JP5421915B2 - Au−Ga−In系ろう材 - Google Patents
Au−Ga−In系ろう材 Download PDFInfo
- Publication number
- JP5421915B2 JP5421915B2 JP2010521681A JP2010521681A JP5421915B2 JP 5421915 B2 JP5421915 B2 JP 5421915B2 JP 2010521681 A JP2010521681 A JP 2010521681A JP 2010521681 A JP2010521681 A JP 2010521681A JP 5421915 B2 JP5421915 B2 JP 5421915B2
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- JP
- Japan
- Prior art keywords
- brazing material
- point
- brazing
- sealing
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3013—Au as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Arc Welding In General (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
Claims (8)
- Au−Ga−In三元系合金からなり、これらの元素の重量濃度が、Au−Ga−In三元系状態図におけるA点(Au:90%、Ga:10%、In:0%)、B点(Au:70%、Ga:30%、In:0%)、C点(Au:60%、Ga:0%、In:40%)、D点(Au:80%、Ga:0%、In:20%)を頂点とする多角形の領域内(但し、In、Gaが0%となる線上を除く)にあるろう材。
- Au−Ga−In三元系合金の元素の重量濃度が、Au−Ga−In三元系状態図におけるE点(Au:86%、Ga:13%、In:1%)、F点(Au:81%、Ga:17%、In:2%)、G点(Au:79%、Ga:10%、In:11%)、H点(Au:84%、Ga:6%、In:10%)を頂点とする多角形の領域内にある請求項1記載のろう材。
- Au−Ga−In三元系合金の元素の重量濃度が、Au−Ga−In三元系状態図におけるI点(Au:85%、Ga:10%、In:5%)、J点(Au:80%、Ga:14%、In:6%)、G点(Au:79%、Ga:10%、In:11%)、H点(Au:84%、Ga:6%、In:10%)を頂点とする多角形の領域内にある請求項1または請求項2に記載のろう材。
- 更に、Sn、Ge、Zn、Sb、Si、Bi、Alの少なくとも1の添加元素を含む請求項1〜請求項3のいずれかに記載のろう材。
- 添加元素の添加量は、0.001〜3.0重量%である請求項4記載のろう材。
- その材料組織が、溶融状態からの急冷凝固組織からなる請求項1〜請求項5のいずれかに記載のろう材。
- 請求項1〜請求項6のいずれかに記載のろう材を備える気密封止用のパッケージ部品。
- 請求項1〜請求項6のいずれかに記載のろう材を用いた封止方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010521681A JP5421915B2 (ja) | 2008-07-24 | 2009-07-15 | Au−Ga−In系ろう材 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008191192 | 2008-07-24 | ||
JP2008191192 | 2008-07-24 | ||
PCT/JP2009/062793 WO2010010833A1 (ja) | 2008-07-24 | 2009-07-15 | Au-Ga-In系ろう材 |
JP2010521681A JP5421915B2 (ja) | 2008-07-24 | 2009-07-15 | Au−Ga−In系ろう材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010010833A1 JPWO2010010833A1 (ja) | 2012-01-05 |
JP5421915B2 true JP5421915B2 (ja) | 2014-02-19 |
Family
ID=41570297
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010521681A Active JP5421915B2 (ja) | 2008-07-24 | 2009-07-15 | Au−Ga−In系ろう材 |
Country Status (8)
Country | Link |
---|---|
US (2) | US20110076183A1 (ja) |
EP (1) | EP2322316B1 (ja) |
JP (1) | JP5421915B2 (ja) |
KR (1) | KR101686252B1 (ja) |
CN (1) | CN102083582B (ja) |
NZ (1) | NZ589711A (ja) |
TW (1) | TWI445589B (ja) |
WO (1) | WO2010010833A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103014401B (zh) * | 2012-12-05 | 2014-12-03 | 昆明贵金属研究所 | 一种金合金及其制备方法 |
JP6413668B2 (ja) | 2014-11-11 | 2018-10-31 | 住友金属鉱山株式会社 | Au−Sn−Ag系はんだ合金とはんだ材料並びにこのはんだ合金又ははんだ材料を用いて封止された電子部品及び電子部品搭載装置 |
US10612112B2 (en) | 2015-04-09 | 2020-04-07 | Electronics And Telecommunications Research Institute | Noble metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same |
KR101839876B1 (ko) * | 2015-04-09 | 2018-03-20 | 한국전자통신연구원 | 3d 프린팅용 귀금속 소재, 그 제조 방법, 및 그 소재를 이용한 3d 프린팅 방법 |
CN107350663B (zh) * | 2017-08-30 | 2019-06-11 | 桂林电子科技大学 | 液态金属增强基纳米银焊膏热界面材料及其制备方法 |
WO2019207823A1 (ja) * | 2018-04-23 | 2019-10-31 | 田中貴金属工業株式会社 | 銀ろう材及び該銀ろう材を用いた接合方法 |
CN109207752A (zh) * | 2018-09-26 | 2019-01-15 | 云南大学 | 一种AuGe共晶合金凝固组织调控方法及该合金材料 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62166096A (ja) * | 1986-01-17 | 1987-07-22 | Mitsubishi Heavy Ind Ltd | Au−Inろう及びその作成方法 |
JPS63165097A (ja) * | 1986-12-26 | 1988-07-08 | Mitsubishi Metal Corp | 硬質金合金ろう材 |
JPS6462296A (en) * | 1987-08-29 | 1989-03-08 | Tokuriki Honten Kk | Gold brazing alloy |
JPH03138096A (ja) * | 1989-10-20 | 1991-06-12 | Tanaka Kikinzoku Kogyo Kk | エレクトロマイグレーション防止性ろう材及び外部リードをろう付けした電子部品 |
