JP5512052B2 - 非接触吸着盤 - Google Patents

非接触吸着盤 Download PDF

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Publication number
JP5512052B2
JP5512052B2 JP2013542287A JP2013542287A JP5512052B2 JP 5512052 B2 JP5512052 B2 JP 5512052B2 JP 2013542287 A JP2013542287 A JP 2013542287A JP 2013542287 A JP2013542287 A JP 2013542287A JP 5512052 B2 JP5512052 B2 JP 5512052B2
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JP
Japan
Prior art keywords
holder
porous pad
pad
sealed space
suction
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JP2013542287A
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English (en)
Japanese (ja)
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JPWO2013129599A1 (ja
Inventor
清隆 藤平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanken Seal Seiko Co Ltd
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Tanken Seal Seiko Co Ltd
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Application filed by Tanken Seal Seiko Co Ltd filed Critical Tanken Seal Seiko Co Ltd
Priority to JP2013542287A priority Critical patent/JP5512052B2/ja
Application granted granted Critical
Publication of JP5512052B2 publication Critical patent/JP5512052B2/ja
Publication of JPWO2013129599A1 publication Critical patent/JPWO2013129599A1/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP2013542287A 2012-02-28 2013-02-28 非接触吸着盤 Active JP5512052B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013542287A JP5512052B2 (ja) 2012-02-28 2013-02-28 非接触吸着盤

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012041171 2012-02-28
JP2012041171 2012-02-28
JP2013542287A JP5512052B2 (ja) 2012-02-28 2013-02-28 非接触吸着盤
PCT/JP2013/055491 WO2013129599A1 (ja) 2012-02-28 2013-02-28 非接触吸着盤

Publications (2)

Publication Number Publication Date
JP5512052B2 true JP5512052B2 (ja) 2014-06-04
JPWO2013129599A1 JPWO2013129599A1 (ja) 2015-07-30

Family

ID=49082790

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013542287A Active JP5512052B2 (ja) 2012-02-28 2013-02-28 非接触吸着盤

Country Status (5)

Country Link
JP (1) JP5512052B2 (zh)
KR (1) KR101697839B1 (zh)
CN (1) CN104137247B (zh)
TW (1) TWI527747B (zh)
WO (1) WO2013129599A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016121015A (ja) * 2014-12-24 2016-07-07 株式会社タンケンシールセーコウ 非接触搬送装置、および非接触吸着盤
WO2018042808A1 (ja) * 2016-08-29 2018-03-08 株式会社日本製鋼所 レーザ照射装置
US11348787B2 (en) 2017-08-25 2022-05-31 Jsw Aktina System Co., Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101627913B1 (ko) * 2014-05-26 2016-06-07 세메스 주식회사 반도체 패키지들을 지지하기 위한 테이블 조립체
CN104096980B (zh) * 2014-06-26 2016-01-20 长春光华微电子设备工程中心有限公司 激光切割真空吸附平台
CN106444298B (zh) * 2016-11-22 2018-01-30 江苏影速光电技术有限公司 一种dmd结构单轴固定光路直写曝光机
CN106444299B (zh) * 2016-11-22 2017-12-12 江苏影速光电技术有限公司 一种dmd结构多轴可移动光路直写曝光机
CN106325007B (zh) * 2016-11-22 2017-11-17 江苏影速光电技术有限公司 一种多扫描驱动轴可移动多棱镜光路直写设备
KR101749997B1 (ko) * 2017-01-17 2017-06-22 주식회사 21세기 Mlcc 적층용 상부금형
JP6898797B2 (ja) * 2017-07-10 2021-07-07 日本特殊陶業株式会社 真空吸着装置
JP7110005B2 (ja) * 2018-06-20 2022-08-01 キヤノン株式会社 基板回転装置、基板回転方法、リソグラフィ装置、および物品製造方法
JP7260984B2 (ja) * 2018-09-21 2023-04-19 日本特殊陶業株式会社 基板保持部材
NL2021859B1 (en) * 2018-10-23 2020-05-13 Suss Microtec Lithography Gmbh Fixation system, support plate and method for production thereof
CN111482712A (zh) * 2020-04-27 2020-08-04 沈阳仪表科学研究院有限公司 精密切割设备用辅助系统
KR102624060B1 (ko) 2021-09-29 2024-01-12 고려대학교 세종산학협력단 진공 분위기 유지 피식각체 이송 장치 및 진공 분위기 유지 피식각체 이송 방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750336A (ja) * 1993-08-04 1995-02-21 Hitachi Ltd 差動排気型真空吸着治具
JP2007027495A (ja) * 2005-07-19 2007-02-01 Tokyo Electron Ltd 浮上式基板搬送処理装置
JP2009104029A (ja) * 2007-10-25 2009-05-14 V Technology Co Ltd 露光装置
JP2011146705A (ja) * 2010-01-12 2011-07-28 Semes Co Ltd 基板処理装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4814050B2 (ja) 2006-10-31 2011-11-09 株式会社妙徳 浮上搬送ユニット
JP2011084352A (ja) 2009-10-14 2011-04-28 Myotoku Ltd ワーク浮上装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0750336A (ja) * 1993-08-04 1995-02-21 Hitachi Ltd 差動排気型真空吸着治具
JP2007027495A (ja) * 2005-07-19 2007-02-01 Tokyo Electron Ltd 浮上式基板搬送処理装置
JP2009104029A (ja) * 2007-10-25 2009-05-14 V Technology Co Ltd 露光装置
JP2011146705A (ja) * 2010-01-12 2011-07-28 Semes Co Ltd 基板処理装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016121015A (ja) * 2014-12-24 2016-07-07 株式会社タンケンシールセーコウ 非接触搬送装置、および非接触吸着盤
KR102552128B1 (ko) 2014-12-24 2023-07-06 가부시키가이샤 단켄시루세코 비접촉 반송 장치 및 비접촉 흡착반
WO2018042808A1 (ja) * 2016-08-29 2018-03-08 株式会社日本製鋼所 レーザ照射装置
JP2018037449A (ja) * 2016-08-29 2018-03-08 株式会社日本製鋼所 レーザ照射装置
US11688622B2 (en) 2016-08-29 2023-06-27 Jsw Aktina System Co., Ltd Laser irradiation apparatus
US11348787B2 (en) 2017-08-25 2022-05-31 Jsw Aktina System Co., Ltd. Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device

Also Published As

Publication number Publication date
KR101697839B1 (ko) 2017-01-18
TWI527747B (zh) 2016-04-01
TW201343514A (zh) 2013-11-01
WO2013129599A1 (ja) 2013-09-06
CN104137247B (zh) 2016-09-07
JPWO2013129599A1 (ja) 2015-07-30
KR20140129070A (ko) 2014-11-06
CN104137247A (zh) 2014-11-05

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