TWI456201B - 無線式熱氣泡式加速儀及其製備方法 - Google Patents

無線式熱氣泡式加速儀及其製備方法 Download PDF

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TWI456201B
TWI456201B TW100143669A TW100143669A TWI456201B TW I456201 B TWI456201 B TW I456201B TW 100143669 A TW100143669 A TW 100143669A TW 100143669 A TW100143669 A TW 100143669A TW I456201 B TWI456201 B TW I456201B
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temperature sensing
layer
sensing elements
thermal bubble
forming
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TW100143669A
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TW201321755A (zh
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Jium Ming Lin
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Univ Chung Hua
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Priority to US13/685,398 priority patent/US9267961B2/en
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Priority to US14/605,568 priority patent/US20150129114A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/006—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of fluid seismic masses
    • G01P15/008—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of fluid seismic masses by using thermal pick-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/487—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using electron radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/56—After-treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)

Claims (27)

  1. 一種無線式熱氣泡式加速儀，包含：一第一絕熱基板；一電路，形成於該第一絕熱基板上；一第一加速度感測裝置，耦接該電路，且包含兩個第一溫度感測元件和設置於該兩個第一溫度感測元件之間之一第一加熱器；以及一第一支撐層，附著於該第一絕熱基板，並支撐該些第一溫度感測元件及該第一加熱器。
  2. 根據請求項1所述之無線式熱氣泡式加速儀，包含兩個電路接點及兩個第一加速度感測裝置，其中位在該兩個第一加速度感測裝置之該些第一加熱器不同側之該些第一溫度感測元件，連接在同一該電路接點。
  3. 根據請求項2所述之無線式熱氣泡式加速儀，包含兩個第二加速度感測裝置，各該第二加速度感測裝置包含兩個第二溫度感測元件，和設置於該兩個第二溫度感測元件之間之一第二加熱器，其中各該第一加速度感測裝置之該第一加熱器，與該些第一溫度感測元件之排列方向，和各該第二加速度感測測裝置之該第二加熱器，與該些第二溫度感測元件之排列方向為垂直。
  4. 根據請求項1所述之無線式熱氣泡式加速儀，其中該第一絕熱基板包含複數個接觸墊，其中該些接觸墊排列在該第一絕熱基板之一邊緣旁，且該兩個第一溫度感測元件，和該第一加熱器連接相應之該些接觸墊。
