JP5500954B2 - 粘着材供給装置及びその製造方法 - Google Patents

粘着材供給装置及びその製造方法 Download PDF

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Publication number
JP5500954B2
JP5500954B2 JP2009264314A JP2009264314A JP5500954B2 JP 5500954 B2 JP5500954 B2 JP 5500954B2 JP 2009264314 A JP2009264314 A JP 2009264314A JP 2009264314 A JP2009264314 A JP 2009264314A JP 5500954 B2 JP5500954 B2 JP 5500954B2
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Japan
Prior art keywords
silicon
adhesive material
material supply
flux
resin layer
Prior art date
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Application number
JP2009264314A
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English (en)
Japanese (ja)
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JP2011108948A (ja
JP2011108948A5 (enrdf_load_stackoverflow
Inventor
秀明 坂口
公作 原山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2009264314A priority Critical patent/JP5500954B2/ja
Publication of JP2011108948A publication Critical patent/JP2011108948A/ja
Publication of JP2011108948A5 publication Critical patent/JP2011108948A5/ja
Application granted granted Critical
Publication of JP5500954B2 publication Critical patent/JP5500954B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2009264314A 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法 Active JP5500954B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009264314A JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009264314A JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2011108948A JP2011108948A (ja) 2011-06-02
JP2011108948A5 JP2011108948A5 (enrdf_load_stackoverflow) 2012-10-04
JP5500954B2 true JP5500954B2 (ja) 2014-05-21

Family

ID=44232099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009264314A Active JP5500954B2 (ja) 2009-11-19 2009-11-19 粘着材供給装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP5500954B2 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6088789B2 (ja) * 2012-10-26 2017-03-01 新光電気工業株式会社 粘着材供給装置及びその製造方法
KR102060831B1 (ko) 2013-02-27 2019-12-30 삼성전자주식회사 플립 칩 패키징 방법, 그리고 상기 플립 칩 패키징 방법에 적용되는 플럭스 헤드 및 그 제조 방법
KR101575641B1 (ko) 2014-04-21 2015-12-08 주식회사 루멘스 솔더 패터닝 시스템 및 솔더 패터닝 방법
WO2021194093A1 (ko) * 2020-03-27 2021-09-30 (주) 에스에스피 탄성패드를 이용한 플럭스툴
KR102206228B1 (ko) * 2020-03-27 2021-01-22 (주)에스에스피 탄성패드를 이용한 플럭스툴
JP7698537B2 (ja) * 2021-09-22 2025-06-25 ファスフォードテクノロジ株式会社 ディッピング装置、ダイボンディング装置および半導体装置の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0720383Y2 (ja) * 1987-07-21 1995-05-15 株式会社明電舎 水車ガイドベ−ンの異常検出装置
JP2001135925A (ja) * 1999-11-04 2001-05-18 Nec Corp フラックス供給装置及び供給方法
JP2004047874A (ja) * 2002-07-15 2004-02-12 Nec Semiconductors Kyushu Ltd フラックス転写装置
JP4653787B2 (ja) * 2007-08-08 2011-03-16 株式会社東芝 複製スタンパおよびその製造方法

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JP2011108948A (ja) 2011-06-02

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