JP5491906B2 - 束状フレキシブル配線 - Google Patents

束状フレキシブル配線 Download PDF

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Publication number
JP5491906B2
JP5491906B2 JP2010044117A JP2010044117A JP5491906B2 JP 5491906 B2 JP5491906 B2 JP 5491906B2 JP 2010044117 A JP2010044117 A JP 2010044117A JP 2010044117 A JP2010044117 A JP 2010044117A JP 5491906 B2 JP5491906 B2 JP 5491906B2
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Japan
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section
bundle
connection section
flexible substrate
layer
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Japanese (ja)
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JP2011066379A5 (enExample
JP2011066379A (ja
Inventor
林崑津
卓志恆
蘇國富
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易鼎股▲ふん▼有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H01B7/0892—Flat or ribbon cables incorporated in a cable of non-flat configuration
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/051—Rolled
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Conductors (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Manufacturing & Machinery (AREA)
JP2010044117A 2009-09-18 2010-03-01 束状フレキシブル配線 Active JP5491906B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW098131522A TWI543209B (zh) 2009-09-18 2009-09-18 Bundled soft circuit cable
TW098131522 2009-09-18

Publications (3)

Publication Number Publication Date
JP2011066379A JP2011066379A (ja) 2011-03-31
JP2011066379A5 JP2011066379A5 (enExample) 2013-04-04
JP5491906B2 true JP5491906B2 (ja) 2014-05-14

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ID=43755649

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010044117A Active JP5491906B2 (ja) 2009-09-18 2010-03-01 束状フレキシブル配線

Country Status (4)

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US (4) US20110067903A1 (enExample)
JP (1) JP5491906B2 (enExample)
KR (1) KR101664241B1 (enExample)
TW (1) TWI543209B (enExample)

Families Citing this family (188)

* Cited by examiner, † Cited by third party
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US8872032B2 (en) 2014-10-28
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