JP5539134B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- JP5539134B2 JP5539134B2 JP2010207572A JP2010207572A JP5539134B2 JP 5539134 B2 JP5539134 B2 JP 5539134B2 JP 2010207572 A JP2010207572 A JP 2010207572A JP 2010207572 A JP2010207572 A JP 2010207572A JP 5539134 B2 JP5539134 B2 JP 5539134B2
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- 239000004065 semiconductor Substances 0.000 title claims description 38
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
- H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
- H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
- H01L27/0664—Vertical bipolar transistor in combination with diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
- H02M3/156—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators
- H02M3/158—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Dc-Dc Converters (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
Claims (4)
- ケースと、
前記ケース内に個別に配設されるダイオード素子と、
前記ケース内に個別に配設されるスイッチング素子と、
前記ケース外に配設され、前記ダイオード素子のアノード電極に電気的に接続されたアノード端子と、
前記ケース外に配設され、スイッチング素子の一方の主電極と電気的に接続された一方の主電極端子と、
前記ケース外に配設され、前記ダイオード素子のカソード電極に電気的に接続されたカソード端子と、
前記ケース外に配設され、前記スイッチング素子の他方の主電極と電気的に接続された他方の主電極端子とを、備えており、
前記アノード端子と前記一方の主電極端子とは、
所定の距離だけ隔てて隣接して配設されており、
前記カソード端子と、前記他方の主電極端子とは、
所定の距離だけ隔てて隣接して配設されており、
前記アノード端子と前記カソード端子との間に流れる電流の方向と、前記一方の主電極端子と前記他方の主電極端子との間に流れる電流の方向とが、平行となるように、前記アノード端子、前記カソード端子、前記一方の主電極端子および前記他方の主電極端子を配設する、
ことを特徴とする半導体装置。 - 前記ケースの一の端縁部には、
前記アノード端子と前記一方の主電極端子とが、配設されており
前記一の端縁部に対向する、前記ケースの他の端縁部には、
前記カソード端子と前記他方の主電極端子とが、配設されている、
ことを特徴とする請求項1に記載の半導体装置。 - 前記スイッチング素子は、
バイポーラトランジスタまたはIGBT(Insulated Gate Bipolar Transistor)であり、
前記一方の主電極端子は、
コレクタ端子であり、
前記他方の主電極端子は、
エミッタ端子である、
ことを特徴とする請求項1に記載の半導体装置。 - 前記スイッチング素子は、
MOSFET(Metal Oxide Semiconductor−Field Effect Transister)であり、
前記一方の主電極端子は、
ドレイン端子であり、
前記他方の主電極端子は、
ソース端子である、
ことを特徴とする請求項1に記載の半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010207572A JP5539134B2 (ja) | 2010-09-16 | 2010-09-16 | 半導体装置 |
US13/103,353 US9087712B2 (en) | 2010-09-16 | 2011-05-09 | Semiconductor device |
DE102011081426A DE102011081426A1 (de) | 2010-09-16 | 2011-08-23 | Halbleitervorrichtung |
KR1020110088294A KR101203089B1 (ko) | 2010-09-16 | 2011-09-01 | 반도체장치 |
CN201110283517.2A CN102420524B (zh) | 2010-09-16 | 2011-09-16 | 半导体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010207572A JP5539134B2 (ja) | 2010-09-16 | 2010-09-16 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012064739A JP2012064739A (ja) | 2012-03-29 |
JP5539134B2 true JP5539134B2 (ja) | 2014-07-02 |
Family
ID=45769089
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010207572A Active JP5539134B2 (ja) | 2010-09-16 | 2010-09-16 | 半導体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9087712B2 (ja) |
JP (1) | JP5539134B2 (ja) |
KR (1) | KR101203089B1 (ja) |
CN (1) | CN102420524B (ja) |
DE (1) | DE102011081426A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012105162B4 (de) * | 2012-06-14 | 2017-02-02 | Infineon Technologies Austria Ag | Integriertes Leistungshalbleiterbauelement, Herstellungsverfahren dafür und Chopperschaltung mit integriertem Halbleiterbauelement |
