JP5364514B2 - チャンバ内クリーニング方法 - Google Patents

チャンバ内クリーニング方法 Download PDF

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Publication number
JP5364514B2
JP5364514B2 JP2009203584A JP2009203584A JP5364514B2 JP 5364514 B2 JP5364514 B2 JP 5364514B2 JP 2009203584 A JP2009203584 A JP 2009203584A JP 2009203584 A JP2009203584 A JP 2009203584A JP 5364514 B2 JP5364514 B2 JP 5364514B2
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Japan
Prior art keywords
chamber
gas
deposit
cleaning method
outer peripheral
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Expired - Fee Related
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JP2009203584A
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English (en)
Japanese (ja)
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JP2011054825A (ja
JP2011054825A5 (https=
Inventor
昌伸 本田
秀敏 花岡
太一 平野
高範 三村
学 岩田
武敏 岡城
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2009203584A priority Critical patent/JP5364514B2/ja
Priority to CN201010264380.1A priority patent/CN102013388B/zh
Priority to US12/873,458 priority patent/US8999068B2/en
Priority to KR1020100085685A priority patent/KR101697285B1/ko
Priority to TW099129694A priority patent/TWI525694B/zh
Publication of JP2011054825A publication Critical patent/JP2011054825A/ja
Publication of JP2011054825A5 publication Critical patent/JP2011054825A5/ja
Application granted granted Critical
Publication of JP5364514B2 publication Critical patent/JP5364514B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853—Hygiene
    • H01J37/32862—In situ cleaning of vessels and/or internal parts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Public Health (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009203584A 2009-09-03 2009-09-03 チャンバ内クリーニング方法 Expired - Fee Related JP5364514B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009203584A JP5364514B2 (ja) 2009-09-03 2009-09-03 チャンバ内クリーニング方法
CN201010264380.1A CN102013388B (zh) 2009-09-03 2010-08-20 腔室内清洁方法
US12/873,458 US8999068B2 (en) 2009-09-03 2010-09-01 Chamber cleaning method
KR1020100085685A KR101697285B1 (ko) 2009-09-03 2010-09-01 챔버 내 클리닝 방법
TW099129694A TWI525694B (zh) 2009-09-03 2010-09-02 Chamber cleaning method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009203584A JP5364514B2 (ja) 2009-09-03 2009-09-03 チャンバ内クリーニング方法

Publications (3)

Publication Number Publication Date
JP2011054825A JP2011054825A (ja) 2011-03-17
JP2011054825A5 JP2011054825A5 (https=) 2012-10-18
JP5364514B2 true JP5364514B2 (ja) 2013-12-11

Family

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Family Applications (1)

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JP2009203584A Expired - Fee Related JP5364514B2 (ja) 2009-09-03 2009-09-03 チャンバ内クリーニング方法

Country Status (5)

Country Link
US (1) US8999068B2 (https=)
JP (1) JP5364514B2 (https=)
KR (1) KR101697285B1 (https=)
CN (1) CN102013388B (https=)
TW (1) TWI525694B (https=)

