JP5511815B2 - モールド・アッセンブリおよびモールド部品製造用の減衰光方法 - Google Patents
モールド・アッセンブリおよびモールド部品製造用の減衰光方法 Download PDFInfo
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- JP5511815B2 JP5511815B2 JP2011520195A JP2011520195A JP5511815B2 JP 5511815 B2 JP5511815 B2 JP 5511815B2 JP 2011520195 A JP2011520195 A JP 2011520195A JP 2011520195 A JP2011520195 A JP 2011520195A JP 5511815 B2 JP5511815 B2 JP 5511815B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0833—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using actinic light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/26—Sealing devices, e.g. packaging for pistons or pipe joints
- B29L2031/265—Packings, Gaskets
Description
本発明は、サイクル数を改善するためのフランジ、モールドおよび電磁放射線フィルターを含むモールド・イン・プレースによるガスケット形成アッセンブリに関する。本発明は、さらに、モールド・イン・プレースによるガスケット形成アッセンブリを使用するモールド・イン・プレースによるガスケッティング方法に関する。
モールド・イン・プレースによるガスケットは、ガスケット形成材料をモールドに液体注入することによって形成されてきた。典型的な方法は、高温および/または高圧の液体注入の利用を含む。例えば、典型的な方法はSakaiらの米国特許第5,597,523号公報に記載されている。成形方法および成形デバイスは、典型的には約24,500kPaの高圧、および例えば250℃の高温を共に必要とする。ある例では、上部および下部モールドは相互にかみ合わせられて、それらの間にモールド空洞を決定する。ある例では、平らなカバーまたはフランジがモールドにかみ合わせられて、それらの間にあるモールド空洞を決定する。ガスケット形成材料、例えば、エポキシ樹脂またはプラスチックゴムは、モールド空洞中に2,900kPaでポンプによって送られる。モールドおよびガスケット材料は、約250℃に加熱される。ガスケット形成材料は、モールド空洞にポンプによって送られる。次いで、モールドは高圧、例えば24,500kPaで共に締め付けられる。ガスケット材料が電磁放射線または他の硬化技術によって硬化された後、モールドおよびガスケットは室温に冷却される。しかし、そのような短いサイクル時間で、そのような高い圧力および温度を利用するには、ガスケットを形成するために精密さを極めて維持しながら、圧力および温度のそのような大きな変動に耐えることができる金属モールドを使用する必要があり、そのことは装置および方法に経費がかかり、かつ運転を困難にする。
本発明のガスケットアッセンブリは、先行技術と比較して多いサイクル数で使用できる性能を提供する。例えば、ある実施形態において、本アッセンブリは許容可能なガスケットを製造するために、先行技術より1000回を超えて多く使用できる。用語「許容可能なガスケット」とは、ガスケットに明白な欠陥がなく、目視で観察できる欠陥なしでモールドから分離できるという意味と意図される。典型的には、先行技術のガスケットアッセンブリは、モールド中の破壊のため比較的短いサイクル寿命を有し、このことは多くの場合、結果として観察できる欠陥を有するモールドおよび/またはガスケットを生じる。そのような欠陥は分離の後、モールドの部分がガスケット上に残る、ならびにその逆を含む。
Claims (27)
- (i)流動性のガスケット形成材料を受け入れるための領域を有するフランジ;
(ii)410nmより短い波長を有する電磁放射線に対して透過性で内表面および外表面を有するモールドであって、前記内表面はモールド空洞を決定し、前記モールドは、前記領域に誘導されたガスケット形成材料を受け入れるための前記領域の周辺がシールされ;
(iii)410nmより短い波長を有する電磁放射線の供給源と前記モールド空洞との間に配置された電磁放射線フィルターであって、ここで前記電磁放射線フィルターは、前記モールドの前記外表面に近接し、供給源から発生されモールドに到達する410nmより短い波長を有する電磁放射線の量を制限および/または減衰し;および
(iv)電磁放射線硬化性組成物を含むガスケット形成材料;
を含む、モールド・イン・プレースによるガスケット形成アッセンブリ。 - 電磁放射線供給源は、モールド部品(単数または複数)中の1つ以上の導管であってよく、それを通って電磁放射線は、ガスケット形成材料を受け入れるための領域に移動する、請求項1に記載のアッセンブリ。
- ガスケット形成材料を受け入れるための領域を形成するモールド部品の1つは、それ自体が製造品またはその部品である、請求項1に記載のアッセンブリ。
- 前記電磁放射線硬化性組成物が、ガスケットを形成するために硬化される、請求項1に記載のアッセンブリ。
- 前記フィルターが、400nmより短い波長を有する電磁放射線の量を制限および/または減衰する、請求項1に記載のアッセンブリ。
- 前記電磁放射線硬化性組成物が、ポリアクリレートを含む、請求項1に記載のアッセンブリ。
- 前記電磁放射線硬化性組成物が、シリコーンを含む、請求項1に記載のアッセンブリ。
- 前記電磁放射線硬化性組成物が、
