JP5331004B2 - インク組成物 - Google Patents

インク組成物 Download PDF

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Publication number
JP5331004B2
JP5331004B2 JP2009534281A JP2009534281A JP5331004B2 JP 5331004 B2 JP5331004 B2 JP 5331004B2 JP 2009534281 A JP2009534281 A JP 2009534281A JP 2009534281 A JP2009534281 A JP 2009534281A JP 5331004 B2 JP5331004 B2 JP 5331004B2
Authority
JP
Japan
Prior art keywords
ink composition
printing
imide oligomer
water
thermosetting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009534281A
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English (en)
Japanese (ja)
Other versions
JPWO2009041299A1 (ja
Inventor
裕靖 稲垣
教之 川西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Manac Inc
Original Assignee
Manac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Manac Inc filed Critical Manac Inc
Priority to JP2009534281A priority Critical patent/JP5331004B2/ja
Publication of JPWO2009041299A1 publication Critical patent/JPWO2009041299A1/ja
Application granted granted Critical
Publication of JP5331004B2 publication Critical patent/JP5331004B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676Single layer compositions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/102Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/30Inkjet printing inks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Epoxy Resins (AREA)
JP2009534281A 2007-09-27 2008-09-12 インク組成物 Expired - Fee Related JP5331004B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009534281A JP5331004B2 (ja) 2007-09-27 2008-09-12 インク組成物

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007251637 2007-09-27
JP2007251637 2007-09-27
JP2009534281A JP5331004B2 (ja) 2007-09-27 2008-09-12 インク組成物
PCT/JP2008/066549 WO2009041299A1 (ja) 2007-09-27 2008-09-12 インク組成物

Publications (2)

Publication Number Publication Date
JPWO2009041299A1 JPWO2009041299A1 (ja) 2011-01-27
JP5331004B2 true JP5331004B2 (ja) 2013-10-30

Family

ID=40511186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009534281A Expired - Fee Related JP5331004B2 (ja) 2007-09-27 2008-09-12 インク組成物

Country Status (4)

Country Link
JP (1) JP5331004B2 (zh)
CN (1) CN101796147B (zh)
TW (1) TWI518147B (zh)
WO (1) WO2009041299A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101440976B1 (ko) 2012-05-31 2014-09-18 주식회사 엘지화학 잉크젯용 잉크 조성물, 이를 이용한 식각 마스크, 절연막 및 그 제조방법
CN103275614B (zh) * 2013-05-30 2015-08-05 苏州艾特斯环保材料有限公司 一种含有聚酰亚胺改性有机硅树脂的耐高温防腐涂料
CN110229158B (zh) * 2019-05-31 2022-06-07 西北工业大学 低熔体粘度、适用于rtm成型的热固性聚酰亚胺前驱体及制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119071A (ja) * 1989-10-02 1991-05-21 Chisso Corp 印刷用インキ組成物
JPH05301960A (ja) * 1992-04-27 1993-11-16 Kanegafuchi Chem Ind Co Ltd 熱硬化性オリゴマー及びその製造方法
JPH09328549A (ja) * 1996-06-12 1997-12-22 Central Glass Co Ltd ポリイミド組成物
JPH11172181A (ja) * 1997-12-10 1999-06-29 Toshiba Chem Corp 印刷用インキ組成物
JP2007137960A (ja) * 2005-11-16 2007-06-07 Amt Kenkyusho:Kk ビスイミド又はビスイソイミド化合物及びそれを含む樹脂組成物
JP2007246556A (ja) * 2006-03-13 2007-09-27 Fujifilm Corp インクジェット用油性インク、及びインクジェット記録方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10101795A (ja) * 1996-07-18 1998-04-21 Reitetsuku Kk ポリイミド類の製法、組成物およびその製品
WO2008044308A1 (fr) * 2006-10-13 2008-04-17 Manac Inc. Carte de circuit et processus de production de cette carte

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03119071A (ja) * 1989-10-02 1991-05-21 Chisso Corp 印刷用インキ組成物
JPH05301960A (ja) * 1992-04-27 1993-11-16 Kanegafuchi Chem Ind Co Ltd 熱硬化性オリゴマー及びその製造方法
JPH09328549A (ja) * 1996-06-12 1997-12-22 Central Glass Co Ltd ポリイミド組成物
JPH11172181A (ja) * 1997-12-10 1999-06-29 Toshiba Chem Corp 印刷用インキ組成物
JP2007137960A (ja) * 2005-11-16 2007-06-07 Amt Kenkyusho:Kk ビスイミド又はビスイソイミド化合物及びそれを含む樹脂組成物
JP2007246556A (ja) * 2006-03-13 2007-09-27 Fujifilm Corp インクジェット用油性インク、及びインクジェット記録方法

Also Published As

Publication number Publication date
TWI518147B (zh) 2016-01-21
JPWO2009041299A1 (ja) 2011-01-27
CN101796147A (zh) 2010-08-04
WO2009041299A1 (ja) 2009-04-02
CN101796147B (zh) 2012-09-05
TW200918616A (en) 2009-05-01

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