JP5427705B2 - 発光ユニット - Google Patents
発光ユニット Download PDFInfo
- Publication number
- JP5427705B2 JP5427705B2 JP2010138972A JP2010138972A JP5427705B2 JP 5427705 B2 JP5427705 B2 JP 5427705B2 JP 2010138972 A JP2010138972 A JP 2010138972A JP 2010138972 A JP2010138972 A JP 2010138972A JP 5427705 B2 JP5427705 B2 JP 5427705B2
- Authority
- JP
- Japan
- Prior art keywords
- led package
- cover
- base material
- emitting unit
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000011810 insulating material Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 10
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 210000000078 claw Anatomy 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 230000035939 shock Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
- H01R4/4809—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar
- H01R4/48185—Clamped connections, spring connections utilising a spring, clip, or other resilient member using a leaf spring to bias the conductor toward the busbar adapted for axial insertion of a wire end
Description
図7乃至図9は、上記実施形態の変形例に係る発光ユニットのカバー4を示す。図7及び図8に示されるように、この変形例においては、カバー4がLEDパッケージからの光を集光するための光学部材7を有する。光学部材7は、レンズ部7aと、このレンズ部7aを保持するためのレンズ保持部7bとを有し、レンズ部7aとレンズ保持部7bとが一体となって、カバー4上に固定される。ここでは、カバー4は光学部材7を固定するための2つの係合孔46を有し、レンズ保持部7bは、この係合孔46に係合する係合爪74を有する。なお、係合孔46及び係合爪74は、1組でも、3組以上であってもよい。
2 基材
3 LEDパッケージ
4 カバー
43 端子台
5 ねじ(固定具)
6 ばね部材(給電用導線)
10 照明器具
11 本体部
Claims (2)
- 照明器具の本体部に固定される発光ユニットであって、
基材と、この基材上に載せ置きされるLEDパッケージと、
前記基材とLEDパッケージとを覆い前記LEDパッケージに接触して給電するための給電用導線を固定するための端子台を兼ねるカバーと、
前記カバーと基材とに係り合い、かつ、前記LEDパッケージに係り合わない前記本体部に固定するための固定具と、を備えたことを特徴とする発光ユニット。 - 前記固定具は金属製であり、前記基材は絶縁材で成ることを特徴とする請求項1に記載の発光ユニット。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010138972A JP5427705B2 (ja) | 2010-06-18 | 2010-06-18 | 発光ユニット |
US13/164,011 US9291335B2 (en) | 2010-06-18 | 2011-06-20 | Light-emitting device with electrically insulated LED module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010138972A JP5427705B2 (ja) | 2010-06-18 | 2010-06-18 | 発光ユニット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012003999A JP2012003999A (ja) | 2012-01-05 |
JP5427705B2 true JP5427705B2 (ja) | 2014-02-26 |
Family
ID=45493476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010138972A Active JP5427705B2 (ja) | 2010-06-18 | 2010-06-18 | 発光ユニット |
Country Status (2)
Country | Link |
---|---|
US (1) | US9291335B2 (ja) |
JP (1) | JP5427705B2 (ja) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102478218B (zh) * | 2010-11-29 | 2013-07-10 | 中强光电股份有限公司 | 装置外壳 |
TWI414714B (zh) * | 2011-04-15 | 2013-11-11 | Lextar Electronics Corp | 發光二極體杯燈 |
JP5216111B2 (ja) * | 2011-02-09 | 2013-06-19 | フェニックス電機株式会社 | Led基板押さえ部材およびそれを用いたledランプ |
JP5717495B2 (ja) * | 2011-03-25 | 2015-05-13 | 三菱電機株式会社 | Led照明器具 |
JP5767853B2 (ja) * | 2011-05-12 | 2015-08-19 | 株式会社小糸製作所 | 車両用灯具 |
MX2011009774A (es) * | 2011-09-19 | 2013-03-19 | Luis Gerardo Avina Silva | Luminaria de leds de potencia con mecanismo modular y expandible. |
US8783911B2 (en) * | 2012-02-17 | 2014-07-22 | Tsmc Solid State Lighting Ltd. | LED packaging structure having improved thermal dissipation and mechanical strength |
JP5900019B2 (ja) * | 2012-02-29 | 2016-04-06 | 日亜化学工業株式会社 | 発光装置用ホルダ |
US9581317B2 (en) * | 2012-03-02 | 2017-02-28 | Molex, Llc | Array holder and LED module with same |
JP5567616B2 (ja) * | 2012-03-14 | 2014-08-06 | 株式会社セライズ | Led基板の取り付け部材 |
US9541265B2 (en) * | 2012-05-21 | 2017-01-10 | Osram Gmbh | Mounting device for lighting sources and associated method |
JP5811960B2 (ja) * | 2012-06-26 | 2015-11-11 | 豊田合成株式会社 | 発光モジュール |
WO2014041810A1 (ja) * | 2012-09-12 | 2014-03-20 | パナソニック株式会社 | 照明器具 |
