3)
- 第1回路パターンが形成されるコア基板を提供する段階と、
前記第1回路パターンに層間連結体を形成する段階と、
前記コア基板に、前記層間連結体が露出されるように絶縁層を積層する段階と、
前記層間連結体と電気的に接続するように、前記絶縁層に第2回路パターンを形成する段階と、を有し、
前記絶縁層を積層する段階が、
金属層および銅箔を含み且つ前記金属層が前記コア基板側に配置されるキャリアと、前記コア基板と、の間に前記絶縁層を介在する段階と、
前記コア基板と前記キャリアとを圧着する段階と、
前記銅箔をエッチングすることにより除去して、前記金属層を露出させる段階と、
前記金属層をエッチングすることにより除去する段階と、を含み、
前記金属層が、前記銅箔および前記層間連結体をエッチングできるエッチング液とは異なるエッチング液と反応する金属からなることにより、前記銅箔をエッチングする場合に、前記層間連結体が前記金属層により保護されることを特徴とする、
印刷回路基板製造方法。 - 前記層間連結体を形成する段階が、
前記コア基板に、前記層間連結体に対応して、メッキレジストを形成する段階と、
前記コア基板をメッキして前記層間連結体を形成する段階と、
前記メッキレジストを除去する段階と
を含むことを特徴とする請求項1に記載の印刷回路基板製造方法。 - 前記第2回路パターンを形成する段階以後に、
前記第2回路パターンの一部を露出させるソルダレジストを形成する段階と、
前記回路パターンの一部をメッキしてパッドを形成する段階と、
をさらに含む請求項1または2に記載の印刷回路基板製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070098396A KR100894178B1 (ko) | 2007-09-28 | 2007-09-28 | 인쇄회로기판 제조방법 |
KR10-2007-0098396 | 2007-09-28 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007322642A Division JP4614367B2 (ja) | 2007-09-28 | 2007-12-13 | 印刷回路基板製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010135860A JP2010135860A (ja) | 2010-06-17 |
JP5539759B2 true JP5539759B2 (ja) | 2014-07-02 |
Family
ID=40506583
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007322642A Expired - Fee Related JP4614367B2 (ja) | 2007-09-28 | 2007-12-13 | 印刷回路基板製造方法 |
JP2010063215A Expired - Fee Related JP5539759B2 (ja) | 2007-09-28 | 2010-03-18 | 印刷回路基板製造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007322642A Expired - Fee Related JP4614367B2 (ja) | 2007-09-28 | 2007-12-13 | 印刷回路基板製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8024856B2 (ja) |
JP (2) | JP4614367B2 (ja) |
KR (1) | KR100894178B1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101013992B1 (ko) * | 2008-12-02 | 2011-02-14 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
JP5589503B2 (ja) | 2009-03-31 | 2014-09-17 | 日油株式会社 | 多分岐鎖ポリオキシアルキレン化合物、その製造方法および中間体 |
TWI419278B (zh) * | 2010-10-26 | 2013-12-11 | Unimicron Technology Corp | 封裝基板及其製法 |
KR101420499B1 (ko) * | 2012-07-26 | 2014-07-16 | 삼성전기주식회사 | 적층형 코어리스 인쇄회로기판 및 그 제조 방법 |
CN113286413A (zh) * | 2021-04-01 | 2021-08-20 | 珠海精路电子有限公司 | 散热电路板及其制造工艺 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5600103A (en) | 1993-04-16 | 1997-02-04 | Kabushiki Kaisha Toshiba | Circuit devices and fabrication method of the same |
JPH1070363A (ja) * | 1996-08-27 | 1998-03-10 | Toshiba Corp | 印刷配線板の製造方法 |
JP3633136B2 (ja) * | 1996-09-18 | 2005-03-30 | 株式会社東芝 | 印刷配線基板 |
JPH10303561A (ja) * | 1997-04-30 | 1998-11-13 | Hitachi Chem Co Ltd | 多層配線基板及びその製造方法 |
JP3889856B2 (ja) * | 1997-06-30 | 2007-03-07 | 松下電器産業株式会社 | 突起電極付きプリント配線基板の製造方法 |
US6455784B1 (en) * | 1999-10-27 | 2002-09-24 | Asahi Kasei Kabushiki Kaisha | Curable sheet for circuit transfer |
JP2002094200A (ja) * | 2000-09-18 | 2002-03-29 | Matsushita Electric Ind Co Ltd | 回路基板用電気絶縁材と回路基板およびその製造方法 |
JP3890901B2 (ja) * | 2001-02-21 | 2007-03-07 | ソニー株式会社 | 電子部品実装基板及びその製造方法 |
JP2003209366A (ja) * | 2002-01-15 | 2003-07-25 | Sony Corp | フレキシブル多層配線基板およびその製造方法 |
JP4443543B2 (ja) * | 2002-02-18 | 2010-03-31 | テセラ・インターコネクト・マテリアルズ,インコーポレイテッド | 多層配線基板の製造方法と、それに用いる配線膜間接続用部材及びその製造方法 |
JP4045143B2 (ja) * | 2002-02-18 | 2008-02-13 | テセラ・インターコネクト・マテリアルズ,インコーポレイテッド | 配線膜間接続用部材の製造方法及び多層配線基板の製造方法 |
JP2004063701A (ja) * | 2002-07-26 | 2004-02-26 | Yamaichi Electronics Co Ltd | フレキシブルプリント配線基板の製造方法 |
JP2006108211A (ja) * | 2004-10-01 | 2006-04-20 | North:Kk | 配線板と、その配線板を用いた多層配線基板と、その多層配線基板の製造方法 |
JP3973654B2 (ja) * | 2004-11-15 | 2007-09-12 | 株式会社ちの技研 | プリント配線基板の製造方法 |
JP4735017B2 (ja) * | 2005-04-19 | 2011-07-27 | 株式会社村田製作所 | 多層セラミック基板の製造方法 |
JP4772424B2 (ja) * | 2005-08-23 | 2011-09-14 | 日本メクトロン株式会社 | 回路基板の製造方法 |
US7772116B2 (en) * | 2005-09-01 | 2010-08-10 | Micron Technology, Inc. | Methods of forming blind wafer interconnects |
KR100761706B1 (ko) * | 2006-09-06 | 2007-09-28 | 삼성전기주식회사 | 인쇄회로기판 제조방법 |
JP2009060076A (ja) * | 2007-08-31 | 2009-03-19 | Samsung Electro Mech Co Ltd | 多層プリント基板の製造方法 |
-
2007
- 2007-09-28 KR KR1020070098396A patent/KR100894178B1/ko not_active IP Right Cessation
- 2007-12-13 JP JP2007322642A patent/JP4614367B2/ja not_active Expired - Fee Related
-
2008
- 2008-01-22 US US12/010,197 patent/US8024856B2/en not_active Expired - Fee Related
-
2010
- 2010-03-18 JP JP2010063215A patent/JP5539759B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR100894178B1 (ko) | 2009-04-22 |
US8024856B2 (en) | 2011-09-27 |
JP2010135860A (ja) | 2010-06-17 |
JP2009088461A (ja) | 2009-04-23 |
US20090083976A1 (en) | 2009-04-02 |
JP4614367B2 (ja) | 2011-01-19 |
KR20090032840A (ko) | 2009-04-01 |
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