WO2005049274B1 - Retaining ring with shaped surface - Google Patents

Retaining ring with shaped surface

Info

Publication number
WO2005049274B1
WO2005049274B1 PCT/US2004/038083 US2004038083W WO2005049274B1 WO 2005049274 B1 WO2005049274 B1 WO 2005049274B1 US 2004038083 W US2004038083 W US 2004038083W WO 2005049274 B1 WO2005049274 B1 WO 2005049274B1
Authority
WO
WIPO (PCT)
Prior art keywords
retaining ring
outer diameter
lapping
inner diameter
polishing
Prior art date
Application number
PCT/US2004/038083
Other languages
French (fr)
Other versions
WO2005049274A2 (en
WO2005049274A3 (en
Inventor
Hung Chih Chen
Steven M Zuniga
Charles C Garretson
Douglas R Mcallister
Stacy Meyer
Jian Lin
Sidney P Huey
Jeonghoon Oh
Trung T Doan
Jeffrey Schmidt
Martin S Wohlert
Kerry F Hughes
James C Wang
Danny Cam Toan Lu
Romain Beau Delamenie
Venkata R Balagani
Aden Martin Allen
Michael Jon Fong
Original Assignee
Applied Materials Inc
Hung Chih Chen
Steven M Zuniga
Charles C Garretson
Douglas R Mcallister
Stacy Meyer
Jian Lin
Sidney P Huey
Jeonghoon Oh
Trung T Doan
Jeffrey Schmidt
Martin S Wohlert
Kerry F Hughes
James C Wang
Danny Cam Toan Lu
Romain Beau Delamenie
Venkata R Balagani
Aden Martin Allen
Michael Jon Fong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Hung Chih Chen, Steven M Zuniga, Charles C Garretson, Douglas R Mcallister, Stacy Meyer, Jian Lin, Sidney P Huey, Jeonghoon Oh, Trung T Doan, Jeffrey Schmidt, Martin S Wohlert, Kerry F Hughes, James C Wang, Danny Cam Toan Lu, Romain Beau Delamenie, Venkata R Balagani, Aden Martin Allen, Michael Jon Fong filed Critical Applied Materials Inc
Priority to KR1020067011644A priority Critical patent/KR101252751B1/en
Priority to AT04801058T priority patent/ATE468941T1/en
Priority to JP2006539965A priority patent/JP5296985B2/en
Priority to CN2004800333875A priority patent/CN1910012B/en
Priority to EP04801058A priority patent/EP1694464B1/en
Priority to DE602004027412T priority patent/DE602004027412D1/en
Publication of WO2005049274A2 publication Critical patent/WO2005049274A2/en
Publication of WO2005049274A3 publication Critical patent/WO2005049274A3/en
Publication of WO2005049274B1 publication Critical patent/WO2005049274B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling

Abstract

A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portion. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.