JP6273639B2 (ja) * | 2012-11-05 | 2018-02-07 | 佑允 山中 | 照明装置および照明スタンド |
DE102012221908A1 (de) * | 2012-11-29 | 2014-06-05 | Osram Gmbh | Leuchtmodul für eine Fahrzeug-Leuchtvorrichtung mit Halbleiterlichtquelle |
JP6160943B2 (ja) * | 2012-12-17 | 2017-07-12 | パナソニックIpマネジメント株式会社 | 照明装置及びホルダ |
AT13737U1 (de) * | 2012-12-21 | 2014-07-15 | Tridonic Connection Technology Gmbh & Co Kg | Leuchtmittel, insbesondere LED-Modul |
JP5614732B2 (ja) | 2012-12-26 | 2014-10-29 | Smk株式会社 | Ledモジュール基板用コネクタ |
JP6214883B2 (ja) * | 2013-03-06 | 2017-10-18 | アイリスオーヤマ株式会社 | Led照明装置 |
JP6029067B2 (ja) * | 2013-03-12 | 2016-11-24 | パナソニックIpマネジメント株式会社 | 照明用光源及び照明装置 |
JP6262339B2 (ja) * | 2013-07-02 | 2018-01-17 | モレックス エルエルシー | Ledホルダシステム |
CN104344247A (zh) * | 2013-08-05 | 2015-02-11 | 展晶科技(深圳)有限公司 | 发光二极管灯具 |
US10151459B2 (en) | 2013-11-06 | 2018-12-11 | Molex, Llc | LED holder |
CN105739642A (zh) * | 2014-12-12 | 2016-07-06 | 鸿富锦精密工业(武汉)有限公司 | 指示装置 |
US10253956B2 (en) | 2015-08-26 | 2019-04-09 | Abl Ip Holding Llc | LED luminaire with mounting structure for LED circuit board |
US10069051B2 (en) * | 2016-04-08 | 2018-09-04 | Advanced Semiconductor Engineering, Inc. | Semiconductor package device and method of manufacturing the same |
US10190755B2 (en) | 2016-11-15 | 2019-01-29 | Abl Ip Holding Llc | LED board retention |
US10251279B1 (en) | 2018-01-04 | 2019-04-02 | Abl Ip Holding Llc | Printed circuit board mounting with tabs |
US10900618B2 (en) | 2019-01-22 | 2021-01-26 | Nichia Corporation | Light-emitting device holder and light source device |
JP7089661B2 (ja) * | 2019-01-22 | 2022-06-23 | 日亜化学工業株式会社 | 発光装置用ホルダ及び光源装置 |
USD919128S1 (en) * | 2019-06-14 | 2021-05-11 | Lumileds Llc | Optical module with LED emitting amber-colored light |
USD919130S1 (en) * | 2019-06-14 | 2021-05-11 | Lumileds Llc | Optical module with LED emitting white-colored light |
USD919129S1 (en) * | 2019-06-14 | 2021-05-11 | Lumileds Llc | Optical module with LED emitting red-colored light |
USD900355S1 (en) * | 2019-06-14 | 2020-10-27 | Lumileds Llc | Optical module with at least one light emitting diode (LED) |
USD899672S1 (en) * | 2019-06-18 | 2020-10-20 | Lumileds Llc | Optical modules installed in base plate |
EP3754254B1 (en) * | 2019-06-19 | 2021-10-13 | Leedarson Lighting Co., Ltd. | Lighting apparatus |
USD976056S1 (en) * | 2020-04-27 | 2023-01-24 | Intex Marketing Ltd. | Spa tray with light |
US11293627B1 (en) * | 2021-02-02 | 2022-04-05 | Gary Lagasse | Miniature LED lightbulb mounting device |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004071143A1 (en) * | 2003-02-07 | 2004-08-19 | Matsushita Electric Industrial Co., Ltd. | Socket for led light source and lighting system using the socket |
JP2007087712A (ja) * | 2005-09-21 | 2007-04-05 | Toshiba Lighting & Technology Corp | ランプ |
JP2007156228A (ja) * | 2005-12-07 | 2007-06-21 | Rohm Co Ltd | Led表示器 |
JP2008135346A (ja) * | 2006-11-29 | 2008-06-12 | Yamaichi Electronics Co Ltd | Ledモジュール用コネクタ |
DE102008005823B4 (de) | 2008-01-24 | 2013-12-12 | Bjb Gmbh & Co. Kg | Anschlusselement zur elektrischen Anbindung einer LED |
KR101266205B1 (ko) * | 2008-07-08 | 2013-05-21 | 우시오덴키 가부시키가이샤 | 발광 장치 및 발광 장치의 제조 방법 |
JP2010098181A (ja) * | 2008-10-17 | 2010-04-30 | Citizen Electronics Co Ltd | Led発光装置 |
-
2010
- 2010-06-18 JP JP2010138972A patent/JP5427705B2/ja active Active
-
2011
- 2011-06-20 US US13/164,011 patent/US9291335B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2012003999A (ja) | 2012-01-05 |
US20120020086A1 (en) | 2012-01-26 |
US9291335B2 (en) | 2016-03-22 |
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