JP5375141B2 - 固体撮像装置、固体撮像装置の製造方法、固体撮像装置の駆動方法、及び電子機器 - Google Patents

固体撮像装置、固体撮像装置の製造方法、固体撮像装置の駆動方法、及び電子機器 Download PDF

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Publication number
JP5375141B2
JP5375141B2 JP2009025346A JP2009025346A JP5375141B2 JP 5375141 B2 JP5375141 B2 JP 5375141B2 JP 2009025346 A JP2009025346 A JP 2009025346A JP 2009025346 A JP2009025346 A JP 2009025346A JP 5375141 B2 JP5375141 B2 JP 5375141B2
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Japan
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light receiving
substrate
storage capacitor
light
imaging device
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Expired - Fee Related
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JP2009025346A
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Japanese (ja)
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JP2010182886A (ja
JP2010182886A5 (enExample
Inventor
秀夫 神戸
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Sony Corp
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Sony Corp
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Priority to JP2009025346A priority Critical patent/JP5375141B2/ja
Priority to TW098145313A priority patent/TWI411103B/zh
Priority to KR1020100006789A priority patent/KR20100090197A/ko
Priority to US12/695,316 priority patent/US8614758B2/en
Priority to CN2010101072193A priority patent/CN101924112B/zh
Publication of JP2010182886A publication Critical patent/JP2010182886A/ja
Publication of JP2010182886A5 publication Critical patent/JP2010182886A5/ja
Priority to US14/067,511 priority patent/US8928788B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/151—Geometry or disposition of pixel elements, address lines or gate electrodes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/50—Control of the SSIS exposure
    • H04N25/53—Control of the integration time
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/63—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to dark current
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/73—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors using interline transfer [IT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/153—Two-dimensional or three-dimensional array CCD image sensors
    • H10F39/1534—Interline transfer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/807—Pixel isolation structures

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2009025346A 2009-02-05 2009-02-05 固体撮像装置、固体撮像装置の製造方法、固体撮像装置の駆動方法、及び電子機器 Expired - Fee Related JP5375141B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009025346A JP5375141B2 (ja) 2009-02-05 2009-02-05 固体撮像装置、固体撮像装置の製造方法、固体撮像装置の駆動方法、及び電子機器
TW098145313A TWI411103B (zh) 2009-02-05 2009-12-28 固態成像裝置，固態成像裝置之製造方法，固態成像裝置之驅動方法，及電子設備
KR1020100006789A KR20100090197A (ko) 2009-02-05 2010-01-26 고체 촬상 장치, 고체 촬상 장치의 제조 방법, 고체 촬상 장치의 구동 방법, 및 전자 기기
US12/695,316 US8614758B2 (en) 2009-02-05 2010-01-28 Solid-state imaging device, method for manufacturing the same, method for driving the same, and electronic apparatus
CN2010101072193A CN101924112B (zh) 2009-02-05 2010-01-29 固态图像捕获成像装置、其制造方法、其驱动方法和电子设备
US14/067,511 US8928788B2 (en) 2009-02-05 2013-10-30 Solid-state imaging device, method for manufacturing the same, method for driving the same, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009025346A JP5375141B2 (ja) 2009-02-05 2009-02-05 固体撮像装置、固体撮像装置の製造方法、固体撮像装置の駆動方法、及び電子機器

Publications (3)

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JP2010182886A JP2010182886A (ja) 2010-08-19
JP2010182886A5 JP2010182886A5 (enExample) 2012-03-08
JP5375141B2 true JP5375141B2 (ja) 2013-12-25

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JP2009025346A Expired - Fee Related JP5375141B2 (ja) 2009-02-05 2009-02-05 固体撮像装置、固体撮像装置の製造方法、固体撮像装置の駆動方法、及び電子機器

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US (2) US8614758B2 (enExample)
JP (1) JP5375141B2 (enExample)
KR (1) KR20100090197A (enExample)
CN (1) CN101924112B (enExample)
TW (1) TWI411103B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5375142B2 (ja) * 2009-02-05 2013-12-25 ソニー株式会社 固体撮像装置、固体撮像装置の駆動方法、及び電子機器
JP4785963B2 (ja) 2009-10-09 2011-10-05 キヤノン株式会社 固体撮像装置
JP5312511B2 (ja) * 2011-04-01 2013-10-09 キヤノン株式会社 固体撮像装置
JP5377590B2 (ja) * 2011-07-08 2013-12-25 キヤノン株式会社 固体撮像装置
TWI467751B (zh) 2011-12-12 2015-01-01 Sony Corp A solid-state imaging device, a driving method of a solid-state imaging device, and an electronic device
US9769398B2 (en) * 2016-01-06 2017-09-19 Microsoft Technology Licensing, Llc Image sensor with large-area global shutter contact
CN108257997A (zh) * 2017-12-07 2018-07-06 德淮半导体有限公司 像素单元及其制造方法以及成像装置
CN113948541A (zh) * 2021-10-15 2022-01-18 上海韦尔半导体股份有限公司 一种高量子效率低图像拖尾像素结构与驱动时序控制方法
CN114975498A (zh) * 2022-05-09 2022-08-30 长春长光辰芯光电技术有限公司 一种尺寸可拓展的cmos图像传感器像素及电子设备

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JPH02243073A (ja) 1989-05-31 1990-09-27 Sony Corp 固体撮像装置
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JPH04268764A (ja) * 1991-02-25 1992-09-24 Sony Corp 固体撮像装置
KR0130959B1 (ko) * 1992-06-03 1998-04-14 쓰지 하루오 고체촬상장치 및 그 제조방법
JPH07336604A (ja) 1994-06-03 1995-12-22 Sony Corp 全画素読み出し型ｃｃｄ固体撮像素子とその信号読み出し方法
TW269744B (en) * 1994-08-08 1996-02-01 Matsushita Electron Co Ltd Solid-state imaging device and method of manufacturing the same
JP2565247B2 (ja) * 1995-04-21 1996-12-18 ソニー株式会社 固体撮像装置及びビデオカメラの露光時間制御方法
JPH1013748A (ja) * 1996-06-24 1998-01-16 Sony Corp 固体撮像装置およびその駆動方法、並びに固体撮像装置を用いたカメラ
US6051857A (en) * 1998-01-07 2000-04-18 Innovision, Inc. Solid-state imaging device and method of detecting optical signals using the same
JP4484449B2 (ja) * 2003-05-08 2010-06-16 富士フイルム株式会社 固体撮像装置
KR100761824B1 (ko) * 2004-06-04 2007-09-28 삼성전자주식회사 이미지 센서 및 그 제조 방법
JP4211696B2 (ja) * 2004-06-30 2009-01-21 ソニー株式会社 固体撮像装置の製造方法
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Also Published As

Publication number Publication date
US8928788B2 (en) 2015-01-06
US20100194959A1 (en) 2010-08-05
JP2010182886A (ja) 2010-08-19
CN101924112A (zh) 2010-12-22
CN101924112B (zh) 2013-01-09
US20140049674A1 (en) 2014-02-20
US8614758B2 (en) 2013-12-24
TWI411103B (zh) 2013-10-01
TW201041128A (en) 2010-11-16
KR20100090197A (ko) 2010-08-13

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