  5. 根據請求項1所述之無線式熱氣泡式加速儀，更包含： 一插座連接器；複數個端子，設置於該插座連接器，且耦接該電路；一第二絕熱基板；複數個接觸墊，排列在該第二絕熱基板之一邊緣旁，其中當該第二絕熱基板，插置於該插座連接器，該些接觸墊接觸該些端子；以及一第三垂直加速度感測裝置，設置於該第二絕熱基板，該第三加速度感測裝置包含：兩個第三溫度感測元件，耦接相應之該些接觸墊；及一第三加熱器，設置於該兩個第三溫度感測元件之間，與耦接相應之該些接觸墊；及一第二支撐層，附著該第二絕熱基板，並支撐該些第三溫度感測元件及該些第三加熱器。
  6. 根據請求項5所述之無線式熱氣泡式加速儀，包含兩個設置於該第二絕熱基板之第三垂直加速度感測裝置。
  7. 根據請求項1所述之熱氣泡式加速儀，其中該第一支撐層包含氮化矽及二氧化矽。
  8. 根據請求項1所述之無線式熱氣泡式加速儀，其中該絕熱基板之材料為聚噻吩、聚對苯二甲酸乙二酯，或聚醯亞胺。
  9. 根據請求項1所述之無線式熱氣泡式加速儀，其中該第一加熱器之材料包含鎳及鉻。
  10. 根據請求項1所述之無線式熱氣泡式加速儀，更包含一天線，形成於該第一支撐層上。
  11. 根據請求項1所述之無線式熱氣泡式加速儀，其中該第一溫度感測元件包含P型摻雜複晶矽。
  12. 根據請求項1所述之無線式熱氣泡式加速儀，其更包含一封裝蓋子及一惰性氣體，其中該封裝蓋子密封該第一加速度感測裝置，而該惰性氣體在該封裝蓋子內。
  13. 根據請求項1所述之無線式熱氣泡式加速儀，其中該些第一溫度感測元件耦接至一控制及放大器，該控制及放大器可為一減法放大器或一儀表放大器。
  14. 根據請求項1所述之無線式熱氣泡式加速儀，其中各該第一溫度感測元件包含複數個交互串聯之熱電偶。
  15. 根據請求項14所述之無線式熱氣泡式加速儀，其中各該熱電偶包含一正極和一負極，該正極包含克鉻美(Chromel)合金，該負極包含亞鋁美(Alumel)合金。
  16. 根據請求項14所述之無線式熱氣泡式加速儀，其更包含一封裝蓋子，該封裝蓋子密封該第一加速度感測裝置，其中各該熱電堆有一半熱電偶位於該封裝蓋子外，作為環境溫度感測補償器。
  17. 根據請求項1所述之無線式熱氣泡式加速儀，其更包含兩個環境溫度感測補償器，其中該兩個環境溫度感測補償器與該兩個第一溫度感測元件分別形成交互串聯。
  18. 一種多軸向無線式熱氣泡式加速儀之製備方法，包含下列步驟：在一絕熱基板上，形成一支撐層；在該支撐層上，形成兩個溫度感測元件；在該支撐層上與該兩個溫度感測元件之間，形成一加熱器；以及將一插座連接器固定在該絕熱基板上，其中該插座連 接器包含複數個端子。
  19. 根據請求項18所述之製備方法，其更包含下列步驟：在該些溫度感測元件及該加熱器四周，塗佈一圈黏膠層，其中各該溫度感測元件包含複數個交互串聯之熱電偶，各該熱電偶有一半位於該黏膠層之外；以及將一封裝蓋子黏附該黏膠層。
  20. 根據請求項19所述之製備方法，其更包含下列步驟：將該些封裝蓋子之內部抽真空；以及將氬、氪或氙灌入該些封裝蓋子內。
  21. 根據請求項18所述之製備方法，其中在該支撐層上，形成兩個溫度感測元件之步驟，包含下列步驟：以電子槍蒸鍍法，蒸鍍含有P型摻雜及矽等粉末的一混合物，以形成含有P型摻雜一非晶矽層；圖案化該含有P型摻雜之該非晶矽層，以獲得該兩個溫度感測元件；以及以雷射進行退火，使該非晶矽層轉變成含有P型摻雜之該複晶矽層。
  22. 根據請求項18所述之製備方法，其中在一絕熱基板上，形成一支撐層之步驟包含：形成一二氧化矽層於該絕熱基板上；以及形成一氮化矽層於該二氧化矽層上。
  23. 根據請求項18所述之製備方法，其中在該支撐層上，形成兩個溫度感測元件之步驟，包含下列步驟：蒸鍍包含鉻及鎳金屬之一粉末，以形成一克鉻美合金層； 圖案化該克鉻美合金層；蒸鍍包含鎳、鋁、錳及矽之一粉末，以獲得一亞鋁美合金層；以及圖案化該亞鋁美合金層。
  24. 根據請求項18所述之製備方法，其更包含形成兩個環境溫度感測補償器之步驟，其中該兩個環境溫度感測補償器與該兩個溫度感測元件分別形成交互串聯。
  25. 根據請求項18所述之製備方法，其中在該支撐層上，形成兩個溫度感測元件之步驟，包含下列步驟：蒸鍍包含鉻及鎳金屬之一粉末，以形成一克鉻美合金層；圖案化該克鉻美合金層；蒸鍍包含鎳和銅之一粉末，以獲得一康銅合金層；以及圖案化該康銅合金層。
  26. 根據請求項18所述之製備方法，其中在該支撐層上，形成兩個溫度感測元件之步驟，包含下列步驟：蒸鍍一銅粉末，以形成一銅層；圖案化該銅層；蒸鍍包含鎳和銅之一粉末，以獲得一康銅合金層；以及圖案化該康銅合金層。
  27. 根據請求項18所述之製備方法，其中在該支撐層上，形成兩個溫度感測元件之步驟，包含下列步驟：蒸鍍一鐵粉末，以形成一鐵層； 圖案化該鐵層；蒸鍍包含鎳和銅之一粉末，以獲得一康銅合金層；以及圖案化該康銅合金層。
TW100143669A 2011-11-29 2011-11-29 無線式熱氣泡式加速儀及其製備方法 TWI456201B (zh)

