JP5349189B2 - 電子部品装置の製造方法及び治具 - Google Patents

電子部品装置の製造方法及び治具 Download PDF

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Publication number
JP5349189B2
JP5349189B2 JP2009175830A JP2009175830A JP5349189B2 JP 5349189 B2 JP5349189 B2 JP 5349189B2 JP 2009175830 A JP2009175830 A JP 2009175830A JP 2009175830 A JP2009175830 A JP 2009175830A JP 5349189 B2 JP5349189 B2 JP 5349189B2
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JP
Japan
Prior art keywords
electronic component
laminated member
sealing resin
mounted body
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009175830A
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English (en)
Japanese (ja)
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JP2011029516A (ja
JP2011029516A5 (https=
Inventor
淳 大井
孝 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2009175830A priority Critical patent/JP5349189B2/ja
Publication of JP2011029516A publication Critical patent/JP2011029516A/ja
Publication of JP2011029516A5 publication Critical patent/JP2011029516A5/ja
Application granted granted Critical
Publication of JP5349189B2 publication Critical patent/JP5349189B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wire Bonding (AREA)
JP2009175830A 2009-07-28 2009-07-28 電子部品装置の製造方法及び治具 Expired - Fee Related JP5349189B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009175830A JP5349189B2 (ja) 2009-07-28 2009-07-28 電子部品装置の製造方法及び治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009175830A JP5349189B2 (ja) 2009-07-28 2009-07-28 電子部品装置の製造方法及び治具

Publications (3)

Publication Number Publication Date
JP2011029516A JP2011029516A (ja) 2011-02-10
JP2011029516A5 JP2011029516A5 (https=) 2012-07-12
JP5349189B2 true JP5349189B2 (ja) 2013-11-20

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ID=43637895

Family Applications (1)

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JP2009175830A Expired - Fee Related JP5349189B2 (ja) 2009-07-28 2009-07-28 電子部品装置の製造方法及び治具

Country Status (1)

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JP (1) JP5349189B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12057425B2 (en) 2021-05-17 2024-08-06 Samsung Electronics Co., Ltd. Semiconductor package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102117726B1 (ko) * 2012-06-29 2020-06-01 토레이 엔지니어링 컴퍼니, 리미티드 압착 장치 및 압착 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0270436U (https=) * 1988-11-18 1990-05-29
JP3611463B2 (ja) * 1998-10-27 2005-01-19 松下電器産業株式会社 電子部品の製造方法
JP2000286302A (ja) * 1999-03-31 2000-10-13 Towa Corp 半導体チップ組立方法及び組立装置
JP2001237268A (ja) * 2000-02-22 2001-08-31 Nec Corp 半導体素子の実装方法及び製造装置
JP2002280401A (ja) * 2001-03-21 2002-09-27 Mitsubishi Electric Corp 半導体装置およびその製造方法
JP3896017B2 (ja) * 2001-08-03 2007-03-22 松下電器産業株式会社 半導体実装体の製造方法、および半導体実装体の製造装置
JP3835556B2 (ja) * 2003-10-27 2006-10-18 セイコーエプソン株式会社 半導体装置の製造方法及び半導体装置の製造装置
JP5104149B2 (ja) * 2007-09-14 2012-12-19 富士通株式会社 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12057425B2 (en) 2021-05-17 2024-08-06 Samsung Electronics Co., Ltd. Semiconductor package

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