JP5371742B2 - セラミック加熱器及びセラミック加熱器に熱電対を固定する方法 - Google Patents
セラミック加熱器及びセラミック加熱器に熱電対を固定する方法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims description 141
- 238000000034 method Methods 0.000 title claims description 28
- 239000000758 substrate Substances 0.000 claims description 98
- 239000000463 material Substances 0.000 claims description 63
- 238000005219 brazing Methods 0.000 claims description 58
- 239000011324 bead Substances 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 28
- 229910045601 alloy Inorganic materials 0.000 claims description 16
- 239000000956 alloy Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229910017945 Cu—Ti Inorganic materials 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 229910001000 nickel titanium Inorganic materials 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 47
- 229910010293 ceramic material Inorganic materials 0.000 description 9
- 239000007769 metal material Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910000809 Alumel Inorganic materials 0.000 description 1
- 229910017398 Au—Ni Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910003310 Ni-Al Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910001179 chromel Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011121 hardwood Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/58—Tubes, sleeves, beads, or bobbins through which the conductor passes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Resistance Heating (AREA)
- Ceramic Products (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Control Of Resistance Heating (AREA)
Description
Claims (21)
- セラミック基板と、
前記セラミック基板に埋め込まれた抵抗発熱体と、
前記セラミック基板の温度を測定するための少なくとも1つの熱電対と
を含み、
前記少なくとも1つの熱電対は、接点を形成する異種金属でできた一対の導電線を有し、前記接点が活性鑞材により前記セラミック基板に直接接合されており、
前記活性鑞材は、前記セラミック基板、前記導電線および前記接点に直接接触し、前記接点は前記活性鑞材に取り囲まれており、
前記活性鑞材が、Au−Cu−Ti合金、Au−Ni−Ti合金及びAu−Ti合金からなる群から選択される、セラミック加熱器。 - 前記セラミック基板が、窒化アルミニウム(AlN)、アルミナ(Al2O3)及び窒化ケイ素(Si3N4)からなる群から選択された材料でできている請求項1に記載されたセラミック加熱器。
- 前記少なくとも1つの熱電対が、K型熱電対、J型熱電対、T型熱電対、R型熱電対、C型熱電対及びB型熱電対からなる群から選択される請求項1に記載されたセラミック加熱器。
- 前記セラミック基板が凹部を有し、該凹部に前記少なくとも1つの熱電対の前記接点が配置される請求項1に記載されたセラミック加熱器。
- 前記セラミック基板の前記凹部が活性鑞材により実質的に充填されている請求項4に記載されたセラミック加熱器。
- 前記少なくとも1つの熱電対が、遠位端部を有する一対の線を含み、前記接点が前記遠位端部の近傍に配置されている請求項1に記載されたセラミック加熱器。
- 前記遠位端部が結合されてビードを形成し、前記ビードが前記セラミック基板に配置された活性鑞材と接触し、それにより前記熱電対を前記セラミック基板に接合している請求項6に記載されたセラミック加熱器。
- 前記一対の線の少なくとも一部が絶縁材により覆われている請求項6に記載されたセラミック加熱器。
- 前記絶縁材が、前記一対の線を覆って配置された一対のセラミック・スリーブを含む請求項8に記載されたセラミック加熱器。
- 少なくとも1つの凹部を有するセラミック基板と、
前記セラミック基板に埋め込まれた抵抗発熱体と、
接点を形成する異種金属でできた一対の導電線を有する少なくとも1つの熱電対であって、前記接点が、前記一対の導電線の遠位端部の近傍に位置付けられ、前記接点が前記凹部に配置された、少なくとも1つの熱電対と、
前記凹部に配置され前記セラミック基板と直接接触する活性鑞材であって、前記少なくとも1つの熱電対の前記接点および導電線と接触している活性鑞材と
を含み、
前記接点は前記活性鑞材に取り囲まれており、
前記活性鑞材が、Au−Cu−Ti合金、Au−Ni−Ti合金及びAu−Ti合金からなる群から選択される、セラミック加熱器。 - 接点を有する一対の線を含む熱電対をセラミック基板に固定する方法において、前記熱電対の前記接点を前記セラミック基板に活性鑞材を使用して直接接合する段階を含み、 前記活性鑞材が、Au−Cu−Ti合金、Au−Ni−Ti合金及びAu−Ti合金からなる群から選択され、
前記活性鑞材を前記セラミック基板の凹部に充填する、熱電対をセラミック基板に固定する方法。 - ペースト状の前記活性鑞材を前記セラミック基板に塗布しと、前記活性鑞材のペースト上に前記熱電対の前記接点を配置する、請求項11に記載された熱電対をセラミック基板に固定する方法。
- 前記熱電対の前記接点の配置された前記活性鑞材を約950℃〜約1080℃の温度に加熱する段階と、約5分〜60分間、前記温度を維持する段階とをさらに含む請求項11に記載された熱電対をセラミック基板に固定する方法。
- 前記加熱する段階を、5×10−6torr未満の真空チャンバ内で実施する請求項13に記載された熱電対をセラミック基板に固定する方法。