ポリエチレングリコールジ(メタ)アクリレート、ヒドロキシプロピル(メタ)アクリレート、ビスフェノール−Aジ(メタ)アクリレート、テトラヒドロフラン(メタ)アクリレートおよびジ(メタ)アクリレート、シトロネリルアクリレートおよびシトロネリルメタクリレート、ヘキサンジオールジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、テトラヒドロジシクロペンタジエニル(メタ)アクリレート、エトキシ化トリメチロールプロパントリアクリレート、トリエチレングリコールジアクリレートおよびトリエチレングリコールジメタクリレートから成る群より選択される少なくとも1種類の(メタ)アクリレートモノマーと;
エポキシ樹脂、ポリウレタン、ポリエステル、ポリエーテル、ポリアミド、ポリスルフィド、ポリチオエーテル、ポリ塩化ビニル、ポリアクリレート、ポリメタクリレート、エチレン−アクリレートエラストマー、ポリオレフィン、フルオロエラストマー、フルオロポリマー、スチレン単位含有エラストマー、ホットメルト樹脂、反応性ホットメルト樹脂、イソプレンおよびイソプレン含有エラストマー、EPDM、ブタジエンおよびブタジエン含有エラストマーおよびポリアセテートから成る群より選択される少なくとも1種類のポリマーと
の少なくともいずれか一方を含む、請求項1に記載のアッセンブリ。 - 前記モールドへの前記形成されたガスケットの接着力が、前記ガスケットの凝集力および前記モールドの凝集力のいずれよりも低いままである、請求項4に記載のアッセンブリ。
- 前記モールド、フィルターおよびフランジが、固定具に共に保持されている、請求項1に記載のアッセンブリ。
- 前記固定具が、前記フランジと前記モールドの間に加圧されたシールを形成するために共に締め付けられている、請求項10に記載のアッセンブリ。
- 前記モールドが、キャストまたは射出で成形された熱硬化性シリコーンを含む、請求項1に記載のアッセンブリ。
- 前記フィルターが、前記モールドのためのバッキングプレートとして機能する、請求項1に記載のアッセンブリ。
- 前記領域が平面状であるか、隆起、凹型またはその他の3次元的形状である、請求項1に記載のアッセンブリ。
- 前記モールドが、シリコーンを含む、請求項1に記載のアッセンブリ。
- 前記フィルターが、UVフィルターである、請求項1に記載のアッセンブリ。
- (i)注入されたガスケット形成材料を受け入れるための凹型領域を有する適用フランジ;
(ii)内表面および外表面を有し紫外光に対して透過性のシリコーンモールドであって、前記内表面はモールド空洞を決定し、前記シリコーンモールドは、前記凹型領域に注入されたガスケット形成材料を受け入れるための前記凹型領域の周辺がシールされ;
(iii)400nmより短い波長をフィルターで除くために前記シリコーンモールドの前記外表面に近接して配置された紫外線フィルター;および
(iv)紫外線硬化性ポリアクリレートを含むガスケット形成材料;
を含む、モールド・イン・プレースによるガスケット形成アッセンブリ。 - 前記UV硬化性ポリアクリレートが、ガスケットを形成するためにUV硬化される、請求項17に記載のアッセンブリ。
- 前記形成されたガスケットを前記モールドより反復して取り除くのを容易にするために、前記形成されたガスケットが、前記ガスケットまたはモールドの凝集強度より低い界面接着力を有する、請求項17に記載のアッセンブリ。
- a)(i)流動性のガスケット形成材料を受け入れるための領域を有するフランジ;
(ii)410nmより短い波長を有する電磁放射線に対して透過性で、内表面および外表面を有するモールドであって、前記内表面はモールド空洞を決定し、前記モールドは、前記領域に誘導されたガスケット形成材料を受け入れるための前記領域の周辺がシールされ;および
(iii)供給源から発生されモールドに到達する410nmより短い波長を有する電磁放射線の量を制限および/または減衰するために、410nmより短い波長を有する電磁放射線の供給源と前記モールド空洞との間に配置され、前記モールドの前記外表面に近接して配置された電磁放射線フィルター;
(iv)電磁放射線硬化性組成物を含むガスケット形成材料;を含むモールド・アッセンブリを提供するステップ;
b)電磁放射線硬化性組成物を含むガスケット形成材料を、前記モールド・アッセンブリの流動性ガスケット形成材料を受け入れるための前記領域中に注入すること;
c)前記ガスケット形成材料を硬化してガスケットを形成するために、前記フィルターおよびモールドを通して電磁放射線を誘導するステップ;および
d)ガスケットを形成するステップ;
を含む、モールド・イン・プレースで形成されたガスケットで填環する方法。 - さらに、前記ガスケットの前記表面を後硬化することを含む、請求項20に記載の方法。
- 前記領域が平面状であるか、隆起、凹型またはその他の3次元的形状である、請求項20に記載の方法。
- 前記モールドが、シリコーンを含む、請求項20に記載の方法。
- 前記フィルターが、400nmより短い波長を有する電磁放射線の量を制限および/または減衰する、請求項20に記載の方法。
- 前記注入温度が、216℃より低い、請求項20に記載の方法。
- 前記ガスケットの前記モールドへの前記界面接着力が、前記ガスケットおよび前記モールドの凝集強度より小さい、請求項20に記載の方法。
- 前記ガスケットを前記モールドから分離するステップを更に含む、請求項20に記載の方法。
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PCT/US2009/051532 WO2010011835A1 (en) | 2008-07-25 | 2009-07-23 | Mold assembly and attenuated light process for fabricating molded parts |
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Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110133366A1 (en) * | 2005-02-07 | 2011-06-09 | Henkel Corporation | Injection molding process, apparatus and material for forming cured-in-place gaskets |