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TW100143669A TWI456201B (zh) 2011-11-29 2011-11-29 無線式熱氣泡式加速儀及其製備方法
US13/685,398 US9267961B2 (en) 2011-11-29 2012-11-26 Thermal convection-type accelerometer
US14/605,568 US20150129114A1 (en) 2011-11-29 2015-01-26 Method for manufacturing a multiple-axis thermal convection-type accelerometer

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI456200B (zh) 2012-07-03 2014-10-11 Univ Chung Hua 熱氣泡角加速儀
JP5904910B2 (ja) * 2012-08-31 2016-04-20 ルネサスエレクトロニクス株式会社 加速度検出素子
TWI477779B (zh) * 2013-06-11 2015-03-21 Univ Chung Hua 熱對流式線性加速儀
US10139124B2 (en) * 2017-01-13 2018-11-27 Lennox Industries Inc. Method and apparatus for system diagnostics using accelerometers
US11067322B2 (en) 2019-01-30 2021-07-20 Lennox Industries Inc. Method and apparatus for preventing component malfunction using accelerometers
US11329371B2 (en) * 2019-10-17 2022-05-10 Mediatek Inc. Antenna device including antenna and substrate generated with non-opaque material
CN110579625A (zh) * 2019-10-22 2019-12-17 西安微电子技术研究所 一种耐高温石英挠性加速度计伺服电路及其加工方法
CN111707844B (zh) * 2020-05-29 2022-02-11 上海应用技术大学 一种风速传感器及其制备方法
CN112162112B (zh) * 2020-09-25 2022-10-28 西北工业大学 一种柔性热对流加速度传感器
WO2022159782A1 (en) * 2021-01-22 2022-07-28 Macleon, LLC Optical fiber cable and system and method of distributing ultra high power using the same
US20220316066A1 (en) * 2021-03-31 2022-10-06 Applied Materials, Inc. Level monitoring and active adjustment of a substrate support assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1667382A (zh) * 2004-03-10 2005-09-14 李韫言 热运动传感指示器
US7069785B2 (en) * 2002-11-29 2006-07-04 Lightuning Tech Inc. Thermal bubble type micro inertial sensor
TW200746874A (en) * 2006-04-26 2007-12-16 Watlow Electric Mfg Ceramic heater and method of securing a thermocouple thereto
TW201105972A (en) * 2009-08-14 2011-02-16 Univ Chung Hua Radio frequency identification based thermal bubble type accelerometer
TW201114678A (en) * 2009-10-29 2011-05-01 Univ Chung Hua Radio frequency identification based thermal bubble type accelerometer

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0281606B1 (en) * 1986-09-08 1996-06-12 Commonwealth Scientific And Industrial Research Organisation Stable metal-sheathed thermocouple cable
US5581034A (en) * 1995-01-13 1996-12-03 Remec, Inc. Convective accelerometer and inclinometer
US6182509B1 (en) * 1996-06-26 2001-02-06 Simon Fraser University Accelerometer without proof mass
US5997803A (en) 1998-05-27 1999-12-07 Hoskins Manufacturing Company Thermoelements prepared from powdered alloys and thermocouples made therefrom
GB9819821D0 (en) * 1998-09-12 1998-11-04 Secr Defence Improvements relating to micro-machining
US6795752B1 (en) 2000-11-03 2004-09-21 Memsic, Inc. Thermal convection accelerometer with closed-loop heater control
US7367232B2 (en) * 2004-01-24 2008-05-06 Vladimir Vaganov System and method for a three-axis MEMS accelerometer
JP4975972B2 (ja) 2005-03-15 2012-07-11 日立オートモティブシステムズ株式会社 物理量センサ
US7424826B2 (en) * 2005-11-10 2008-09-16 Memsic, Inc. Single chip tri-axis accelerometer
TWM307828U (en) 2006-08-23 2007-03-11 Inventec Corp Strander for thermal couple wires
EP2065929A4 (en) * 2006-09-06 2011-07-06 Hitachi Metals Ltd SEMICONDUCTOR SENSOR DEVICE AND MANUFACTURING METHOD THEREFOR
KR100823841B1 (ko) * 2006-12-21 2008-04-21 동부일렉트로닉스 주식회사 이미지 센서의 제조 방법
JP5224089B2 (ja) * 2007-06-07 2013-07-03 セイコーＮｐｃ株式会社 熱式センサ
US7862229B2 (en) * 2008-08-22 2011-01-04 Memsic, Inc. Temperature-gradient cancelation technique and device
WO2010101026A1 (ja) * 2009-03-06 2010-09-10 株式会社日立製作所 薄膜圧電弾性波共振器及び高周波フィルタ
TWI428844B (zh) 2009-07-10 2014-03-01 Univ Chung Hua 神經刺激及反應監控之裝置及其系統以及該裝置之製備方法
CN101961528B (zh) 2009-07-24 2013-09-04 中华大学 神经刺激及反应监控的装置及其系统以及装置的制备方法
CN102012437B (zh) 2009-09-08 2013-07-10 中华大学 应用无线射频识别标签技术的热气泡式加速仪及制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7069785B2 (en) * 2002-11-29 2006-07-04 Lightuning Tech Inc. Thermal bubble type micro inertial sensor
CN1667382A (zh) * 2004-03-10 2005-09-14 李韫言 热运动传感指示器
TW200746874A (en) * 2006-04-26 2007-12-16 Watlow Electric Mfg Ceramic heater and method of securing a thermocouple thereto
TW201105972A (en) * 2009-08-14 2011-02-16 Univ Chung Hua Radio frequency identification based thermal bubble type accelerometer
TW201114678A (en) * 2009-10-29 2011-05-01 Univ Chung Hua Radio frequency identification based thermal bubble type accelerometer

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