- 前記活性鑞材を前記セラミック基板の外部表面に付加する請求項11に記載された熱電対をセラミック基板に固定する方法。
- 前記線を前記線の遠位端部で溶接することによって、前記接点を形成する請求項11に記載された熱電対をセラミック基板に固定する方法。
- 前記直接接合する段階が、前記セラミック基板上に金属化層を形成する段階及び鑞材によって前記接点を前記金属化層に接合する段階を含む請求項11に記載された熱電対をセラミック基板に固定する方法。
- 金属化層を形成する段階が、第1の層を形成するために、Mo、MnO、ガラス・フリット、有機結合剤及び溶媒の混合物を前記セラミック基板に付加する段階、及び第2の層を形成するために、Ni、Cu及びAuからなる群から選択された材料を付加する段階を含む請求項17に記載された熱電対をセラミック基板に固定する方法。
- 金属化層を形成する段階が、前記セラミック基板上にTi層を形成する段階を含む請求項17に記載された熱電対をセラミック基板に固定する方法。
- 一対の線を含む熱電対をセラミック基板に固定する方法において、
前記セラミック基板の表面を洗浄する段階と、
前記セラミック基板の前記表面に活性鑞材を付加する段階と、
前記活性鑞材上に熱電対の接点を配置する段階と、
前記活性鑞材を乾燥させる段階と、
前記活性鑞材を加熱する段階と、
所定時間、前記活性鑞材を所定温度に維持する段階と、
前記活性鑞材を室温まで冷却する段階と
を含み、
前記活性鑞材が、Au−Cu−Ti合金、Au−Ni−Ti合金及びAu−Ti合金からなる群から選択される、熱電対をセラミック基板に固定する方法。 - 前記活性鑞材が、箔及びペーストからなる群から選択された形態である請求項20に記載された熱電対をセラミック基板に固定する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US11/411,579 | 2006-04-26 | ||
US11/411,579 US20070251938A1 (en) | 2006-04-26 | 2006-04-26 | Ceramic heater and method of securing a thermocouple thereto |
PCT/US2007/010157 WO2008054519A2 (en) | 2006-04-26 | 2007-04-25 | Ceramic heater and method of securing a thermocouple thereto |
Publications (2)
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JP2009535291A JP2009535291A (ja) | 2009-10-01 |
JP5371742B2 true JP5371742B2 (ja) | 2013-12-18 |
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JP2009507806A Active JP5371742B2 (ja) | 2006-04-26 | 2007-04-25 | セラミック加熱器及びセラミック加熱器に熱電対を固定する方法 |
Country Status (7)
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US (2) | US20070251938A1 (ja) |
JP (1) | JP5371742B2 (ja) |
KR (1) | KR101486253B1 (ja) |
CN (1) | CN101433125B (ja) |
DE (1) | DE112007000835B4 (ja) |
TW (1) | TWI462629B (ja) |
WO (1) | WO2008054519A2 (ja) |
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2007
- 2007-04-25 DE DE112007000835.0T patent/DE112007000835B4/de active Active
- 2007-04-25 CN CN200780014804.5A patent/CN101433125B/zh active Active
- 2007-04-25 KR KR1020087027997A patent/KR101486253B1/ko active IP Right Grant
- 2007-04-25 WO PCT/US2007/010157 patent/WO2008054519A2/en active Application Filing
- 2007-04-25 JP JP2009507806A patent/JP5371742B2/ja active Active
- 2007-04-25 TW TW096114601A patent/TWI462629B/zh active
-
2008
- 2008-01-08 US US11/970,541 patent/US7832616B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019143067A1 (ko) * | 2018-01-18 | 2019-07-25 | 삼성에스디아이 주식회사 | 열전쌍, 열전쌍의 본딩 툴, 전지 모듈, 열전쌍의 제조 방법, 및 열전쌍의 접합 방법 |
US11223082B2 (en) | 2018-01-18 | 2022-01-11 | Samsung Sdi Co., Ltd. | Thermocouple, bonding tool for thermocouple, battery module, method for manufacturing thermocouple, and method for bonding thermocouple |
Also Published As
Publication number | Publication date |
---|---|
CN101433125B (zh) | 2015-07-08 |
WO2008054519A3 (en) | 2008-07-24 |
DE112007000835T5 (de) | 2009-04-02 |
WO2008054519A2 (en) | 2008-05-08 |
TWI462629B (zh) | 2014-11-21 |
US20070251938A1 (en) | 2007-11-01 |
JP2009535291A (ja) | 2009-10-01 |
KR20090008352A (ko) | 2009-01-21 |
KR101486253B1 (ko) | 2015-01-26 |
US7832616B2 (en) | 2010-11-16 |
CN101433125A (zh) | 2009-05-13 |
US20080110963A1 (en) | 2008-05-15 |
DE112007000835B4 (de) | 2018-07-12 |
TW200746874A (en) | 2007-12-16 |
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