JP5306646B2 - 錫表面の耐食性の向上 - Google Patents
錫表面の耐食性の向上 Download PDFInfo
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- JP5306646B2 JP5306646B2 JP2007515573A JP2007515573A JP5306646B2 JP 5306646 B2 JP5306646 B2 JP 5306646B2 JP 2007515573 A JP2007515573 A JP 2007515573A JP 2007515573 A JP2007515573 A JP 2007515573A JP 5306646 B2 JP5306646 B2 JP 5306646B2
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- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
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Description
本発明は、錫を基材とする表面の腐食を抑制するための方法および組成物、ならびに該表面の腐食の抑制およびはんだ付け性の向上に関するものである。
錫を基材とするコーティングはしばしば、銅もしくはニッケルを基材とする表面の酸化もしくは変色の防止および/またははんだ付け性の向上のため、電気コネクタ、工学的、機能的および装飾的デバイスの表面などの銅およびニッケルを基材とする半製品(workpiece)の表面に適用される。空気またはその他の酸化性雰囲気において温度が上昇するような条件下では、電子部品パッケージのリードおよび電気コネクタの錫で被膜した表面は、製造と電子デバイスへの組立ての間の出荷および保管の期間中に酸化物の膜を形成する傾向を有する。酸化物のコーティングは、一般的にわずか約500〜2000nm(約50〜200オングストローム(Å))の厚さであるが、錫で被膜した表面の表面を変色させ、多くの消費者が受け入れられないと考える黄色がかった色を呈する。さらに酸化物は、被膜した電気端子の接触抵抗を劣化させる可能性がある。変色のない表面は、酸化物で被膜した表面に比べ、より低い電気接触抵抗およびより良好なはんだづけ性を有する。
従って、本発明の目的の一つは、錫を基材とする表面の耐食性の付与およびはんだ付け性の向上のための方法および組成物を提供することである。
それゆえ、簡単には、本発明は、錫を基材とする表面にホスホン酸化合物および水を含む組成物を接触させ、錫を基材とするコーティング上に燐を基材とする膜を形成し、それにより錫を基材とする表面の腐食を抑制することからなる、半製品の、錫を基材とする表面の耐食性を向上させる方法を指向する。
本発明の他の目的および特徴が開示される。
図1は、封止された電子部品のための本発明により形成されたリードの断面である。
図2は、電子部品パッケージの斜視図である。
図3は、リード・フレームの正面図である。
図4は、電気コネクタの斜視図である。
図5および図6は、実施例において論じた試験片の写真である。
図7は、実施例の試験データのグラフ表示である。
図1〜4は、概略図であり、正確な縮尺で描かれていない。
対応する参照数字はどの図でも対応する部分を示す。
1つの態様において、発明は、半製品の、錫を基材とする表面の耐食性を向上させる方法を対象とする。例示の目的のため、このような1つの半製品は、封止された電子パッケージの電子リードなどの電子部品または電気コネクタであるが、本発明は、工学的、機能的、装飾的またはその他の電子機器のいずれの一部であるかを問わず、錫を基材とする表面に適用することができる。電子機器の錫を基材とする表面に関し、本方法は、錫を基材とする表面の一部のリフローを伴うはんだ付け作業前の保管中、錫を主原料とする表面の耐食性を向上させ、かつはんだ付け性も維持する。
代替的な実施態様において、組成物は、有機溶剤を本質的に含まない。この実施態様は、ホスホン酸化合物および水を含む。好都合なことに、有機溶剤を除去することにより、取扱い、労働者への危険および流水への廃棄物の処分ならびに費用など該に対する懸念は払拭される。
本発明は、はるかに少ない水を含む濃縮液も対象とし、それは使用前に希釈される。
これらの図は概略図であり、種々の個別の層は、正確な縮尺で描かれていない。
本発明の一層の詳細は、以下の実施例で説明される。
A − 1.2重量/容量%のオクチルホスホン酸、22容量%のエタノール
AA − 1.6重量/容量%のオクチルホスホン酸、0.2容量%のエタノール
AAA − 1.6重量/容量%のオクチルホスホン酸、0%のエタノール
11 錫または錫合金コーティング
13 リード
14 電子パッケージ
Claims (10)
- 錫を基材とする半製品表面を、ホスホン酸化合物を主成分として含有してなる組成物と接触させ、前記表面上に燐を基材とするフィルムを形成してなる、錫を基材とする半製品表面の腐食を抑制する方法において、
前記組成物として、下記の構造式(式中、Rは炭化水素基又は置換炭化水素基を表わす)で表わされるホスホン酸化合物0.01〜10重量/容量%、5容量%未満の濃度のアルコール及び水を含有してなる組成物を用いると共に、
前記組成物を錫を基材とする半製品表面と接触させるに当たり、当該組成物の温度を20〜45℃の範囲に維持しつつ、前記表面と1〜60秒間暴露させることを特徴とする錫を基材とする半製品表面の腐食を抑制する方法。
- 前記ホスホン酸化合物が、一般式CH 3 (CH 2 ) n P(O) (OH) 2 (式中、n=5〜17)で表されることを特徴とする請求項1に記載の方法。
- 前記ホスホン酸化合物がオクチルホスホン酸であることを特徴とする請求項1に記載の方法。
- 前記ホスホン酸化合物が、デシルホスホン酸、ビニルホスホン酸、およびカルボン酸部分を含むホスホン酸化合物からなる群から選択されることを特徴とする請求項1に記載の方法。
- 前記ホスホン酸化合物が二官能性の分子を包含することを特徴とする請求項1に記載の方法。
- 錫を基材とする電子部品半製品表面を、ホスホン酸化合物を主成分として含有してなる組成物と接触させ、前記表面上に燐を基材とするフィルムを形成することにより、錫を基材とする電子部品半製品表面の腐食を抑制し、該表面の一部のリフローを伴うはんだ付け作業前の保管の間も該表面のはんだ付け性を保持せしめる方法において、
前記組成物として、下記の構造式(式中、Rは炭化水素基又は置換炭化水素基を表わす)で表わされるホスホン酸化合物0.01〜10重量/容量%、5容量%未満の濃度のアルコール及び水を含有してなる組成物を用いると共に、
前記組成物を錫を基材とする電子部品半製品表面と接触させるに当たり、当該組成物の温度を20〜45℃の範囲に維持しつつ、前記表面と1〜60秒間暴露させることを特徴とする錫を基材とする電子部品半製品表面の腐食を抑制し、はんだ付け性を保持せしめる方法。
- 前記ホスホン酸化合物が、一般式CH 3 (CH 2 ) n P(O) (OH) 2 (式中、n=5〜17)で表されることを特徴とする請求項6に記載の方法。
- 前記ホスホン酸化合物がオクチルホスホン酸であることを特徴とする請求項6に記載の方法。
