JP5435909B2 - スライドの変形を吸収するためのひずみメカニズムモジュールを有する試料移動ステージ - Google Patents

スライドの変形を吸収するためのひずみメカニズムモジュールを有する試料移動ステージ Download PDF

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Publication number
JP5435909B2
JP5435909B2 JP2008210611A JP2008210611A JP5435909B2 JP 5435909 B2 JP5435909 B2 JP 5435909B2 JP 2008210611 A JP2008210611 A JP 2008210611A JP 2008210611 A JP2008210611 A JP 2008210611A JP 5435909 B2 JP5435909 B2 JP 5435909B2
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Japan
Prior art keywords
slide
sample
moving stage
deformation
strain mechanism
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Expired - Fee Related
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JP2008210611A
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English (en)
Japanese (ja)
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JP2009065147A (ja
JP2009065147A5 (enExample
Inventor
チョン・ホンテク
クォン・デカプ
キム・ユンジェ
チョ・ユンマン
アン・ダフン
Original Assignee
スンハン・エンジニアリング・コーポレイション
コリア・アドヴァンスト・インスティテュート・オブ・サイエンス・アンド・テクノロジー
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Priority claimed from KR1020080005417A external-priority patent/KR100973530B1/ko
Application filed by スンハン・エンジニアリング・コーポレイション, コリア・アドヴァンスト・インスティテュート・オブ・サイエンス・アンド・テクノロジー filed Critical スンハン・エンジニアリング・コーポレイション
Publication of JP2009065147A publication Critical patent/JP2009065147A/ja
Publication of JP2009065147A5 publication Critical patent/JP2009065147A5/ja
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Publication of JP5435909B2 publication Critical patent/JP5435909B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2210/00—Machine tools incorporating a specific component
    • B23Q2210/002—Flexures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Details Of Measuring And Other Instruments (AREA)
JP2008210611A 2007-08-20 2008-08-19 スライドの変形を吸収するためのひずみメカニズムモジュールを有する試料移動ステージ Expired - Fee Related JP5435909B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2007-0083496 2007-08-20
KR20070083496 2007-08-20
KR10-2008-0005417 2008-01-17
KR1020080005417A KR100973530B1 (ko) 2007-08-20 2008-01-17 슬라이드변형흡수용 유연기구모듈을 이용한 시편이송장치

Publications (3)

Publication Number Publication Date
JP2009065147A JP2009065147A (ja) 2009-03-26
JP2009065147A5 JP2009065147A5 (enExample) 2011-09-15
JP5435909B2 true JP5435909B2 (ja) 2014-03-05

Family

ID=39884190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008210611A Expired - Fee Related JP5435909B2 (ja) 2007-08-20 2008-08-19 スライドの変形を吸収するためのひずみメカニズムモジュールを有する試料移動ステージ

Country Status (3)

Country Link
US (1) US7821632B2 (enExample)
EP (1) EP2027966B1 (enExample)
JP (1) JP5435909B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110090563A1 (en) * 2008-04-11 2011-04-21 Molecular Devices, Inc. Uniformity in slide scanning
JP5911959B2 (ja) 2011-09-09 2016-04-27 マッパー・リソグラフィー・アイピー・ビー．ブイ． ウェーハテーブル用支持構造体
JP6274246B2 (ja) * 2016-04-08 2018-02-07 株式会社デンソー 監視装置
CN106002312B (zh) * 2016-06-29 2018-01-23 广东工业大学 一种单驱动刚柔耦合精密运动平台及其实现方法及应用
JP7178944B2 (ja) * 2019-04-09 2022-11-28 株式会社ニューフレアテクノロジー ステージ装置
CN112964191B (zh) * 2021-03-25 2022-11-04 四川合众精准科技有限公司 一种微变形激光准直测量方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6335989U (enExample) 1986-08-25 1988-03-08
JP2711589B2 (ja) * 1990-09-13 1998-02-10 キヤノン株式会社 レーザ干渉計用ミラーの取付け方法及び該方法を用いたステージ装置
JP3160049B2 (ja) * 1992-03-12 2001-04-23 株式会社日立製作所 位置決め装置
JPH09320954A (ja) * 1996-05-31 1997-12-12 Nikon Corp ステージ装置
JP3678533B2 (ja) * 1997-04-10 2005-08-03 富士通株式会社 荷電粒子ビーム露光装置
JPH11154698A (ja) 1997-11-21 1999-06-08 Nikon Corp テーブル支持装置
JPH11295031A (ja) * 1998-04-08 1999-10-29 Canon Inc 位置決めステージ装置とその位置計測方法および位置決めステージ装置を備えた露光装置ならびにデバイス製造方法
JP3413122B2 (ja) * 1998-05-21 2003-06-03 キヤノン株式会社 位置決め装置及びこれを用いた露光装置並びにデバイス製造方法
JP2001274223A (ja) 2000-03-23 2001-10-05 Hitachi Ltd 移動テーブル装置
JP2002022868A (ja) * 2000-07-07 2002-01-23 Sumitomo Heavy Ind Ltd Ｘ−ｙステージの可動テーブルの支持構造
CN100401193C (zh) * 2002-07-11 2008-07-09 Asml荷兰有限公司 光刻装置及制造集成电路的方法
KR100497729B1 (ko) * 2003-02-21 2005-06-28 한국과학기술원 유연기구 메커니즘을 이용한 3축 직선운동 스테이지
US7384228B2 (en) * 2004-05-24 2008-06-10 Asml Netherlands B.V. Insertion device, lithographic apparatus with said insertion device and device manufacturing method
US20080111977A1 (en) * 2006-11-14 2008-05-15 Asml Holding N.V. Compensation techniques for fluid and magnetic bearings

Also Published As

Publication number Publication date
US7821632B2 (en) 2010-10-26
JP2009065147A (ja) 2009-03-26
US20090051911A1 (en) 2009-02-26
EP2027966A1 (en) 2009-02-25
EP2027966B1 (en) 2010-04-21

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