JP5379874B2 - シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器 - Google Patents

シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器 Download PDF

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Publication number
JP5379874B2
JP5379874B2 JP2012038136A JP2012038136A JP5379874B2 JP 5379874 B2 JP5379874 B2 JP 5379874B2 JP 2012038136 A JP2012038136 A JP 2012038136A JP 2012038136 A JP2012038136 A JP 2012038136A JP 5379874 B2 JP5379874 B2 JP 5379874B2
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Japan
Prior art keywords
sheet
heat pipe
container
protruding piece
heat
Prior art date
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Active
Application number
JP2012038136A
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English (en)
Japanese (ja)
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JP2013174376A5 (cg-RX-API-DMAC7.html
JP2013174376A (ja
Inventor
博史 青木
匡視 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP2012038136A priority Critical patent/JP5379874B2/ja
Priority to CN201390000266.5U priority patent/CN204217285U/zh
Priority to PCT/JP2013/053474 priority patent/WO2013125427A1/ja
Priority to TW102105829A priority patent/TWI510899B/zh
Publication of JP2013174376A publication Critical patent/JP2013174376A/ja
Publication of JP2013174376A5 publication Critical patent/JP2013174376A5/ja
Application granted granted Critical
Publication of JP5379874B2 publication Critical patent/JP5379874B2/ja
Priority to US14/467,928 priority patent/US9565786B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2012038136A 2012-02-24 2012-02-24 シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器 Active JP5379874B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2012038136A JP5379874B2 (ja) 2012-02-24 2012-02-24 シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器
CN201390000266.5U CN204217285U (zh) 2012-02-24 2013-02-14 薄片状热管及具备薄片状热管的电子设备
PCT/JP2013/053474 WO2013125427A1 (ja) 2012-02-24 2013-02-14 シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器
TW102105829A TWI510899B (zh) 2012-02-24 2013-02-20 A sheet-like heat pipe and an electronic device having a sheet-like heat pipe
US14/467,928 US9565786B2 (en) 2012-02-24 2014-08-25 Sheet-like heat pipe, and electronic device provided with same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012038136A JP5379874B2 (ja) 2012-02-24 2012-02-24 シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器

Publications (3)

Publication Number Publication Date
JP2013174376A JP2013174376A (ja) 2013-09-05
JP2013174376A5 JP2013174376A5 (cg-RX-API-DMAC7.html) 2013-10-17
JP5379874B2 true JP5379874B2 (ja) 2013-12-25

Family

ID=49005614

Family Applications (1)

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JP2012038136A Active JP5379874B2 (ja) 2012-02-24 2012-02-24 シート状ヒートパイプ、及びシート状ヒートパイプを備えた電子機器

Country Status (5)