Claims

AMENDED CLAIMS [received by the International Bureau on 16 November 2005 (16.11.2005); original claims 1-152 replaced by amended claims 1-150]
1. A retaining ring for a chemical mechanical polisher- comprising: a generally annular body having atop surface, an inner diameter surface, an outer diameter surface and a bottom surface, wherein the bottom surface has a convex shape and wherein a difference in height across the bottom surface is between 0.001 mm and 0.05 m.
2. The retairiing ring of claim 1 , wherein the difference in height across the bottom surface is between 0.001 mm and 0.03 rn .
3. The retaining ring of claim 1, wherein the height difference is between 0.002 intn and 0.02 mm.
4. The retaining ring of claim 1, further comprising an inner edge at the connection of the inner diameter surface and the bottom surface, and an outer edge at the connection of the outer diameter surface and the bottom surface, and the inner edge is at a different height than the outer edge.
5. The retaining ring of claim 4, wherein the inner edge is below the outer edge.
6. The retaining ring of claim 1 , wherein an outermost point on the convex profile is closer to the inner diameter surface than the outer diameter surface.
7. The retaining ring of claim 6, wherein the outermost point is about one-lnird of the width of the retaining ring from the inner diameter surface.
8. The retaining ring of claim 1 , ftirther comprising a plurality of channels in the bottom surface.
9. The reta ing ring of claim 1 , further comprising an upper portion formed of a first material and a lower portion formed of a second material, wherein the top surface is located
39 on the upper portion, the bottom surface is located on the lower portion, and the second material is less rigid than the first material.
10. A retaining ring for a chemical mechanical polisher, comprising: a generally annular body having a top surface, an inner diameter surface, an outer diameter surface and a bottom surface, wherein the bottom surface includes a generally horizontal portion adjacent the inner diameter surface and a sloped portion adjacent the outer diameter surface and has a continuous curve from the inner diameter surface to the outer diameter surface.
11. The retaining ring of claim 10, wherein the slope of the bottom surface increases toward the outer diameter surface,
12. The retaining ring of claim 10, wherein an edge of the bottom surface at the inner diameter surface is below an edge of the bottom surface at the outer diameter surface.
13. The retaining ring of claim 10, wherein, a difference in height across the bottom surface is between 0.001 mm and 0,03 mm.
14. The retaining ring of claim 10, wherein the retaining ring includes a lower portion and an upper portion formed of a material that is more rigid than a material of the lower portion.
15. A retaining ring for a chemical mechanical polisher, comprising: a generally annular body having a top surface, an inner diameter surface, an outer diameter surface and a bottom surface, wherein the bottom surface includes a convex portion adjacent the inner diameter surface and a concave portion adjacent the outer diameter surface.
16. The retaining ring of claim 15, wherein a difference in height across the bottom surface is between 0.001 mm and 0.03 mm.
17. A retaining ring for use in chemical mechanical polishing, comprising: a substantially arnular body having a top surface, an inner diameter surface adjacent to
40 the top surface, an outer diameter surface adjacent to the top surface, and a bottom surface, where the bottom surface has a flat sloped first portion adjacent to the inner diameter surface and a flat sloped second portion adjacent to the outer diameter surface and the first portion is not planar with the second portion.
18. The retaining ring of claim 17, wherein the first portion slopes downward from the inner diameter surface and the second portion slopes downward from the outer diameter surface.
19. The retaining ring of claim 18, wherein the bottom surface includes a third portion between the first and second portions, where the third portion is not coplanar with either of the first or second portions.
20. The retaining ring of claim 18, wherein the third portion is planar with the top surface.
21. The retaining ring of claim 18, wherein an area of the first portion that is adj acent to the second portion is closer to the inner diameter surface than to the outer diameter surface.
22. The retaining ring of claim 17, wherein a difference in height across the bottom surface is between 0.002 mm and 0.02 m.
23. The retaining ring of claim 23, wherein the height difference is approximately 0.01 mm.
24. The retaining ring of claim 17, wherein the bottom surface has exactly two surfaces between the inner diameter and the outer diameter, including one frustoconical surface and one planar surface.
25. The retaining ring of claim 17, wherein the bottom surface has exactly two surfaces between the inner diameter and the outer diameter, wherein both surfaces are frustoconical surfaces.
41
26. The retaining ring of claim 25, wherein the bottom surface has exactly three surfaces between the inner diameter and the outer diameter, including two frustoconical surfaces and one planar surface.
27. The retaining ring of claim 26, wherein the planar surface is between the two frustoconical surfaces.