JP6490017B2 (ja) * | 2016-01-19 | 2019-03-27 | 三菱電機株式会社 | パワーモジュール、3相インバータシステム、およびパワーモジュールの検査方法 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1264513C2 (de) * | 1963-11-29 | 1973-01-25 | Texas Instruments Inc | Bezugspotentialfreier gleichstromdifferenzverstaerker |
US4354223A (en) * | 1981-09-02 | 1982-10-12 | General Electric Company | Step-up/step down chopper |
US6204717B1 (en) * | 1995-05-22 | 2001-03-20 | Hitachi, Ltd. | Semiconductor circuit and semiconductor device for use in equipment such as a power converting apparatus |
JPH09322531A (ja) | 1996-05-27 | 1997-12-12 | Oki Electric Ind Co Ltd | 降圧チョッパ回路 |
US5814884C1 (en) * | 1996-10-24 | 2002-01-29 | Int Rectifier Corp | Commonly housed diverse semiconductor die |
JPH11113253A (ja) | 1997-10-06 | 1999-04-23 | Hitachi Ltd | 昇圧チョッパー回路 |
JP3375560B2 (ja) * | 1999-02-15 | 2003-02-10 | 松下電器産業株式会社 | 半導体装置 |
US6421262B1 (en) * | 2000-02-08 | 2002-07-16 | Vlt Corporation | Active rectifier |
JP4646480B2 (ja) * | 2002-02-27 | 2011-03-09 | 三洋電機株式会社 | 半導体回路収納装置 |
JP2006006061A (ja) | 2004-06-18 | 2006-01-05 | Toshiba Corp | 双方向チョッパ回路 |
JP4459883B2 (ja) | 2005-04-28 | 2010-04-28 | 三菱電機株式会社 | 半導体装置 |
JP5033335B2 (ja) * | 2006-02-21 | 2012-09-26 | ルネサスエレクトロニクス株式会社 | 半導体装置およびそれを用いたインバータ装置 |
JP2007294669A (ja) * | 2006-04-25 | 2007-11-08 | Matsushita Electric Ind Co Ltd | 半導体装置 |
US7750447B2 (en) * | 2007-06-11 | 2010-07-06 | Alpha & Omega Semiconductor, Ltd | High voltage and high power boost converter with co-packaged Schottky diode |
JP5196794B2 (ja) * | 2007-01-29 | 2013-05-15 | 三菱電機株式会社 | 半導体装置 |
JP5070937B2 (ja) | 2007-05-25 | 2012-11-14 | 東芝三菱電機産業システム株式会社 | 昇圧チョッパ回路、降圧チョッパ回路及びそれを用いたdc−dcコンバータ回路 |
JP5176507B2 (ja) | 2007-12-04 | 2013-04-03 | 富士電機株式会社 | 半導体装置 |
JP5321124B2 (ja) | 2009-02-23 | 2013-10-23 | 三菱電機株式会社 | 半導体スイッチング装置 |
WO2011083737A1 (ja) * | 2010-01-05 | 2011-07-14 | 富士電機システムズ株式会社 | 半導体装置用ユニットおよび半導体装置 |
US9071130B2 (en) * | 2010-06-28 | 2015-06-30 | Toshiba Lighting & Technology Corporation | Switching power supply device, switching power supply circuit, and electrical equipment |
US9362905B2 (en) * | 2011-03-21 | 2016-06-07 | Infineon Technologies Americas Corp. | Composite semiconductor device with turn-on prevention control |
-
2010
- 2010-09-16 JP JP2010207572A patent/JP5539134B2/ja active Active
-
2011
- 2011-05-09 US US13/103,353 patent/US9087712B2/en active Active
- 2011-08-23 DE DE102011081426A patent/DE102011081426A1/de not_active Ceased
- 2011-09-01 KR KR1020110088294A patent/KR101203089B1/ko not_active IP Right Cessation
- 2011-09-16 CN CN201110283517.2A patent/CN102420524B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20120068329A1 (en) | 2012-03-22 |
CN102420524B (zh) | 2015-03-04 |
CN102420524A (zh) | 2012-04-18 |
US9087712B2 (en) | 2015-07-21 |
KR101203089B1 (ko) | 2012-11-21 |
JP2012064739A (ja) | 2012-03-29 |
DE102011081426A1 (de) | 2012-03-22 |
KR20120029998A (ko) | 2012-03-27 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |