JP5412731B2 - 加熱加圧システム及び冷却装置 - Google Patents

加熱加圧システム及び冷却装置 Download PDF

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Publication number
JP5412731B2
JP5412731B2 JP2008036893A JP2008036893A JP5412731B2 JP 5412731 B2 JP5412731 B2 JP 5412731B2 JP 2008036893 A JP2008036893 A JP 2008036893A JP 2008036893 A JP2008036893 A JP 2008036893A JP 5412731 B2 JP5412731 B2 JP 5412731B2
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temperature
cooling
substrate
heating
peripheral
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Japanese (ja)
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JP2009200075A (ja
JP2009200075A5 (enExample
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功 菅谷
和也 岡本
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Nikon Corp
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Nikon Corp
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JP2008036893A 2008-02-19 2008-02-19 加熱加圧システム及び冷却装置 Active JP5412731B2 (ja)

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JP2008036893A JP5412731B2 (ja) 2008-02-19 2008-02-19 加熱加圧システム及び冷却装置

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JP2008036893A JP5412731B2 (ja) 2008-02-19 2008-02-19 加熱加圧システム及び冷却装置

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JP2009200075A JP2009200075A (ja) 2009-09-03
JP2009200075A5 JP2009200075A5 (enExample) 2011-09-08
JP5412731B2 true JP5412731B2 (ja) 2014-02-12

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071331A (ja) * 2009-09-25 2011-04-07 Nikon Corp 基板剥離方法及び基板剥離装置
JP2011082367A (ja) * 2009-10-07 2011-04-21 Nikon Corp 加圧加熱モジュール
JP5413149B2 (ja) * 2009-11-20 2014-02-12 株式会社ニコン 重ね合わされた複数の半導体基板を加熱して接合する接合装置における、接合条件の補正方法、および接合装置
JP4801769B2 (ja) * 2009-11-30 2011-10-26 三菱重工業株式会社 接合方法、接合装置制御装置、接合装置
KR101144840B1 (ko) * 2010-06-08 2012-05-14 삼성코닝정밀소재 주식회사 접합기판 제조방법
JP2012004322A (ja) * 2010-06-16 2012-01-05 Nikon Corp 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置
KR101186556B1 (ko) * 2010-07-02 2012-10-08 포항공과대학교 산학협력단 질화갈륨계 반도체와 금속기판과의 접합방법과 반도체 소자
JP2012054416A (ja) * 2010-09-01 2012-03-15 Nikon Corp 押圧装置、貼り合わせ装置、貼り合わせ方法、及び、積層半導体装置の製造方法
JP4831844B1 (ja) * 2010-09-28 2011-12-07 三菱重工業株式会社 常温接合装置および常温接合方法
JP5935542B2 (ja) * 2012-06-28 2016-06-15 株式会社ニコン 基板貼り合わせ装置および基板貼り合わせ方法
JP5797167B2 (ja) * 2012-07-27 2015-10-21 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6220308A (ja) * 1985-07-19 1987-01-28 Hitachi Ltd 熱処理方法および装置
JP2000133606A (ja) * 1998-10-22 2000-05-12 Ftl:Kk 半導体装置の製造方法
JPH11214279A (ja) * 1998-01-21 1999-08-06 Sony Corp 基板加熱装置
JP2002313529A (ja) * 2001-04-18 2002-10-25 Sakaguchi Dennetsu Kk 分割式プレートヒーター
JP3950424B2 (ja) * 2003-02-10 2007-08-01 東京エレクトロン株式会社 熱処理装置
US20070246450A1 (en) * 2006-04-21 2007-10-25 Cady Raymond C High temperature anodic bonding apparatus

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