JP5383430B2 - チップ形電子部品特性検査分類装置 - Google Patents
チップ形電子部品特性検査分類装置 Download PDFInfo
- Publication number
- JP5383430B2 JP5383430B2 JP2009246479A JP2009246479A JP5383430B2 JP 5383430 B2 JP5383430 B2 JP 5383430B2 JP 2009246479 A JP2009246479 A JP 2009246479A JP 2009246479 A JP2009246479 A JP 2009246479A JP 5383430 B2 JP5383430 B2 JP 5383430B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- type electronic
- electronic component
- classification
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007689 inspection Methods 0.000 title claims description 32
- 230000004308 accommodation Effects 0.000 claims description 15
- 238000010586 diagram Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
- G01R31/013—Testing passive components
- G01R31/016—Testing of capacitors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Sorting Of Articles (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009246479A JP5383430B2 (ja) | 2009-10-27 | 2009-10-27 | チップ形電子部品特性検査分類装置 |
TW099128859A TWI513521B (zh) | 2009-10-27 | 2010-08-27 | Chip - type electronic parts - Characteristic inspection and sorting device |
KR1020100088280A KR101697239B1 (ko) | 2009-10-27 | 2010-09-09 | 칩형 전자부품 특성검사 분류장치 |
CN201010510723.8A CN102049392B (zh) | 2009-10-27 | 2010-10-13 | 片状电子部件特性检查分类装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009246479A JP5383430B2 (ja) | 2009-10-27 | 2009-10-27 | チップ形電子部品特性検査分類装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011096715A JP2011096715A (ja) | 2011-05-12 |
JP5383430B2 true JP5383430B2 (ja) | 2014-01-08 |
Family
ID=43954383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009246479A Active JP5383430B2 (ja) | 2009-10-27 | 2009-10-27 | チップ形電子部品特性検査分類装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5383430B2 (zh) |
KR (1) | KR101697239B1 (zh) |
CN (1) | CN102049392B (zh) |
TW (1) | TWI513521B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102168907B1 (ko) * | 2012-07-10 | 2020-10-22 | 가부시키가이샤 휴모 라보라토리 | 칩 전자 부품의 검사 방법 및 검사 장치 |
TWI583965B (zh) * | 2013-07-15 | 2017-05-21 | Humo Laboratory Ltd | Inspection and sorting device for wafer electronic parts |
JP6312200B2 (ja) * | 2014-02-07 | 2018-04-18 | 株式会社ヒューモラボラトリー | チップキャパシタ検査選別装置 |
JP6679552B2 (ja) * | 2017-10-02 | 2020-04-15 | 株式会社ヒューモラボラトリー | チップ電子部品の検査選別方法 |
TWI767762B (zh) * | 2021-06-22 | 2022-06-11 | 萬潤科技股份有限公司 | 電子元件測試裝置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0427856Y2 (zh) * | 1985-02-05 | 1992-07-06 | ||
JP2511807Y2 (ja) * | 1993-06-11 | 1996-09-25 | 若井産業株式会社 | 部品供給装置 |
US5568870A (en) * | 1994-08-18 | 1996-10-29 | Testec, Inc. | Device for testing and sorting small electronic components |
US5842579A (en) * | 1995-11-16 | 1998-12-01 | Electro Scientific Industries, Inc. | Electrical circuit component handler |
JP3114692B2 (ja) * | 1998-04-10 | 2000-12-04 | 株式会社村田製作所 | 被処理物取扱方法及び被処理物取扱装置 |
US6906508B1 (en) * | 2003-12-11 | 2005-06-14 | Ceramic Component Technologies, Inc. | Component testing system vacuum ring and test plate construction |
JP2006194831A (ja) * | 2005-01-17 | 2006-07-27 | Humo Laboratory Ltd | チップ形電子部品特性検査分類装置 |
CN200998716Y (zh) * | 2007-01-08 | 2008-01-02 | 深圳市国冶星光电子有限公司 | 分光机下料机构的接料管 |
-
2009
- 2009-10-27 JP JP2009246479A patent/JP5383430B2/ja active Active
-
2010
- 2010-08-27 TW TW099128859A patent/TWI513521B/zh active
- 2010-09-09 KR KR1020100088280A patent/KR101697239B1/ko active IP Right Grant
- 2010-10-13 CN CN201010510723.8A patent/CN102049392B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN102049392A (zh) | 2011-05-11 |
TW201138997A (en) | 2011-11-16 |
CN102049392B (zh) | 2014-04-02 |
KR20110046258A (ko) | 2011-05-04 |
TWI513521B (zh) | 2015-12-21 |
JP2011096715A (ja) | 2011-05-12 |
KR101697239B1 (ko) | 2017-01-17 |
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