JP5353192B2 - 蛍光体、及びその製造方法 - Google Patents
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- JP5353192B2 JP5353192B2 JP2008287814A JP2008287814A JP5353192B2 JP 5353192 B2 JP5353192 B2 JP 5353192B2 JP 2008287814 A JP2008287814 A JP 2008287814A JP 2008287814 A JP2008287814 A JP 2008287814A JP 5353192 B2 JP5353192 B2 JP 5353192B2
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- 229910052720 vanadium Inorganic materials 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
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JP2010260957A (ja) * | 2009-05-07 | 2010-11-18 | Mitsubishi Chemicals Corp | 蛍光体及び蛍光体の製造方法、並びに、蛍光体含有組成物、発光装置、照明装置及び画像表示装置 |
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JP4725008B2 (ja) * | 2003-09-11 | 2011-07-13 | 日亜化学工業株式会社 | 発光装置、発光素子用蛍光体および発光素子用蛍光体の製造方法 |
JP2007113019A (ja) * | 2004-02-18 | 2007-05-10 | National Institute For Materials Science | 蛍光体の製造方法 |
JP4760082B2 (ja) * | 2005-03-25 | 2011-08-31 | 日亜化学工業株式会社 | 発光装置、発光素子用蛍光体及びその製造方法 |
JP5036975B2 (ja) * | 2005-03-31 | 2012-09-26 | Dowaホールディングス株式会社 | 窒素を含有する蛍光体およびその製造方法、並びに発光装置 |
JP5326182B2 (ja) * | 2005-10-07 | 2013-10-30 | 日亜化学工業株式会社 | 発光装置、発光素子用蛍光体及びその製造方法 |
JP4971630B2 (ja) * | 2005-12-21 | 2012-07-11 | Dowaホールディングス株式会社 | 蛍光体およびその製造方法、並びに発光装置 |
JP2007291352A (ja) * | 2006-03-27 | 2007-11-08 | Mitsubishi Chemicals Corp | 蛍光体及びそれを使用した発光装置 |
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