28. A retaining ring for use in chemical mechanical poHshiπg, comprising: a substantially annular body having a top surface, an inner diameter surface adjacent to the top surface, an outer diameter surface adjacent to the top surface, and a bottom surface, wherein the bottom surface has at least one frustoconical surface between the inner diameter to the outer diameter, and wherein a difference in height across the bottom surface is between 0.002 mm and 0.02 mm.
29. The retaining ring of claim 28, wherein the bottom surface has exactly one frustoconical surface between the inner diameter and the outer diameter.
30. The retaining ring of claim 29, wherein the frustoconical surface extends from the inner diameter to the outer diameter.
31. The retaining ring of claim 30, wherein the bottom surface is sloped downwardly from the outer diameter to the inner diameter.
32. The retaining ring of claim 28, wherein the bottom surface includes exactly one planar surface.
33. The retaining ring of claim 32, wherein the planar surface is positioned radially outward of the frustoconical surface.
34. The retaining ring of claim 32, wherein the planar surface is positioned radially inward of the frustoconical surface.
35. The retaining ring of claim 28, wherein the bottom surface has exactly two frustoconical surfaces between the inner diameter and the outer diameter.
36. The retaining ring of claim 35, wherem the bottom surface includes exactly one planar surface that is located between the two frustoconical surfaces,
37- The retailing ring of claim 28, wherein the retaining ring includes two individual pieces.
38- Aretaining ring, comprising: an annular body having a bottom surface with a shaped radial profile formed by lapping the bottom surface using a first machine dedicated for use in lapping the bottom surface of retaining rings.
3 . A retaining ring comprising: an annular body having a bottom surface, an inner surface, an outer surface and a top surface configured for attachment to a carrier head, wherein the retaining ring includes a first portion and a second portion having different surface roughness.
40. The retaining ring of claim 39, wherein the first portion and second portion are located on the bottom surface.
41. The retaining ring of claim 39, wherein the first portion is located on the bottom surface and the second portion is located on one or more of the inner and outer surfaces.
42- A retaining ring comprising: an annular body having a bottom surface, an inner surface, an outer surface and a top surface configured for attachment to a carrier head, an inner edge between the inner surface and the bottom surface having a first radius of curvature, and an outer edge between the outer surface and the bottom surface having a second radius of curvature that is different from the first radius of curvature, the bottom surface having a generally horizontal portion between the inner and outer edges.
43
43. The retaining ring of claim 42, wherein the first radius of curvature is greater than the second radius of curvature.
44. The retaining ring of claim 42, wherein the first radius of curvature is less than the second radius of curvature.
45. The retaining ring of one of claims 1 , 10, 15, 17, 28 or 42, wherein the bottom surface of the retaining ring includes polyarm^e-imide.
46. The retaining ring of claim 45, wherein the retaining ring includes an upper portion having the top surface and a bottom portion having the bottom surface, the bottom portion is formed of polyamide-imide, and the upper portion is formed a metal that is more rigid than the polyamide-imide.
47. A lapping machine comprising: a rotating platen; a plurality of restraining arms associated with the platen, each resfraining arm operable to keep an object from moving along the path of the platen's rotation, while allowing the object to rotate about one or more points in the object; and an adaptor operable to couple a source of pneumatic pressure and a source of vacuum to at least one of the objects such that pneumatic pressure and vacuum can be applied to the object simultaneously.
48. The lapping machine of claim 47, wherein at least one of the pluraUty of restraining arms holds a conditioner.
49. An apparatus for forming a predetermined profile on a bottom surface of a retaining ring, comprising: a lapping table; and a retaining ring holder; wherein at least one of the lapping table and retaining ring holder is configured to apply a pressure differential across a width of the retaining ring.
44
50. The apparatus of claim 49, wherem the retaining ring holder includes a cover having a sloped lower surface that contacts the top surface of the retaining ring.
51. The apparatus of claim 50, wherein the sloped lower surface is sloped downwardly from inside outward.
52. The apparatus of claim 50, wherein the sloped lower surface is sloped upwardly from inside outward.
53. The apparatus of claim 49, wherein the retaining ring holder is bowable toward the lapping table to so as to apply increased pressure to the inner edge of the retaining ring.
54. The apparatus of claim 49, further comprising a drive shaft and a biasing mechanism to apply a lateral force to the drive shaft at a point separated from the holder.
55. The apparatus of claim 49, wherein the lapping table includes a concave lappmg surface.
56. A method of forming a surface profile on a bottom surface of a rctaimng ring, comprising: holding a bottom surface of an annular retaining ring in contact with a generally planar polishing surface; creating non-rotational motion between the bottom surface and the polishing surface to wear the bottom surface until the bottom surface reaches an equilibrium geometry.
