JP5379589B2 - 真空吸着パッド、搬送アーム及び基板搬送装置 - Google Patents

真空吸着パッド、搬送アーム及び基板搬送装置 Download PDF

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Publication number
JP5379589B2
JP5379589B2 JP2009173195A JP2009173195A JP5379589B2 JP 5379589 B2 JP5379589 B2 JP 5379589B2 JP 2009173195 A JP2009173195 A JP 2009173195A JP 2009173195 A JP2009173195 A JP 2009173195A JP 5379589 B2 JP5379589 B2 JP 5379589B2
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vacuum suction
opening
hole
suction pad
surface portion
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Expired - Fee Related
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JP2009173195A
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Japanese (ja)
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JP2011029388A5 (enrdf_load_stackoverflow
JP2011029388A (ja
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圭祐 近藤
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009173195A 2009-07-24 2009-07-24 真空吸着パッド、搬送アーム及び基板搬送装置 Expired - Fee Related JP5379589B2 (ja)

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JP2009173195A JP5379589B2 (ja) 2009-07-24 2009-07-24 真空吸着パッド、搬送アーム及び基板搬送装置

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JP2009173195A JP5379589B2 (ja) 2009-07-24 2009-07-24 真空吸着パッド、搬送アーム及び基板搬送装置

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JP2011029388A JP2011029388A (ja) 2011-02-10
JP2011029388A5 JP2011029388A5 (enrdf_load_stackoverflow) 2012-11-01
JP5379589B2 true JP5379589B2 (ja) 2013-12-25

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JP2009173195A Expired - Fee Related JP5379589B2 (ja) 2009-07-24 2009-07-24 真空吸着パッド、搬送アーム及び基板搬送装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200001966A (ko) 2018-06-28 2020-01-07 히라따기꼬오 가부시키가이샤 얼라인먼트 장치, 반도체 웨이퍼 처리장치 및 얼라인먼트 방법
JP7586840B2 (ja) 2019-05-16 2024-11-19 コア フロー リミテッド 反ったワークピースのための吸着グリッパ

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5345167B2 (ja) 2011-03-18 2013-11-20 東京エレクトロン株式会社 基板保持装置
JP6224437B2 (ja) 2013-11-26 2017-11-01 東京エレクトロン株式会社 基板搬送装置
JP6032234B2 (ja) 2014-03-19 2016-11-24 信越半導体株式会社 ワーク保持装置
JP6298099B2 (ja) 2016-05-18 2018-03-20 キヤノントッキ株式会社 基板搬送装置
US11315823B2 (en) * 2019-12-27 2022-04-26 Kawasaki Jukogyo Kabushiki Kaisha Substrate suction-holding structure and substrate transfer robot
TW202418470A (zh) 2022-06-06 2024-05-01 日商東京威力科創股份有限公司 載置墊、載置機構及基板搬運機構

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08143147A (ja) * 1994-11-18 1996-06-04 Metsukusu:Kk 薄板状ワークの吸着装置
JP3282787B2 (ja) * 1996-07-29 2002-05-20 東京エレクトロン株式会社 ウエハ搬送機構
JP3782523B2 (ja) * 1996-09-12 2006-06-07 オリンパス株式会社 基板吸着部材および装置
JP3408780B2 (ja) * 2000-06-05 2003-05-19 株式会社しなのエレクトロニクス 真空把持装置及びｉｃテストハンドラ
JP3917528B2 (ja) * 2003-01-07 2007-05-23 エスペック株式会社 吸着パッド
JP2006073946A (ja) * 2004-09-06 2006-03-16 Fuji Mach Mfg Co Ltd ガラス基板供給装置
JP4790395B2 (ja) * 2005-12-02 2011-10-12 オリンパス株式会社 基板吸着機構及び基板検査装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200001966A (ko) 2018-06-28 2020-01-07 히라따기꼬오 가부시키가이샤 얼라인먼트 장치, 반도체 웨이퍼 처리장치 및 얼라인먼트 방법
US11232962B2 (en) 2018-06-28 2022-01-25 Hirata Corporation Alignment device, semiconductor wafer processing device, and alignment method
JP7586840B2 (ja) 2019-05-16 2024-11-19 コア フロー リミテッド 反ったワークピースのための吸着グリッパ
US12327753B2 (en) 2019-05-16 2025-06-10 Core Flow Ltd. Suction gripper for warped workpiece

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JP2011029388A (ja) 2011-02-10

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