US9073241B2 (en) | 2005-02-07 | 2015-07-07 | Henkel IP & Holding GmbH | Injection molding process and compositions with improved sealing characteristics for mold-in-place gaskets |
CN102165009A (zh) * | 2008-07-11 | 2011-08-24 | 汉高公司 | 用于就地模塑垫圈的具有改进的密封特性的组合物 |
WO2013055928A1 (en) * | 2011-10-14 | 2013-04-18 | Speculative Product Design, Llc | Case for enclosing a personal electronic device manufactured from a polyurethane or silicon compound and method for making same |
US9059580B2 (en) | 2011-11-10 | 2015-06-16 | Thomas & Betts International, Llc | Curing system for sealing an electrical fitting |
AT13189U1 (de) * | 2012-06-04 | 2013-08-15 | Elast Kunststoffverarbeitungs Gmbh Und Co Keg | Verfahren und Vorrichtung zur Verarbeitung von flüssigen Silikonmassen in Spritzgussmaschine und Spritzgussmaschine |
TW201540854A (zh) * | 2014-04-23 | 2015-11-01 | Hon Hai Prec Ind Co Ltd | 鍍膜方法 |
JP6359889B2 (ja) | 2014-06-23 | 2018-07-18 | 出光興産株式会社 | 熱硬化性組成物、及び熱硬化樹脂の製造方法 |
DE102014216613A1 (de) * | 2014-08-21 | 2016-02-25 | Henkel Ag & Co. Kgaa | Verfahren zur Herstellung einer Dichtung an einem Bauteil sowie formgebendes Werkzeug zur Verwendung in einem derartigen Verfahren |
DE102015121858A1 (de) * | 2015-12-15 | 2017-06-22 | Heraeus Kulzer Gmbh | Verfahren zur Herstellung grosser polymerisierter dentaler Materialblöcke |
TW201722699A (zh) | 2015-12-30 | 2017-07-01 | 聖高拜塑膠製品公司 | 複合管及其製造與使用方法 |
US20190299494A1 (en) * | 2016-07-21 | 2019-10-03 | Basf Se | Microwave welding of elastomer powder |
JP7038477B2 (ja) * | 2017-02-27 | 2022-03-18 | デクセリアルズ株式会社 | 画像表示装置及びその製造方法 |
CN115122550B (zh) * | 2022-06-08 | 2023-05-26 | 常州机电职业技术学院 | 一种用于模具成型的智能检测装置 |
Family Cites Families (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1109891B (de) * | 1955-08-25 | 1961-06-29 | American Sealants Company | Unter Luftausschluss polymerisierende fluessige Gemische |
US3218305A (en) * | 1963-12-26 | 1965-11-16 | Loctite Corp | Accelerated anaerobic compositions and method of using same |
US3425988A (en) * | 1965-01-27 | 1969-02-04 | Loctite Corp | Polyurethane polyacrylate sealant compositions |
US4295909A (en) * | 1975-02-03 | 1981-10-20 | Loctite Corporation | Curable polybutadiene-based resins having improved properties |
US4018851A (en) * | 1975-03-12 | 1977-04-19 | Loctite Corporation | Curable poly(alkylene) ether polyol-based grafted resins having improved properties |
US4051195A (en) * | 1975-12-15 | 1977-09-27 | Celanese Polymer Specialties Company | Polyepoxide-polyacrylate ester compositions |