57. The method of claim 56, wherein creating non-circular motion comprises creating random motion.
58. The method of claim 57, wherein creating random motion comprises creating random vibratory motion.
59. The method of claim 58, wherein creating random vibratory motion includes moving a poHshing table that supports the polishing surface in random vibratory motion.
45
60. The method of claim 57, wherem creating random vibratory motion includes permitting the retaining ring to float without lateral restraint on the polishing surface.
61. The method of claim 60, wherem creating random vibratory motion mcludes bouncmg a holder of the retaining ring off a retaining wall surrounding the polishing surface,
62. The method of claim 61, wherein bounding the holder includes contacting the retaining wall with a resilient bumper on the holder.
63. The method of claim 56, wherein creating non-circular motion comprises creating elliptical motion.
64. The method of claim 63, wherein creating elliptical motion comprises creating orbital motion.
65. The method of claim 63, wherein creating elliptical motion includes moving a polishing table that supports the polishing surface in elliptical motion.
66. The method of claim 63, wherein creating elliptical motion includes peirnitting the retaining ring to float without rotational restraint on the polishing surface.
67. The method of claim 56> further comprising retaining a polishing liquid on the polishing surface with a retaining wall surrounding the polishing surface.
68. The method of claim 56, wherein holding the retaining ring mcludes securing the retaining ring to a holder.
69. The method of claim 56, wherem the equilibrium geometry results in a difference in height across the bottom surface between 0.001 mm and 0.03 mm.
70. A method of assembling a carrier head, comprising: forming a surface profile on a bottom surface of a retaining ring according to the method
46 of claim 56; and securing the retaining ring with the equilibrium geometry to a carrier head.
71. A method of chemical mechanical polishing, comprising: assembling a carrier head according to the method of claim 70; securing the carrier head to a chemical mechanical polisher; holding a substrate in the carrier head with the retaining ring against a polishing surface; and creating relative motion between the substrate and the polishing surface.
72. The method of claim 71, wherein creating relative motion between the substrate and the pofishing surface includes rotating the carrier head.
73. The method of claim 71 , wherein creating relative motion between the substrate and the pohshing surface includes rotating the polishing surface.
74. The method of claim 73, wherem creating relative motion between the substrate and the polishing surface includes rotating the polishing surface,
75. The method of claim 71, wherein a profile of the bottom surface of the retaining ring does not substantially change from the equilibrium geometry after polishing of the substrate.
76. A method of forming a retaining ring, comprising: forming a retaining ring with an inner diameter surface, an outer diameter surface, a top surface and a bottom surface; and lapping the bottom surface to provide a predetermined non-planar profile.
77. The method of claim 76, wherein lapping the bottom surface includes applying a pressure differential across a width of the retaining ring.
78. The method of claim 77, wherein applying a pressure differential includes applying a pressure differential to the top surface of the retaining ring.
47
79. The method of claim 78, wherein lappmg the bottom surface includes holding the retaining ring in a cover having a sloped lower surface that contacts the top surface of the retaining ring.
80. The method of claim 79, wherein the sloped lower surface is sloped downwardly from inside outward.
81. The method of claim 79, wherein the sloped lower surface is sloped upwardly from inside outward.
82. The method of claim 78, wherein lapping the bottom surface includes holding the retaining ring in a flexible holder.
83. The method of claim 82, wherein applying a pressure differential includes applying a downward pressure to a center of the holder.
84. The method of claim 83, wherein applying a downward pressure to a center of the holder causes a center of the holder to bow toward the platen so as to apply increased pressure to the inner edge of the retaining ring.
85. The method of claim 78, wherem lapping the bottom surface includes holding the retaining ring in a rigid holder.
$6, The method of claim 85, wherein applying a pressure differential includes applying a lateral force to a shaft extending upwardly from the holder.
87. The method of claim 86, wherein applying a lateral force causes a moment of the holder so as to apply increased pressure to the outer edge of the retaining ring.
88. The method of claim 77, wherein applying a pressure differential includes applying a pressure differential to the bottom surface of the retaining ring.
48
89. The method of claim 88, wherein applying a pressure differential includes pressing the retaining ring against a concave lappmg surface.
90. The method of claim 76, further comprising attaching the retaining ring to a holder at a first temperature and heating at least one of the retaimng ring and holder to a second temperature,
91. The method of claim 90, wherein the retaining ring and the holder are formed of materials with different coefficients of thermal expansion.
92. The method of claim 90, wherem the retaining ring is heated to a second temperature different than that of the holder.
