JP5489454B2 - 積層型半導体パッケージ - Google Patents

積層型半導体パッケージ Download PDF

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Publication number
JP5489454B2
JP5489454B2 JP2008331194A JP2008331194A JP5489454B2 JP 5489454 B2 JP5489454 B2 JP 5489454B2 JP 2008331194 A JP2008331194 A JP 2008331194A JP 2008331194 A JP2008331194 A JP 2008331194A JP 5489454 B2 JP5489454 B2 JP 5489454B2
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor package
wiring board
semiconductor
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008331194A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010153651A (ja
JP2010153651A5 (enExample
Inventor
直樹 安田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2008331194A priority Critical patent/JP5489454B2/ja
Publication of JP2010153651A publication Critical patent/JP2010153651A/ja
Publication of JP2010153651A5 publication Critical patent/JP2010153651A5/ja
Application granted granted Critical
Publication of JP5489454B2 publication Critical patent/JP5489454B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/1533—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate
    • H01L2924/15331—Connection portion the connection portion being formed on the die mounting surface of the substrate the connection portion being formed both on the die mounting surface of the substrate and outside the die mounting surface of the substrate being a ball array, e.g. BGA

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2008331194A 2008-12-25 2008-12-25 積層型半導体パッケージ Expired - Fee Related JP5489454B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008331194A JP5489454B2 (ja) 2008-12-25 2008-12-25 積層型半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008331194A JP5489454B2 (ja) 2008-12-25 2008-12-25 積層型半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2010153651A JP2010153651A (ja) 2010-07-08
JP2010153651A5 JP2010153651A5 (enExample) 2012-02-16
JP5489454B2 true JP5489454B2 (ja) 2014-05-14

Family

ID=42572417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008331194A Expired - Fee Related JP5489454B2 (ja) 2008-12-25 2008-12-25 積層型半導体パッケージ

Country Status (1)

Country Link
JP (1) JP5489454B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101930689B1 (ko) 2012-05-25 2018-12-19 삼성전자주식회사 반도체 장치
JP6415365B2 (ja) 2014-03-28 2018-10-31 株式会社ジェイデバイス 半導体パッケージ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002009265A (ja) * 2000-06-21 2002-01-11 Sony Corp 固体撮像装置
JP2003347722A (ja) * 2002-05-23 2003-12-05 Ibiden Co Ltd 多層電子部品搭載用基板及びその製造方法
JP4436179B2 (ja) * 2004-04-20 2010-03-24 富士通マイクロエレクトロニクス株式会社 半導体装置
JP2007251070A (ja) * 2006-03-18 2007-09-27 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2007281043A (ja) * 2006-04-04 2007-10-25 Matsushita Electric Ind Co Ltd 半導体装置

Also Published As

Publication number Publication date
JP2010153651A (ja) 2010-07-08

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