JP5413920B2 - 発光装置 - Google Patents

発光装置 Download PDF

Info

Publication number
JP5413920B2
JP5413920B2 JP2011090804A JP2011090804A JP5413920B2 JP 5413920 B2 JP5413920 B2 JP 5413920B2 JP 2011090804 A JP2011090804 A JP 2011090804A JP 2011090804 A JP2011090804 A JP 2011090804A JP 5413920 B2 JP5413920 B2 JP 5413920B2
Authority
JP
Japan
Prior art keywords
light emitting
external terminal
package body
emitting device
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011090804A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011139109A (ja
Inventor
登美男 井上
毅 筒井
ジェジュン ユン
玉 煕 申
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JP2011139109A publication Critical patent/JP2011139109A/ja
Application granted granted Critical
Publication of JP5413920B2 publication Critical patent/JP5413920B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139—Silver (Ag) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
JP2011090804A 2007-04-23 2011-04-15 発光装置 Active JP5413920B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20070039402 2007-04-23
KR10-2007-0039402 2007-04-23
KR1020080036995A KR100990637B1 (ko) 2007-04-23 2008-04-22 발광장치 및 그 제조방법
KR10-2008-0036995 2008-04-22

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2008113118A Division JP4903179B2 (ja) 2007-04-23 2008-04-23 発光装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2011139109A JP2011139109A (ja) 2011-07-14
JP5413920B2 true JP5413920B2 (ja) 2014-02-12

Family

ID=40154962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011090804A Active JP5413920B2 (ja) 2007-04-23 2011-04-15 発光装置

Country Status (2)

Country Link
JP (1) JP5413920B2 (ko)
KR (1) KR100990637B1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101579623B1 (ko) * 2008-11-28 2015-12-23 앰코 테크놀로지 코리아 주식회사 이미지 센서용 반도체 패키지 및 그 제조 방법
KR101037371B1 (ko) * 2009-03-16 2011-05-26 이익주 엘이디 제조방법
PH12013000227A1 (en) * 2012-07-30 2015-03-09 Canon Kk Ophthalmologic apparatus and ophthalmologic method
KR102124026B1 (ko) * 2013-12-27 2020-06-17 엘지디스플레이 주식회사 백라이트유닛용 광원장치 및 그 제조방법
KR102026655B1 (ko) * 2017-07-25 2019-09-30 (주)라이타이저 일면 발광 칩 스케일 패키지의 제조 방법
KR102275368B1 (ko) * 2019-10-14 2021-07-13 주식회사 에스엘바이오닉스 반도체 발광소자

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10144966A (ja) * 1996-09-13 1998-05-29 Iwasaki Electric Co Ltd 発光ダイオード
JP3673621B2 (ja) * 1997-07-30 2005-07-20 ローム株式会社 チップ型発光素子
JP2000150962A (ja) * 1998-11-10 2000-05-30 Nichia Chem Ind Ltd 発光ダイオード
JP2001077432A (ja) 1999-09-08 2001-03-23 Matsushita Electronics Industry Corp 面実装発光素子及びその製造方法
JP3627592B2 (ja) * 1999-10-08 2005-03-09 日亜化学工業株式会社 発光装置の製造方法
JP2002314138A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
US6744077B2 (en) * 2002-09-27 2004-06-01 Lumileds Lighting U.S., Llc Selective filtering of wavelength-converted semiconductor light emitting devices
JP4386789B2 (ja) 2004-05-12 2009-12-16 ローム株式会社 発光ダイオード素子の製造方法
JP2007073575A (ja) * 2005-09-05 2007-03-22 Matsushita Electric Ind Co Ltd 半導体発光装置
JP2007270004A (ja) * 2006-03-31 2007-10-18 Asahi Glass Co Ltd 硬化性シリコーン樹脂組成物、それを用いた透光性封止材および発光素子
JP4147353B2 (ja) * 2007-01-15 2008-09-10 豊田合成株式会社 発光装置

Also Published As

Publication number Publication date
KR20080095192A (ko) 2008-10-28
JP2011139109A (ja) 2011-07-14
KR100990637B1 (ko) 2010-10-29

Similar Documents

Publication Publication Date Title
JP4903179B2 (ja) 発光装置及びその製造方法
US7942550B2 (en) Light emitting device and backlight unit including the same
JP5413920B2 (ja) 発光装置
KR102033203B1 (ko) 광전자 반도체 소자, 변환 매체 박판 및 변환 매체 박판의 제조를 위한 방법
US8866376B2 (en) Light emitting device package and manufacturing method thereof
US8486731B2 (en) Light-emitting device and method for manufacturing light-emitting device
US7985980B2 (en) Chip-type LED and method for manufacturing the same
JP4044078B2 (ja) 高出力発光ダイオードパッケージ及び製造方法
US20070278513A1 (en) Semiconductor light emitting device and method of fabricating the same
WO2013168802A1 (ja) Ｌｅｄモジュール
JP2013191872A (ja) 発光素子パッケージ
KR101352967B1 (ko) 발광다이오드 칩, 그 제조방법 및 고출력 발광장치
KR20120032899A (ko) Ｌｅｄ 패키지 및 그 제조방법
US11329203B2 (en) Light emitting device including covering member and optical member
CN110197864B (zh) 半导体发光器件及其制造方法
JP2009094199A (ja) 発光装置、面光源、表示装置と、その製造方法
JP2006351773A (ja) 半導体発光装置
KR20150029497A (ko) 발광다이오드 패키지 구조체 및 그 제조 방법
JP2006080312A (ja) 発光装置およびその製造方法
JP5286122B2 (ja) 半導体発光装置および半導体発光装置の製造方法
CN102244179A (zh) 发光二极管封装结构及其制造方法
KR100856233B1 (ko) 고출력 발광장치 및 그 제조방법
JP2020107837A (ja) 発光装置とその製造方法
KR101432559B1 (ko) 발광 장치
KR20090126624A (ko) 발광 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110415

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20120814

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20121120

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130624

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130702

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131001

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131022

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131106

R150 Certificate of patent or registration of utility model

Ref document number: 5413920

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250