93. The method of claim 90, wherein the holder is heated to a second temperature different than that of the retaining ring.
94. A method of forming a retaining ring, comprising: forming a retaining ring with an inner diameter surface, an outer diameter surface, a top surface and a bottom surface; and machining the bottom surface to provide a predeteπnined non-planar profile.
95. The method of claim 94, wherein machining includes contacting the bottom surface to a cutting edge that is smaller than the width of the retaining ring, and moving the cutting edge along the width of the retaining ring while adjusting the relative distance between the retaining ring and the cutting edge so as to cut the predetermined non-planar profile.
96. The method of claim 94, wherein machining includes contacting the bottom surface to a cutting surface that is wider than the width of the retaimng ring and has a predetermined contour, and creating relative motion between the retaining ring and the cutting surface to machine the bottom surface into a contour that complements the predetermined contour to provide the predetermined non-planar profile.
49 97- A method of forming a retaining ring, comprising: forming a retaining ring with an inner diameter, an outer diameter, a top surface and a bottom surface; and shaping the bottom surface to have two or more annular regions where at least one of the regions is not parallel to the top surface.
98. The method of claim 97, wherem forming a retaining ring includes forming the retaining ring from two individual pieces.
99. The method of claim 97, wherein shaping the bottom surface includes shaping the regions to be either flat or frustoconical.
100. The method of claim 97, wherein the bottom surface has exactly three regions.
101. The method of claim 97, wherein shaping the bottom surface includes machining the bottom surface.
102. The method of claim 97, wherem shaping the bottom surface includes shaping the retaining ring such that a difference in height across the bottom surface is between 0.002 mm and 0.02 mm.
103. The method of claim 102, wherein shaping the bottom surface includes shaping the retaining ring such that the difference in height across the bottom surface is approximately 0.01 mm.
104. The method of claim 97, wherem shaping the bottom surface includes forming three regions which are not planar to one another, the first regions sloping downward from the outer diameter, the second region sloping downward from the inner diameter, and a third region between the first and second regions.
105. The method of claim 104, wherein shaping the bottom surface includes forming the third region to be closer to the inner diameter than to the outer diameter.
50 106- The method of claim 104, wherein shaping the bottom surface includes forming the third region to be closer to the outer diameter than to the inner diameter.
107. A method of forrriing a retaimng ring, comprising: forming a et ning ring with an inner diameter, an outer diameter, a top surface and a bottom surface; and shaping the bottom surface to provide at least one frustoconical surface from the inner diameter to the outer diameter, wherein a difference in height across the bottom surface is between 0.002 mm and 0.02 mm.
108. The method of claim 107, wherein shaping the bottom surface provides exactly one frustoconical surface between the inner diameter and the outer diameter.
109. The method of claim 108, wherein the frustoconical surface extends from the inner diameter to the outer diameter.
110- The method of claim 109, wherem the bottom surface is sloped downwardly from the outer diameter to the inner diameter.
111. The method of claim 107, wherein the bottom surface includes exactly one planar surface.
112. The method of claim 111, wherein the planar surface is positioned radially outward of the frustoconical surface.
113. The method of claim 111, wherein the planar surface is positioned radially inward of the frustoconical surface.
114. The method of claim 107, wherein shaping the bottom surface pro ides exactly two f ustoconical surfaces between the inner diameter and the outer diameter.
115- The method of claim 114, the bottom surface includes exactly one planar surface that is located between the two frustoconical surfaces.
51
116. The method of claim 107, wherein forming a retaimng ring includes forming the retaining ring from two individual pieces.
117- A method for shaping a retaining ring, the method comprising: providing a retaining ring having a bottom surface; and lapping the bottom surface to form a shaped radial profile in the bottom surface, the lapping being performed using a first machine dedicated for use in lapping the bottom surface of retaining rings.
118. The method of claim 117, further comprising: mounting the retaining ring to a carrier head before lapping the bottom surface.
119. The method of claim 117, wherein the bottom surface is a plastic.
120. The method of claim 117, wherein lapping the bottom surface includes holding a dummy substrate in the retaining ring while lapping.
121. The method of claim 117, wherein the shaped radial profile is substantially an equilibrium profile for the retaining ring, the equilibrium profile being associated with a set of chemical mechanical polishing process parameters.
122. The method of claim 117, wherem the shaped radial profile is substantially flat to within 0.05 mm.
123. The method of claim 117, wherein the first machine is a lapping machine having multiple lapping positions on a single platen.
