JP2010153651A5 - - Google Patents

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Publication number
JP2010153651A5
JP2010153651A5 JP2008331194A JP2008331194A JP2010153651A5 JP 2010153651 A5 JP2010153651 A5 JP 2010153651A5 JP 2008331194 A JP2008331194 A JP 2008331194A JP 2008331194 A JP2008331194 A JP 2008331194A JP 2010153651 A5 JP2010153651 A5 JP 2010153651A5
Authority
JP
Japan
Prior art keywords
resin material
sealing resin
wiring
stacked
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008331194A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010153651A (ja
JP5489454B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008331194A priority Critical patent/JP5489454B2/ja
Priority claimed from JP2008331194A external-priority patent/JP5489454B2/ja
Publication of JP2010153651A publication Critical patent/JP2010153651A/ja
Publication of JP2010153651A5 publication Critical patent/JP2010153651A5/ja
Application granted granted Critical
Publication of JP5489454B2 publication Critical patent/JP5489454B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008331194A 2008-12-25 2008-12-25 積層型半導体パッケージ Expired - Fee Related JP5489454B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008331194A JP5489454B2 (ja) 2008-12-25 2008-12-25 積層型半導体パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008331194A JP5489454B2 (ja) 2008-12-25 2008-12-25 積層型半導体パッケージ

Publications (3)

Publication Number Publication Date
JP2010153651A JP2010153651A (ja) 2010-07-08
JP2010153651A5 true JP2010153651A5 (enExample) 2012-02-16
JP5489454B2 JP5489454B2 (ja) 2014-05-14

Family

ID=42572417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008331194A Expired - Fee Related JP5489454B2 (ja) 2008-12-25 2008-12-25 積層型半導体パッケージ

Country Status (1)

Country Link
JP (1) JP5489454B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101930689B1 (ko) 2012-05-25 2018-12-19 삼성전자주식회사 반도체 장치
JP6415365B2 (ja) 2014-03-28 2018-10-31 株式会社ジェイデバイス 半導体パッケージ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002009265A (ja) * 2000-06-21 2002-01-11 Sony Corp 固体撮像装置
JP2003347722A (ja) * 2002-05-23 2003-12-05 Ibiden Co Ltd 多層電子部品搭載用基板及びその製造方法
JP4436179B2 (ja) * 2004-04-20 2010-03-24 富士通マイクロエレクトロニクス株式会社 半導体装置
JP2007251070A (ja) * 2006-03-18 2007-09-27 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2007281043A (ja) * 2006-04-04 2007-10-25 Matsushita Electric Ind Co Ltd 半導体装置

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