US5529728A (en) * | 1986-01-28 | 1996-06-25 | Q2100, Inc. | Process for lens curing and coating |
US4879318A (en) * | 1986-01-28 | 1989-11-07 | Ophthalmic Research Group International, Inc. | Plastic lens composition and method for the production thereof |
JPS6334108A (ja) * | 1986-07-30 | 1988-02-13 | Hitachi Ltd | 光デイスク用基板の製造方法および装置 |
US4761443A (en) * | 1987-06-04 | 1988-08-02 | Dow Corning Corporaton | Multiple release mold coating for high water, high resiliency polyurethane foam |
US5219497A (en) * | 1987-10-30 | 1993-06-15 | Innotech, Inc. | Method for manufacturing lenses using thin coatings |
FR2657308B1 (fr) * | 1990-01-04 | 1994-08-05 | Peugeot | Procede et dispositif de realisation d'un joint renfermant un insert, a la peripherie d'un vitrage et vitrage obtenu. |
JPH04161305A (ja) * | 1990-10-26 | 1992-06-04 | Canon Inc | レンズの製造方法及び製造装置 |
GB2252267A (en) * | 1991-01-31 | 1992-08-05 | Grace W R & Co | Curing of plastisol liner material in thermoplastic closure |
US5597523A (en) * | 1994-02-22 | 1997-01-28 | Mitsubishi Denki Kabushiki Kaisha | Molding apparatus and method in which a mold cavity gasket is deformed by separately applied pressure |
US6635354B2 (en) * | 1995-01-20 | 2003-10-21 | Parker-Hannifin Corporation | Form-in place EMI gaskets |
JP3436435B2 (ja) * | 1995-02-22 | 2003-08-11 | 東レ・ダウコーニング・シリコーン株式会社 | 紫外線硬化型シリコーン組成物の硬化方法 |
JPH09193249A (ja) * | 1995-08-15 | 1997-07-29 | Dainippon Ink & Chem Inc | ディスクの貼り合わせ方法及び装置 |
US5885514A (en) * | 1996-12-09 | 1999-03-23 | Dana Corporation | Ambient UVL-curable elastomer mold apparatus |
JP4550954B2 (ja) * | 1998-05-29 | 2010-09-22 | デュポン パフォーマンス エラストマーズ エルエルシー | 白色エラストマーシール材およびその製造方法 |
US6201036B1 (en) * | 1998-07-21 | 2001-03-13 | Mezhoiraslevoi Nauchno-Tekhnichesky Komplex “Mikrokhirurgia Glaza” | Light-curable polymer material, method for making an elastic intraocular lens, and an elastic intraocular lens |
US6558587B1 (en) * | 1999-02-19 | 2003-05-06 | O'so, Inc. | In situ low pressure gasket molding method |
US6780001B2 (en) * | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
US20040108607A1 (en) * | 2000-02-04 | 2004-06-10 | Winterton Lynn Cook | Method for modifying a surface |
WO2001074554A2 (en) * | 2000-03-31 | 2001-10-11 | Bausch & Lomb Incorporated | Method and mold to control optical device polymerization |
US7220786B1 (en) * | 2000-08-23 | 2007-05-22 | Dana Corporation | Ultraviolet radiation curable coating for MLS head gasket applications |
US6830712B1 (en) * | 2000-08-28 | 2004-12-14 | Johnson & Johnson Vision Care, Inc. | Deformable molds and methods for their use in the manufacture of ophthalmic lenses |