124. The method of claim 117, further comprising: securing the retaining ring with the lapped bottom surface to a second machine used for polishing substrates; and holding a substrate in the retaining ring with the lapped bottom surface, the substrate contacting a polishing surface of the second machine.
52
125. The method of claim 124, wherein the second machine is a polishing machine having a plurality of carrier heads and a plurality of platens.
126- The method of claim 124, wherein the substrate contacting the polishing surface is a silicon substrate.
127. The method of claim 117, wherein the first machine does not have an associated wafer transfer system.
128. A method for shaping a retaining ring, the method comprising: providing a retaimng ring having a bottom surface; and lapping the bottom surface to form a shaped radial profile in the bottom surface, wherein during the lapping the ring is permitted to rotate freely about an axis of the ring.
129. The method of claim 128, further comprising mounting the retaining ring to a carrier head before lapping the bottom surface to form a shaped radial profile.
130. The method of claim 128, wherem the bottom surface is a plastic.
131. The method of claim 128, wherein lapping includes holding a dummy substrate in the retaining ring.
132. The method of claim 128, wherein the shaped radial profile is substantially an equilibrium profile for the retaining ring, the equiUbrium profile being associated with a set of chemical mechanical pohshing process parameters.
133. The method of claim 128, wherein the shaped radial profile is flat to within 0.05 mm.
134. The method of claim 128, wherein lapping mcludes lapping multiple retaining rings on a single platen.
53
135. A ethod of using a retaining ring, comprising: lapping a bottom surface of an annular retaining ring to provide a target surface characteristic, the lapping being performed using a first machine dedicated for use in lapping the bottom surface of retaining rings; securing the retaining ring on a carrier head; and polishing a plurality of device substrates with a second machine using the carrier head, wherein the target surface-,characteristic substantially matches an equilibrium surface characteristic that would result from breaking-in the retaining ring on the second machine.
136. The method of claim 135, wherein the polishing step includes one or more of rotation of the substrate, rotation of a polishing pad, orbiting of the substrate, orbiting of the polishing pad, oscillation of the substrate, oscillation of the polishing pad, or linear motion of the poHshing pad.
137. ' The method of claim 136, wherein the poHshing step comprises dual rotation.
138. The method of claim 1-37, wherein the surface characteristic comprises a profile of the bottom surface.
139. The method of claim 138, wherein the profile provides the bottom surface with a non- planar surface.
140. The method of claim 139, wherem the profile includes a convex curve.
141. The method of claim 139, wherein the profile provides the bottom surface with a frustoconical surface.
142. The method of claim 139, wherein the profile mcludes a radius of curvature of an inner edge and a radius of curvature of an outer edge.
143. The method of claim 142, wherein the radius of curvature of the inner edge is greater than the radius of curvature of the outer edge.
54
144. The method of claim 142, wherein the radius of curvature of the inner edge is less than the radius of curvature of the outer edge,
145. The method of claim 135 , wherein the surface characteristic comprises a surface roughness.
146. The method of claim 145, wherein the retaining ring includes portions having different surface roughness.
147. The method of claim 135, wherein the surface characteristic comprises an axial flatness.
148. The method of claim 147, wherem at a given radius an axial variation in profile is less than 0.3 mils.
149. A method of forming a retaining ring, comprising: removing material from a bottom surface of an annular retaining ring to provide a target surface characteristic, the removing being performed using a first machine dedicated for use in removing material from a bottom surface of retaining rings, wherein the target surface characteristic substantially matches an equilibrium surface characteristic that would result from breaking-in the retaining ring on a second machine used for polishing of device substrates.
150. A retaining ring that has not been use in device substrate poHshing, comprising: a generally annular body having atop surface, an inner diameter surface, an outer diameter surface and a bottom surface, wherem the bottom surface has a target surface characteristic substantially matches an equiHbrium surface characteristic that would result from breaking-in the retaining ring with the device substrate poHshing.
55
PCT/US2004/038083 2003-11-13 2004-11-12 Retaining ring with shaped surface WO2005049274A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020067011644A KR101252751B1 (en) 2003-11-13 2004-11-12 Retaining ring with shaped surface
AT04801058T ATE468941T1 (en) 2003-11-13 2004-11-12 RETAINING RING WITH SHAPED SURFACE
JP2006539965A JP5296985B2 (en) 2003-11-13 2004-11-12 Retaining ring with shaping surface
CN2004800333875A CN1910012B (en) 2003-11-13 2004-11-12 Retaining ring with shaped surface
EP04801058A EP1694464B1 (en) 2003-11-13 2004-11-12 Retaining ring with shaped surface
DE602004027412T DE602004027412D1 (en) 2003-11-13 2004-11-12 HOLDING WITH SHAPED SURFACE

