JP5517157B2 - マイクロホン - Google Patents
マイクロホン Download PDFInfo
- Publication number
- JP5517157B2 JP5517157B2 JP2010069430A JP2010069430A JP5517157B2 JP 5517157 B2 JP5517157 B2 JP 5517157B2 JP 2010069430 A JP2010069430 A JP 2010069430A JP 2010069430 A JP2010069430 A JP 2010069430A JP 5517157 B2 JP5517157 B2 JP 5517157B2
- Authority
- JP
- Japan
- Prior art keywords
- particles
- grip housing
- microphone
- connector
- grip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002245 particle Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 11
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 239000002904 solvent Substances 0.000 claims description 8
- 238000013016 damping Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000012212 insulator Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000002955 isolation Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 241000023320 Luma <angiosperm> Species 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005520 electrodynamics Effects 0.000 description 1
- OSWPMRLSEDHDFF-UHFFFAOYSA-N methyl salicylate Chemical compound COC(=O)C1=CC=CC=C1O OSWPMRLSEDHDFF-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000004590 silicone sealant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001755 vocal effect Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/08—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
- H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
- H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
- H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
- H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4957—Sound device making
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Otolaryngology (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Description
2 グリップ筐体
3 マイクロホンユニット
4 コネクタ
10 空気室
13 複数の粒子
Claims (4)
- グリップ筐体と、
上記グリップ筐体の一端側で支持されているマイクロホンユニットと、
を備え、
上記グリップ筐体における上記マイクロホンユニットの背面側は空気室となっており、
上記空気室は、弾力性を有する複数の粒子で埋められ、
上記複数の粒子の表面同士が融着されていて、
上記複数の粒子の表面と上記グリップ筐体の内周面とが融着されていて、
上記複数の粒子同士と上記グリップ筐体とが隙間を設けながら機械的に結合されていて、
上記グリップ筐体の対向する内周面間が上記複数の粒子によって固定されている、
ことを特徴とするマイクロホン。 - 複数の粒子は、高分子制振材料からなる請求項1に記載のマイクロホン。
- 複数の粒子は、絶縁体からなる請求項1または2に記載のマイクロホン。
- 弾力性を有する複数の粒子が、グリップ筐体に埋められる工程と、
溶剤を上記グリップ筐体に供給して、上記複数の粒子の表面同士および、上記粒子と上
記グリップ筐体とを機械的に結合して、上記グリップ筐体の対向する内周面間を上記複数の粒子によって固定する工程と、
上記溶剤を乾燥させる工程を含むことを特徴とするマイクロホンの製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010069430A JP5517157B2 (ja) | 2010-03-25 | 2010-03-25 | マイクロホン |
US13/045,940 US8406446B2 (en) | 2010-03-25 | 2011-03-11 | Microphone with vibration isolation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010069430A JP5517157B2 (ja) | 2010-03-25 | 2010-03-25 | マイクロホン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011205299A JP2011205299A (ja) | 2011-10-13 |
JP5517157B2 true JP5517157B2 (ja) | 2014-06-11 |
Family
ID=44656522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010069430A Expired - Fee Related JP5517157B2 (ja) | 2010-03-25 | 2010-03-25 | マイクロホン |
Country Status (2)
Country | Link |
---|---|
US (1) | US8406446B2 (ja) |
JP (1) | JP5517157B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120014552A1 (en) * | 2010-07-15 | 2012-01-19 | Yang Zore | Microphone housing with disassembly protection for a cap thereof |
US8948434B2 (en) * | 2013-06-24 | 2015-02-03 | Michael James Godfrey | Microphone |
JP6284446B2 (ja) * | 2014-06-27 | 2018-02-28 | 株式会社オーディオテクニカ | ダイナミックマイクロホンおよび背部空気室の成形方法 |
CN107659876B (zh) * | 2017-09-30 | 2021-07-09 | 歌尔股份有限公司 | 半模组式发声装置和电子产品 |
USD880459S1 (en) * | 2018-12-20 | 2020-04-07 | Shenzhen Hua Sirui Technology Co. Ltd. | Microphone |
USD883961S1 (en) * | 2018-12-30 | 2020-05-12 | Shenzhen Hua Sirui Technology Co. Ltd. | Microphone |
USD978119S1 (en) * | 2020-10-16 | 2023-02-14 | Beijing Kuzhi Technology Co., Ltd. | Microphone |
USD933638S1 (en) * | 2021-01-19 | 2021-10-19 | Shenzhen Ownfortune Electronic Technology Co., Ltd | Microphone |
USD980828S1 (en) * | 2021-03-25 | 2023-03-14 | Kuo Su | Microphone speaker |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3585317A (en) * | 1968-01-04 | 1971-06-15 | Astatic Corp | Cardioid microphone |
JPS6059379B2 (ja) * | 1981-03-31 | 1985-12-25 | 住友ゴム工業株式会社 | 床舗装構造体 |
JPS5995793A (ja) * | 1982-11-25 | 1984-06-01 | Audio Technica Corp | マイクロホン |
JPH084364A (ja) * | 1994-06-24 | 1996-01-09 | Nippon Kenchiku Sogo Shikenjo | 音鳴りを防止した建材 |
JPH08310314A (ja) * | 1995-05-15 | 1996-11-26 | Toyoda Gosei Co Ltd | 防音材 |
JP3524754B2 (ja) * | 1998-02-27 | 2004-05-10 | 株式会社オーディオテクニカ | マイクロホン |
JP4411112B2 (ja) | 2004-03-24 | 2010-02-10 | 株式会社オーディオテクニカ | 単一指向性ダイナミックマイクロホン |
JP4613047B2 (ja) * | 2004-10-27 | 2011-01-12 | 株式会社オーディオテクニカ | コンデンサマイクロホン |
WO2010006558A1 (zh) * | 2008-07-18 | 2010-01-21 | 歌尔声学股份有限公司 | 微型麦克风、微型麦克风的保护框架及其制造方法 |
US8200339B2 (en) * | 2008-10-13 | 2012-06-12 | Cochlear Limited | Implantable microphone for an implantable hearing prothesis |
-
2010
- 2010-03-25 JP JP2010069430A patent/JP5517157B2/ja not_active Expired - Fee Related
-
2011
- 2011-03-11 US US13/045,940 patent/US8406446B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20110235842A1 (en) | 2011-09-29 |
JP2011205299A (ja) | 2011-10-13 |
US8406446B2 (en) | 2013-03-26 |
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