Country Link
US (1) US9565786B2 (cg-RX-API-DMAC7.html)
JP (1) JP5379874B2 (cg-RX-API-DMAC7.html)
CN (1) CN204217285U (cg-RX-API-DMAC7.html)
TW (1) TWI510899B (cg-RX-API-DMAC7.html)
WO (1) WO2013125427A1 (cg-RX-API-DMAC7.html)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
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JP6121854B2 (ja) * 2013-09-18 2017-04-26 東芝ホームテクノ株式会社 シート型ヒートパイプまたは携帯情報端末
CN103702549A (zh) * 2013-12-26 2014-04-02 苏州天脉导热科技有限公司 一种用于超薄电子产品的热管
CN104797120A (zh) * 2014-01-21 2015-07-22 宏达国际电子股份有限公司 电子装置
TW201530076A (zh) 2014-01-21 2015-08-01 Htc Corp 電子裝置
US9435590B2 (en) 2014-04-07 2016-09-06 Microsoft Technology Licensing, Llc Thin heat transfer device for thermal management
JP6023120B2 (ja) * 2014-05-15 2016-11-09 レノボ・シンガポール・プライベート・リミテッド 携帯用情報機器
CN105636406A (zh) * 2014-11-07 2016-06-01 泰硕电子股份有限公司 行动装置的散热模块
JP6548032B2 (ja) * 2015-03-19 2019-07-24 株式会社オートネットワーク技術研究所 冷却部材、及び蓄電モジュール
US10670352B2 (en) * 2016-05-23 2020-06-02 Pimems, Inc. High performance two-phase cooling apparatus for portable applications
US11306974B2 (en) * 2016-06-15 2022-04-19 Delta Electronics, Inc. Temperature plate and heat dissipation device
US11543188B2 (en) 2016-06-15 2023-01-03 Delta Electronics, Inc. Temperature plate device
KR102097500B1 (ko) * 2016-12-07 2020-04-06 엘지전자 주식회사 이동 단말기
CN106714515B (zh) * 2016-12-20 2023-07-25 深圳市欢太科技有限公司 移动终端
JPWO2018147283A1 (ja) * 2017-02-07 2019-07-18 古河電気工業株式会社 ベーパーチャンバ
CN109565114B (zh) * 2017-07-06 2020-08-04 株式会社村田制作所 电子设备
JP6866854B2 (ja) * 2018-01-22 2021-04-28 株式会社オートネットワーク技術研究所 熱輸送部材、熱輸送システム、及び蓄電モジュール
JP6400240B1 (ja) * 2018-02-05 2018-10-03 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
DE102018123707B4 (de) * 2018-09-26 2022-07-07 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Batterieeinrichtung
WO2020100533A1 (ja) * 2018-11-16 2020-05-22 株式会社村田製作所 ベーパーチャンバー
CN113272615B (zh) * 2018-12-26 2023-10-17 株式会社巴川制纸所 温度控制单元及温度控制装置
TWI738179B (zh) 2019-01-18 2021-09-01 李克勤 薄形散熱裝置及其製造方法
JP7132958B2 (ja) * 2020-01-31 2022-09-07 古河電気工業株式会社 ベーパーチャンバ
JP6998979B2 (ja) 2020-01-31 2022-01-18 古河電気工業株式会社 ベーパーチャンバ
EP4097760A1 (en) 2020-03-04 2022-12-07 Transport Phenomena Technologies, LLC Compliant thermal management devices, systems, and methods of fabrication thereof
WO2021186686A1 (ja) * 2020-03-19 2021-09-23 Ｆｃｎｔ株式会社 携帯端末
JP7568430B2 (ja) * 2020-06-30 2024-10-16 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法
WO2022025260A1 (ja) * 2020-07-31 2022-02-03 日本電産株式会社 熱伝導ユニットおよび冷却装置
JP7240470B1 (ja) 2021-10-18 2023-03-15 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール
JP7765355B2 (ja) * 2022-07-04 2025-11-06 Ａｓｔｅｍｏ株式会社 半導体装置

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US5560423A (en) * 1994-07-28 1996-10-01 Aavid Laboratories, Inc. Flexible heat pipe for integrated circuit cooling apparatus
JPH09159381A (ja) 1995-12-13 1997-06-20 Fujikura Ltd ヒートパイプを用いた熱伝達構造
JPH11237193A (ja) * 1998-02-19 1999-08-31 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた実装構造
JP2000065490A (ja) * 1998-08-20 2000-03-03 Furukawa Electric Co Ltd:The 板型ヒートパイプとそれを用いた冷却構造
JP2003322483A (ja) 2002-04-26 2003-11-14 Furukawa Electric Co Ltd:The 板型ヒートパイプおよびその製造方法
JP2004012011A (ja) 2002-06-06 2004-01-15 Furukawa Electric Co Ltd:The 薄型フレキシブルヒートパイプ
JP2004028442A (ja) * 2002-06-25 2004-01-29 Furukawa Electric Co Ltd:The 板型ヒートパイプおよびその実装構造
US7019976B1 (en) * 2003-06-04 2006-03-28 Cisco Technology, Inc. Methods and apparatus for thermally coupling a heat sink to a circuit board component
JP4305644B2 (ja) * 2003-10-30 2009-07-29 大成プラス株式会社 固着機能を有する電子部品の熱保護装置
US20080141872A1 (en) * 2006-12-17 2008-06-19 Jian-Dih Jeng Pressing Method for Sealing Heat Pipe
TW200849295A (en) * 2007-06-15 2008-12-16 Fu-Chia Chang Super-conducting uniform-temperature heat dissipating module
US8069907B2 (en) * 2007-09-13 2011-12-06 3M Innovative Properties Company Flexible heat pipe
JP2009024996A (ja) * 2008-08-21 2009-02-05 Toshiba Home Technology Corp ヒートパイプの製造方

Also Published As

Publication number Publication date
TWI510899B (zh) 2015-12-01
WO2013125427A1 (ja) 2013-08-29
CN204217285U (zh) 2015-03-18
US9565786B2 (en) 2017-02-07
JP2013174376A (ja) 2013-09-05
TW201339814A (zh) 2013-10-01
US20140360701A1 (en) 2014-12-11

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