JP5506894B2 - 整形面をもつリテーニングリング - Google Patents
整形面をもつリテーニングリング Download PDFInfo
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- JP5506894B2 JP5506894B2 JP2012253344A JP2012253344A JP5506894B2 JP 5506894 B2 JP5506894 B2 JP 5506894B2 JP 2012253344 A JP2012253344 A JP 2012253344A JP 2012253344 A JP2012253344 A JP 2012253344A JP 5506894 B2 JP5506894 B2 JP 5506894B2
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- retaining ring
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- 238000005498 polishing Methods 0.000 claims description 82
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
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- 230000000452 restraining effect Effects 0.000 description 2
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- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000012935 Averaging Methods 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 241000218378 Magnolia Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Apparatus For Radiation Diagnosis (AREA)
Description
本発明の他の特徴、目的及び効果は、以下の説明、添付図面及び特許請求の範囲から明らかとなろう。
[0052]外面230の下縁220は、内面235の下縁225より上にある。底面155の最も下の地点は、内面235の下縁225から0.001mm乃至0.05mmであり、例えば、0.002mm乃至0.01mmである。例えば、D1−D2は、一般に、ほぼ0.0025mmである。
この実施形態では、テーブル202は、例えば、軌道経路に沿って楕円運動でテーブルを駆動する駆動メカニズムにより支持される。更に、リテーニングリングホルダー700は、弾力性バンパーを必要としない。
105…上部
110…底面
115…頂面
120…ホール
125…整列アパーチャー
130…下部
135…頂面
150…外面
155…底面
160…基板受け入れくぼみ
165…内面
205、210、215…領域
222…駆動メカニズム
230…外面
235…内面
250…ブレード
255…切削エッジ
260…切削面
262…ドラム
300…ラッピング装置
312…弾力性バンパー
320…リテーニングリング
333…駆動シャフト
340…ホイール
341…研磨又はラッピングテーブル
344…リテーニングリングキャリア
350…装着キャリア
352…駆動シャフト
354…プラテン
370…リテーニングリングキャリア
372…駆動シャフト
374…駆動メカニズム
376…プラテン
378…研磨又はラッピングパッド
380…ダミー基板
402…回転プラテン
410…キャリアヘッド
420…ラッピングパッド
430…ラッピング流体
440…シャフト
450…メンブレーン
470…チャンバー
480…ダミー基板
490…アダプタ
500…ラッピングテーブル
510…プラテン
520、540…オーバーハング
530…ホール
600…カバー
610…リテーニング壁
700…リテーニングリングホルダー
702…円板状本体
Claims (6)
- デバイス基板の研磨に使用されていないリテーニングリングにおいて、
頂面、該頂面付近の内径面、上記頂面付近の外径面、及び底面を有する環状の本体を備え、上記底面が、内径と外径との間に多くとも2つの円錐台形面を有し、更に、上記底面にわたる高さの差が0.002mm乃至0.02mmであり、上記底面の1つの上記円錐台形面は上記外径から上記内径へと下方に傾斜されている、化学的機械的研磨に使用するためのリテーニングリング。 - 上記底面は、1つだけの円錐台形面を内径と外径との間に有する、請求項1に記載のリテーニングリング。
- 上記底面は、2つの円錐台形面を内径と外径との間に有する、請求項1に記載のリテーニングリング。
- 上記底面は、上記2つの円錐台形面間に置かれた1つの平坦面を含む、請求項3に記載のリテーニングリング。
- リテーニングリングを形成する方法において、ターゲット表面特性を与えるように環状リテーニングリングの底面から材料を除去するステップであって、リテーニングリングの底面から材料を除去するのに専用に使用される第1マシンを使用して除去を行うステップを備え、上記ターゲット表面特性は、デバイス基板の研磨に使用される第2マシンにおいて上記リテーニングリングを試運転することから生じる平衡表面特性に一致するものである方法。
- デバイス基板の研磨に使用されていないリテーニングリングにおいて、頂面、内径面、外径面及び底面を有する環状の本体を備え、上記底面は、デバイス基板を研磨して上記リテーニングリングを試運転することから生じる平衡表面特性に一致するターゲット表面特性を有するものであるリテーニングリング。
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US52055503P | 2003-11-13 | 2003-11-13 | |
US60/520,555 | 2003-11-13 | ||
US55656904P | 2004-03-26 | 2004-03-26 | |
US60/556,569 | 2004-03-26 | ||
US58075904P | 2004-06-17 | 2004-06-17 | |
US58075804P | 2004-06-17 | 2004-06-17 | |
US60/580,758 | 2004-06-17 | ||
US60/580,759 | 2004-06-17 | ||
US60306804P | 2004-08-19 | 2004-08-19 | |
US60/603,068 | 2004-08-19 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006539965A Division JP5296985B2 (ja) | 2003-11-13 | 2004-11-12 | 整形面をもつリテーニングリング |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013056416A JP2013056416A (ja) | 2013-03-28 |
JP5506894B2 true JP5506894B2 (ja) | 2014-05-28 |
Family
ID=34624074
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006539965A Active JP5296985B2 (ja) | 2003-11-13 | 2004-11-12 | 整形面をもつリテーニングリング |
JP2012253344A Active JP5506894B2 (ja) | 2003-11-13 | 2012-11-19 | 整形面をもつリテーニングリング |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006539965A Active JP5296985B2 (ja) | 2003-11-13 | 2004-11-12 | 整形面をもつリテーニングリング |
Country Status (9)
Country | Link |
---|---|
US (9) | US7344434B2 (ja) |
EP (3) | EP2191936B1 (ja) |
JP (2) | JP5296985B2 (ja) |
KR (1) | KR101252751B1 (ja) |
CN (1) | CN1910012B (ja) |
AT (1) | ATE468941T1 (ja) |
DE (1) | DE602004027412D1 (ja) |
TW (2) | TWI355984B (ja) |
WO (1) | WO2005049274A2 (ja) |
Families Citing this family (60)
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DE602004027412D1 (de) | 2003-11-13 | 2010-07-08 | Applied Materials Inc | Haltering mit geformter fläche |
US11260500B2 (en) | 2003-11-13 | 2022-03-01 | Applied Materials, Inc. | Retaining ring with shaped surface |
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