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JP2012204644A (ja) * 2011-03-25 2012-10-22 Tokyo Electron Ltd プラズマ処理装置及びプラズマ処理方法
CN102789960A (zh) * 2011-05-16 2012-11-21 北京北方微电子基地设备工艺研究中心有限责任公司 用于等离子体设备腔室的等离子清洗方法
TWI505400B (zh) * 2011-08-26 2015-10-21 Lg Siltron Inc 基座
CN103785646A (zh) * 2012-10-30 2014-05-14 中微半导体设备(上海)有限公司 反应腔室清洗方法
CN102896129A (zh) * 2012-11-01 2013-01-30 常州捷佳创精密机械有限公司 一种用于太阳能光伏清洗槽的慢提抽风装置
JP6071514B2 (ja) * 2012-12-12 2017-02-01 東京エレクトロン株式会社 静電チャックの改質方法及びプラズマ処理装置
CN103871865B (zh) * 2012-12-18 2016-08-17 中微半导体设备(上海)有限公司 一种清洁等离子体反应腔侧壁的方法
CN104282519B (zh) * 2013-07-12 2016-12-28 中微半导体设备(上海)有限公司 等离子体处理装置的清洁方法
JP2015053384A (ja) * 2013-09-06 2015-03-19 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
JP6422262B2 (ja) * 2013-10-24 2018-11-14 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
JP6273188B2 (ja) * 2013-10-31 2018-01-31 東京エレクトロン株式会社 プラズマ処理方法
JP6284786B2 (ja) * 2014-02-27 2018-02-28 東京エレクトロン株式会社 プラズマ処理装置のクリーニング方法
JP6285213B2 (ja) * 2014-03-03 2018-02-28 東京エレクトロン株式会社 プラズマ処理装置のクリーニング方法
US9824865B2 (en) 2014-03-05 2017-11-21 Lam Research Corporation Waferless clean in dielectric etch process
FR3020641A1 (fr) * 2014-04-30 2015-11-06 Ion Beam Services Dispositif de diffusion de gaz passive
JP6339866B2 (ja) * 2014-06-05 2018-06-06 東京エレクトロン株式会社 プラズマ処理装置およびクリーニング方法
CN104867804B (zh) * 2015-03-30 2017-02-01 上海华力微电子有限公司 晶片刻蚀腔室的清洗方法
CN105590849B (zh) * 2016-02-29 2018-08-28 上海华力微电子有限公司 一种解决hdp psg制程厚度均一性持续跳高的方法
JP6854600B2 (ja) * 2016-07-15 2021-04-07 東京エレクトロン株式会社 プラズマエッチング方法、プラズマエッチング装置、および基板載置台
US10559451B2 (en) * 2017-02-15 2020-02-11 Applied Materials, Inc. Apparatus with concentric pumping for multiple pressure regimes
TWI756424B (zh) * 2017-05-12 2022-03-01 日商東京威力科創股份有限公司 電漿處理裝置之洗淨方法
CN107706076B (zh) * 2017-08-16 2019-04-12 上海华力微电子有限公司 一种改善cmos图像传感器刻蚀腔体金属污染的方法
CN109904054B (zh) * 2017-12-08 2021-08-13 北京北方华创微电子装备有限公司 腔室环境恢复方法及刻蚀方法
JP7055031B2 (ja) 2018-02-16 2022-04-15 東京エレクトロン株式会社 クリーニング方法及びプラズマ処理装置
US20190341275A1 (en) * 2018-05-07 2019-11-07 Lam Research Corporation Edge ring focused deposition during a cleaning process of a processing chamber
CN108847390B (zh) * 2018-06-13 2021-04-02 上海华力微电子有限公司 一种等离子体刻蚀的方法
JP7378276B2 (ja) * 2019-11-12 2023-11-13 東京エレクトロン株式会社 プラズマ処理装置
JP7270863B1 (ja) 2019-11-29 2023-05-10 東京エレクトロン株式会社 プラズマ処理装置における載置台のクリーニング方法およびプラズマ処理装置
JP7229904B2 (ja) 2019-11-29 2023-02-28 東京エレクトロン株式会社 プラズマ処理装置における載置台のクリーニング方法およびプラズマ処理装置
US20210210355A1 (en) * 2020-01-08 2021-07-08 Tokyo Electron Limited Methods of Plasma Processing Using a Pulsed Electron Beam
JP7394668B2 (ja) 2020-03-13 2023-12-08 東京エレクトロン株式会社 温度制御方法およびプラズマ処理装置
TWI771977B (zh) * 2021-04-07 2022-07-21 台灣積體電路製造股份有限公司 沉積室的清潔方法
US11837448B2 (en) 2021-04-27 2023-12-05 Applied Materials, Inc. High-temperature chamber and chamber component cleaning and maintenance method and apparatus
TW202307954A (zh) 2021-05-25 2023-02-16 日商東京威力科創股份有限公司 清潔方法及電漿處理方法

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Also Published As

Publication number Publication date
JP2011054825A (ja) 2011-03-17
TWI525694B (zh) 2016-03-11
US8999068B2 (en) 2015-04-07
US20110048453A1 (en) 2011-03-03
CN102013388B (zh) 2013-09-25
TW201131638A (en) 2011-09-16
KR20110025142A (ko) 2011-03-09
KR101697285B1 (ko) 2017-01-17
CN102013388A (zh) 2011-04-13

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