JP2002250807A (ja) * | 2000-12-22 | 2002-09-06 | Dainippon Printing Co Ltd | レンズシート、それを用いたプロジェクションスクリーン、及びレンズシートの成形方法 |
JP3483539B2 (ja) * | 2001-03-30 | 2004-01-06 | Tdk株式会社 | スタンパ、金型システム、記録媒体用基板、スタンパ製造方法 |
AU2002950469A0 (en) * | 2002-07-30 | 2002-09-12 | Commonwealth Scientific And Industrial Research Organisation | Improved biomedical compositions |
US7517486B2 (en) * | 2003-05-16 | 2009-04-14 | Du Pont Performance Elastomers L.L.C. | Process for preparing UV curable sealing assemblies |
US7919020B2 (en) * | 2004-06-08 | 2011-04-05 | Hoya Corporation | Method of manufacturing plastic lens, gasket for molding plastic lens, casting mold for molding plastic lens, casting jig for plastic lens starting material liquid, holding member for plastic lens casting mold, and plastic lens manufacturing apparatus |
US20110133366A1 (en) * | 2005-02-07 | 2011-06-09 | Henkel Corporation | Injection molding process, apparatus and material for forming cured-in-place gaskets |
WO2006086324A1 (en) * | 2005-02-07 | 2006-08-17 | Henkel Corporation | Injection molding process, apparatus and material for forming cured-in-place gaskets |
US7785092B2 (en) * | 2005-08-09 | 2010-08-31 | Coopervision International Holding Company, Lp | Systems and methods for producing contact lenses from a polymerizable composition |
US8011916B2 (en) * | 2005-09-06 | 2011-09-06 | Canon Kabushiki Kaisha | Mold, imprint apparatus, and process for producing structure |
JP2008044271A (ja) * | 2006-08-18 | 2008-02-28 | Techno Polymer Co Ltd | 樹脂成形装置 |
EP1950021A4 (en) * | 2005-11-15 | 2010-05-26 | Techno Polymer Co Ltd | RESIN FORMING METHOD AND RESIN FORMING DEVICE |
JP4956270B2 (ja) * | 2007-05-14 | 2012-06-20 | テクノポリマー株式会社 | 樹脂成形方法及び樹脂成形装置 |
KR101289337B1 (ko) * | 2007-08-29 | 2013-07-29 | 시게이트 테크놀로지 엘엘씨 | 양면 임프린트 리소그래피 장치 |
KR101555230B1 (ko) * | 2009-01-29 | 2015-09-24 | 삼성전자주식회사 | 나노임프린트 리소그래피를 이용한 미세 패턴의 형성 방법 |
JP5636916B2 (ja) * | 2010-11-30 | 2014-12-10 | Jsr株式会社 | 光照射成形装置及び光照射成形方法 |
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2009
- 2009-07-23 CN CN200980134304.4A patent/CN102171012B/zh not_active Expired - Fee Related
- 2009-07-23 WO PCT/US2009/051532 patent/WO2010011835A1/en active Application Filing
- 2009-07-23 JP JP2011520195A patent/JP5511815B2/ja active Active
- 2009-07-23 KR KR1020117004239A patent/KR20110052655A/ko active Search and Examination
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JP2011529002A (ja) | 2011-12-01 |
CN102171012B (zh) | 2014-10-01 |
CN102171012A (zh) | 2011-08-31 |
US20110115132A1 (en) | 2011-05-19 |
WO2010011835A1 (en) | 2010-01-28 |
KR20110052655A (ko) | 2011-05-18 |
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