JPH0570252A (ja) * | 1991-02-14 | 1993-03-23 | Mitsubishi Materials Corp | ろう接用合金 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1234397B (de) * | 1954-11-20 | 1967-02-16 | Duerrwaechter E Dr Doduco | Verwendung von Gold- und/oder Silber-Legierungen als Werkstoff fuer elektrische Kontakte und Verfahren zur Herstellung von Kontakten |
US3141238A (en) * | 1960-11-22 | 1964-07-21 | Jr George G Harman | Method of low temperature bonding for subsequent high temperature use |
US3335489A (en) * | 1962-09-24 | 1967-08-15 | North American Aviation Inc | Interconnecting circuits with a gallium and indium eutectic |
DE3406712C1 (de) * | 1984-02-24 | 1985-04-11 | Degussa Ag, 6000 Frankfurt | Edelmetallegierungen fuer Dentalanwendungen |
DE3764087D1 (de) * | 1987-03-10 | 1990-09-06 | Steinemann Samuel | Intermetallische verbindung und ihre verwendung. |
JP3138096B2 (ja) * | 1992-12-24 | 2001-02-26 | 本田技研工業株式会社 | 変速機におけるオイルポンプ駆動装置 |
GB9314292D0 (en) * | 1993-07-10 | 1993-08-25 | Johnson Matthey Plc | Gold alloy |
JPH07151943A (ja) | 1993-11-30 | 1995-06-16 | Hitachi Cable Ltd | 光集積回路パッケージ及びその組立て方法 |
JP3915112B2 (ja) | 1999-11-22 | 2007-05-16 | 三菱マテリアル株式会社 | 濡れ性に優れた金錫合金ロウ材 |
US6156266A (en) * | 2000-01-07 | 2000-12-05 | Argen Corporation | Gold alloy for firing on porcelain |
US6620378B2 (en) * | 2000-02-14 | 2003-09-16 | Keith Weinstein | Precious metal solder |
EP1323492A4 (en) * | 2001-03-23 | 2004-10-06 | Citizen Watch Co Ltd | BRAZING SUPPLY METAL |
AU2003234608A1 (en) * | 2002-05-24 | 2003-12-12 | Baxter Healthcare S.A. | Automated dialysis system |
JP2007160340A (ja) | 2005-12-13 | 2007-06-28 | Epson Toyocom Corp | ロウ材 |
ITVR20070134A1 (it) * | 2007-09-27 | 2009-03-28 | Legor Group S R L | Leghe per oreficeria per la realizzazione di oggetti in oro bianco privi di nichel |
-
2009
- 2009-07-15 KR KR1020117003882A patent/KR101686252B1/ko active IP Right Grant
- 2009-07-15 NZ NZ589711A patent/NZ589711A/en unknown
- 2009-07-15 US US12/993,992 patent/US20110076183A1/en not_active Abandoned
- 2009-07-15 JP JP2010521681A patent/JP5421915B2/ja active Active
- 2009-07-15 CN CN2009801248798A patent/CN102083582B/zh active Active
- 2009-07-15 EP EP09800347.8A patent/EP2322316B1/en active Active
- 2009-07-15 WO PCT/JP2009/062793 patent/WO2010010833A1/ja active Application Filing
- 2009-07-23 TW TW098124851A patent/TWI445589B/zh active
-
2014
- 2014-08-15 US US14/460,904 patent/US9604317B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62166096A (ja) * | 1986-01-17 | 1987-07-22 | Mitsubishi Heavy Ind Ltd | Au−Inろう及びその作成方法 |
JPS63165097A (ja) * | 1986-12-26 | 1988-07-08 | Mitsubishi Metal Corp | 硬質金合金ろう材 |
JPS6462296A (en) * | 1987-08-29 | 1989-03-08 | Tokuriki Honten Kk | Gold brazing alloy |
JPH03138096A (ja) * | 1989-10-20 | 1991-06-12 | Tanaka Kikinzoku Kogyo Kk | エレクトロマイグレーション防止性ろう材及び外部リードをろう付けした電子部品 |
JPH0570252A (ja) * | 1991-02-14 | 1993-03-23 | Mitsubishi Materials Corp | ろう接用合金 |
Also Published As
Publication number | Publication date |
---|---|
KR20110041533A (ko) | 2011-04-21 |
EP2322316A1 (en) | 2011-05-18 |
CN102083582A (zh) | 2011-06-01 |
NZ589711A (en) | 2012-04-27 |
TWI445589B (zh) | 2014-07-21 |
US20110076183A1 (en) | 2011-03-31 |
CN102083582B (zh) | 2013-05-29 |
JPWO2010010833A1 (ja) | 2012-01-05 |
EP2322316A4 (en) | 2012-02-01 |
WO2010010833A1 (ja) | 2010-01-28 |
EP2322316B1 (en) | 2014-05-14 |
TW201016375A (en) | 2010-05-01 |
KR101686252B1 (ko) | 2016-12-13 |
US9604317B2 (en) | 2017-03-28 |
US20140356226A1 (en) | 2014-12-04 |
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