JP5360179B2 - 半導体用銅合金ボンディングワイヤ - Google Patents
半導体用銅合金ボンディングワイヤ Download PDFInfo
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- JP5360179B2 JP5360179B2 JP2011219314A JP2011219314A JP5360179B2 JP 5360179 B2 JP5360179 B2 JP 5360179B2 JP 2011219314 A JP2011219314 A JP 2011219314A JP 2011219314 A JP2011219314 A JP 2011219314A JP 5360179 B2 JP5360179 B2 JP 5360179B2
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- wire
- copper alloy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/003—Drawing materials of special alloys so far as the composition of the alloy requires or permits special drawing methods or sequences
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/047—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire of fine wires
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
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- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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Description
不良発生までの寿命が500時間以上まで向上する。これは、従来の銅ボンディングワイヤの1.5倍以上の長寿命化に相当する場合もあり、過酷な環境での使用にも対応可能となる。
Claims (3)
- Pdを0.13〜1.15質量%含有し、残部が銅と不可避不純物とでなる銅合金を伸線加工してなることを特徴とする半導体用銅合金ボンディングワイヤ。
- 前記銅合金が、更に、Ag、Auの少なくとも1種を総計で0.0005〜0.07質量%含有することを特徴とする請求項1に記載の半導体用銅合金ボンディングワイヤ。
- 前記銅合金が、更に、Ti:0.0005〜0.01質量%、B:0.0005〜0.007質量%、及びP:0.0005〜0.02質量%の少なくとも1種を総計で0.0005〜0.025質量%含有することを特徴とする請求項1又は2に記載の半導体用銅合金ボンディングワイヤ。
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SG190480A1 (en) * | 2011-12-01 | 2013-06-28 | Heraeus Materials Tech Gmbh | 3n copper wire with trace additions for bonding in microelectronics device |
SG11201403958YA (en) * | 2012-03-22 | 2014-10-30 | Sumitomo Bakelite Co | Semiconductor device and method of manufacturing the same |
TWI486970B (zh) * | 2013-01-29 | 2015-06-01 | Tung Han Chuang | 銅基合金線材及其製造方法 |
EP2930746A1 (en) * | 2013-02-15 | 2015-10-14 | Heraeus Materials Singapore Pte. Ltd. | Copper bond wire and method of making the same |
CN105393352B (zh) * | 2013-05-03 | 2018-11-16 | 贺利氏材料新加坡私人有限公司 | 铜接合导线以及其制造方法 |
US20150262731A1 (en) * | 2014-03-12 | 2015-09-17 | Merry Electronics (Suzhou) Co., Ltd. | Method of making copper-clad graphene conducting wire |
JP6037464B2 (ja) | 2014-05-29 | 2016-12-07 | インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation | 電気機器の寿命を予測する装置及び方法 |
JP6810222B2 (ja) * | 2014-07-11 | 2021-01-06 | ローム株式会社 | 電子装置 |
JP2016028417A (ja) * | 2014-07-11 | 2016-02-25 | ローム株式会社 | 電子装置 |
EP3188222B1 (en) * | 2014-08-29 | 2022-03-16 | Nippon Micrometal Corporation | Cylindrical formed body for cu pillars for semiconductor connection |
JP5807992B1 (ja) * | 2015-02-23 | 2015-11-10 | 田中電子工業株式会社 | ボールボンディング用パラジウム(Pd)被覆銅ワイヤ |
TWI550639B (zh) * | 2015-05-26 | 2016-09-21 | Nippon Micrometal Corp | Connecting wires for semiconductor devices |
CN106489199B (zh) | 2015-06-15 | 2019-09-03 | 日铁新材料股份有限公司 | 半导体装置用接合线 |
CN105161476B (zh) * | 2015-06-19 | 2018-10-30 | 汕头市骏码凯撒有限公司 | 一种用于细间距ic封装的键合铜丝及其制造方法 |
WO2017013796A1 (ja) * | 2015-07-23 | 2017-01-26 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
JP6369994B2 (ja) * | 2015-09-02 | 2018-08-08 | 田中電子工業株式会社 | ボールボンディング用銅合金細線 |
CN105420547B (zh) * | 2015-12-17 | 2017-07-14 | 天津华北集团铜业有限公司 | 一种铜线坯及其生产方法 |
WO2017221434A1 (ja) | 2016-06-20 | 2017-12-28 | 日鉄住金マイクロメタル株式会社 | 半導体装置用ボンディングワイヤ |
CN106222483A (zh) * | 2016-08-29 | 2016-12-14 | 芜湖楚江合金铜材有限公司 | 一种高耐磨铜线材及其加工工艺 |
CN108122877B (zh) * | 2017-12-21 | 2020-10-13 | 汕头市骏码凯撒有限公司 | 薄金铜合金线及其制造方法 |
CN108823463A (zh) * | 2018-06-30 | 2018-11-16 | 汕头市骏码凯撒有限公司 | 一种铜合金键合丝及其制造方法 |
JP6507329B1 (ja) * | 2019-02-08 | 2019-04-24 | 田中電子工業株式会社 | パラジウム被覆銅ボンディングワイヤ、ワイヤ接合構造、半導体装置及び半導体装置の製造方法 |
EP4071256A4 (en) * | 2019-12-02 | 2023-11-29 | Nippon Micrometal Corporation | COPPER CONNECTION WIRE OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE |
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KR101055957B1 (ko) * | 2007-12-03 | 2011-08-09 | 가부시키가이샤 닛데쓰 마이크로 메탈 | 반도체 장치용 본딩 와이어 |
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CN106119595A (zh) | 2016-11-16 |
EP2447380B1 (en) | 2015-02-25 |
KR101704839B1 (ko) | 2017-02-08 |
US20120094121A1 (en) | 2012-04-19 |
KR20120031005A (ko) | 2012-03-29 |
JP2012084878A (ja) | 2012-04-26 |
CN102459668A (zh) | 2012-05-16 |
SG177358A1 (en) | 2012-02-28 |
TW201107499A (en) | 2011-03-01 |
WO2010150814A1 (ja) | 2010-12-29 |
EP2447380A1 (en) | 2012-05-02 |
US9427830B2 (en) | 2016-08-30 |
EP2447380A4 (en) | 2012-12-05 |
TWI496900B (zh) | 2015-08-21 |
JP4866490B2 (ja) | 2012-02-01 |
JP5246314B2 (ja) | 2013-07-24 |
JP2012074706A (ja) | 2012-04-12 |
JPWO2010150814A1 (ja) | 2012-12-10 |
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