JP5383430B2 - チップ形電子部品特性検査分類装置 - Google Patents

チップ形電子部品特性検査分類装置 Download PDF

Info

Publication number
JP5383430B2
JP5383430B2 JP2009246479A JP2009246479A JP5383430B2 JP 5383430 B2 JP5383430 B2 JP 5383430B2 JP 2009246479 A JP2009246479 A JP 2009246479A JP 2009246479 A JP2009246479 A JP 2009246479A JP 5383430 B2 JP5383430 B2 JP 5383430B2
Authority
JP
Japan
Prior art keywords
chip
type electronic
electronic component
classification
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2009246479A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011096715A (ja
Inventor
哲矢 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Humo Laboratory Ltd
Original Assignee
Humo Laboratory Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Humo Laboratory Ltd filed Critical Humo Laboratory Ltd
Priority to JP2009246479A priority Critical patent/JP5383430B2/ja
Priority to TW099128859A priority patent/TWI513521B/zh
Priority to KR1020100088280A priority patent/KR101697239B1/ko
Priority to CN201010510723.8A priority patent/CN102049392B/zh
Publication of JP2011096715A publication Critical patent/JP2011096715A/ja
Application granted granted Critical
Publication of JP5383430B2 publication Critical patent/JP5383430B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G01R31/013Testing passive components
    • G01R31/016Testing of capacitors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34Sorting according to other particular properties
    • B07C5/344Sorting according to other particular properties according to electric or electromagnetic properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36Sorting apparatus characterised by the means used for distribution
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Sorting Of Articles (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2009246479A 2009-10-27 2009-10-27 チップ形電子部品特性検査分類装置 Active JP5383430B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009246479A JP5383430B2 (ja) 2009-10-27 2009-10-27 チップ形電子部品特性検査分類装置
TW099128859A TWI513521B (zh) 2009-10-27 2010-08-27 Chip - type electronic parts - Characteristic inspection and sorting device
KR1020100088280A KR101697239B1 (ko) 2009-10-27 2010-09-09 칩형 전자부품 특성검사 분류장치
CN201010510723.8A CN102049392B (zh) 2009-10-27 2010-10-13 片状电子部件特性检查分类装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009246479A JP5383430B2 (ja) 2009-10-27 2009-10-27 チップ形電子部品特性検査分類装置

Publications (2)

Publication Number Publication Date
JP2011096715A JP2011096715A (ja) 2011-05-12
JP5383430B2 true JP5383430B2 (ja) 2014-01-08

Family

ID=43954383

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009246479A Active JP5383430B2 (ja) 2009-10-27 2009-10-27 チップ形電子部品特性検査分類装置

Country Status (4)

Country Link
JP (1) JP5383430B2 (zh)
KR (1) KR101697239B1 (zh)
CN (1) CN102049392B (zh)
TW (1) TWI513521B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102168907B1 (ko) * 2012-07-10 2020-10-22 가부시키가이샤 휴모 라보라토리 칩 전자 부품의 검사 방법 및 검사 장치
TWI583965B (zh) * 2013-07-15 2017-05-21 Humo Laboratory Ltd Inspection and sorting device for wafer electronic parts
JP6312200B2 (ja) * 2014-02-07 2018-04-18 株式会社ヒューモラボラトリー チップキャパシタ検査選別装置
JP6679552B2 (ja) * 2017-10-02 2020-04-15 株式会社ヒューモラボラトリー チップ電子部品の検査選別方法
TWI767762B (zh) * 2021-06-22 2022-06-11 萬潤科技股份有限公司 電子元件測試裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0427856Y2 (zh) * 1985-02-05 1992-07-06
JP2511807Y2 (ja) * 1993-06-11 1996-09-25 若井産業株式会社 部品供給装置
US5568870A (en) * 1994-08-18 1996-10-29 Testec, Inc. Device for testing and sorting small electronic components
US5842579A (en) * 1995-11-16 1998-12-01 Electro Scientific Industries, Inc. Electrical circuit component handler
JP3114692B2 (ja) * 1998-04-10 2000-12-04 株式会社村田製作所 被処理物取扱方法及び被処理物取扱装置
US6906508B1 (en) * 2003-12-11 2005-06-14 Ceramic Component Technologies, Inc. Component testing system vacuum ring and test plate construction
JP2006194831A (ja) * 2005-01-17 2006-07-27 Humo Laboratory Ltd チップ形電子部品特性検査分類装置
CN200998716Y (zh) * 2007-01-08 2008-01-02 深圳市国冶星光电子有限公司 分光机下料机构的接料管

Also Published As

Publication number Publication date
CN102049392A (zh) 2011-05-11
TW201138997A (en) 2011-11-16
CN102049392B (zh) 2014-04-02
KR20110046258A (ko) 2011-05-04
TWI513521B (zh) 2015-12-21
JP2011096715A (ja) 2011-05-12
KR101697239B1 (ko) 2017-01-17

Similar Documents

Publication Publication Date Title
JP5383430B2 (ja) チップ形電子部品特性検査分類装置
KR100484611B1 (ko) 전자부품 운송장치와 이를 이용한 검사장치
JP6496151B2 (ja) 三つ以上の電極を備えたチップ電子部品検査選別装置
US7743913B2 (en) Electronic component conveying apparatus and method of controlling the same
TWI640787B (zh) 晶片電子零件檢查分選裝置
JP2007230661A (ja) ワーク搬送システム
WO2014087492A1 (ja) 電子部品搬送装置
US20040187446A1 (en) Handling device for electronic chip components and handling method for electronic chip components
CN106211737B (zh) 电子零件搬运装置
CN114334769B (zh) 集成ic振动输送装置
US6737878B2 (en) Probe applied to semiconductor package test and method for testing semiconductor package
TW200823135A (en) Workpiece ejecting device
KR101551784B1 (ko) 워크 반송 장치
JP2014232794A (ja) 検査装置
US8916003B2 (en) Wafer scrubber
JP2012020822A (ja) ワーク搬送装置
KR102168405B1 (ko) 듀얼형 솔더볼 플레이스먼트 시스템
CN214113009U (zh) 编带设备的气流防单进料模块
WO2023127316A1 (ja) 部品選別装置
WO2012073283A1 (ja) 電子部品検査装置及びパーツフィーダ
JP2015003797A (ja) 搬送装置及び搬送ローター
JP2008277627A (ja) 部品実装装置
KR20210000665A (ko) 듀얼형 솔더볼 플레이스먼트 시스템용 볼툴
KR101544178B1 (ko) 진공제거 부품 선별장치
KR100853852B1 (ko) 솔더볼의 선별장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121001

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130716

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130723

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130924

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131001

R150 Certificate of patent or registration of utility model

Ref document number: 5383430

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250