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US52055503P 2003-11-13 2003-11-13
US60/520,555 2003-11-13
US55656904P 2004-03-26 2004-03-26
US60/556,569 2004-03-26
US58075804P 2004-06-17 2004-06-17
US58075904P 2004-06-17 2004-06-17
US60/580,758 2004-06-17
US60/580,759 2004-06-17
US60306804P 2004-08-19 2004-08-19
US60/603,068 2004-08-19

Publications (3)

Publication Number Publication Date
WO2005049274A2 WO2005049274A2 (en) 2005-06-02
WO2005049274A3 WO2005049274A3 (en) 2005-11-03
WO2005049274B1 true WO2005049274B1 (en) 2005-12-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/038083 WO2005049274A2 (en) 2003-11-13 2004-11-12 Retaining ring with shaped surface

Country Status (9)

Country Link
US (9) US7344434B2 (en)
EP (3) EP2191936B1 (en)
JP (2) JP5296985B2 (en)
KR (1) KR101252751B1 (en)
CN (1) CN1910012B (en)
AT (1) ATE468941T1 (en)
DE (1) DE602004027412D1 (en)
TW (2) TWI496660B (en)
WO (1) WO2005049274A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11850703B2 (en) 2003-11-13 2023-12-26 Applied Materials, Inc. Method of forming retaining ring with shaped surface

Families Citing this family (59)

* Cited by examiner, † Cited by third party
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