- 前記ホスホン酸化合物が、デシルホスホン酸、ビニルホスホン酸、およびカルボン酸部分を含むホスホン酸化合物からなる群から選択されることを特徴とする請求項6に記載の方法。
- 前記ホスホン酸化合物が二官能性の分子を包含することを特徴とする請求項6に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/860,678 US20050268991A1 (en) | 2004-06-03 | 2004-06-03 | Corrosion resistance enhancement of tin surfaces |
US10/860,678 | 2004-06-03 | ||
PCT/US2005/019395 WO2005121405A1 (en) | 2004-06-03 | 2005-06-02 | Corrosion resistance enhancement of tin surfaces |
Publications (2)
Publication Number | Publication Date |
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JP2008501861A JP2008501861A (ja) | 2008-01-24 |
JP5306646B2 true JP5306646B2 (ja) | 2013-10-02 |
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JP2007515573A Active JP5306646B2 (ja) | 2004-06-03 | 2005-06-02 | 錫表面の耐食性の向上 |
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US (1) | US20050268991A1 (ja) |
EP (1) | EP1771603B1 (ja) |
JP (1) | JP5306646B2 (ja) |
CN (1) | CN101001980B (ja) |
TW (1) | TWI409362B (ja) |
WO (1) | WO2005121405A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0507887D0 (en) * | 2005-04-20 | 2005-05-25 | Rohm & Haas Elect Mat | Immersion method |
US7883738B2 (en) * | 2007-04-18 | 2011-02-08 | Enthone Inc. | Metallic surface enhancement |
EP2014798B1 (en) * | 2007-07-10 | 2016-04-13 | ATOTECH Deutschland GmbH | Solution and process for increasing the solderability and corrosion resistance of metal or metal alloy surface |
WO2010081833A2 (en) | 2009-01-14 | 2010-07-22 | Atotech Deutschland Gmbh | Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface |
WO2012147716A1 (ja) * | 2011-04-28 | 2012-11-01 | セントラル硝子株式会社 | 撥水性保護膜形成用薬液及びこれを用いたウェハの洗浄方法 |
JP2013237906A (ja) * | 2012-05-16 | 2013-11-28 | Toyota Motor Corp | 金属の表面処理剤、及び酸化防止被膜 |
CN103668147B (zh) * | 2012-09-26 | 2018-03-23 | 广州天至环保科技有限公司 | 一种能提高锡及其合金镀层综合性能的无铬水性保护剂 |
CN108315789A (zh) * | 2018-03-01 | 2018-07-24 | 深圳市盛元半导体有限公司 | 一种铜基镀锡耐高温保护剂 |
DE102019120051A1 (de) | 2019-07-24 | 2021-01-28 | Infineon Technologies Ag | Package mit selektivem Korrosionsschutz einer elektrischen Verbindungsstruktur |
CN110753457A (zh) * | 2019-11-05 | 2020-02-04 | 江苏上达电子有限公司 | 一种提高cof化锡后保存寿命的方法 |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL128296C (ja) * | 1959-11-18 | |||
NL274316A (ja) * | 1961-02-08 | |||
BE621988A (ja) * | 1961-08-31 | |||
US3630790A (en) * | 1969-05-13 | 1971-12-28 | Dow Chemical Co | Method of protection of metal surfaces from corrosion |
GB1418966A (en) * | 1973-10-06 | 1975-12-24 | Ciba Geigy Ag | Treatment of steel with organic phosphonic or phosphonous acids |
US4188438A (en) * | 1975-06-02 | 1980-02-12 | National Semiconductor Corporation | Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices |
US4153482A (en) * | 1977-11-15 | 1979-05-08 | Chevron Research Company | Process for soldering using a phosphorus-containing liquid flux |
US4452650A (en) * | 1980-01-11 | 1984-06-05 | Olin Corporation | Copper and copper alloy coating |
US4582556A (en) * | 1982-11-22 | 1986-04-15 | Olin Corporation | Adhesion primers for encapsulating epoxies |
US4521469A (en) * | 1982-11-22 | 1985-06-04 | Olin Corporation | Casing for electronic components |
US4441118A (en) * | 1983-01-13 | 1984-04-03 | Olin Corporation | Composite copper nickel alloys with improved solderability shelf life |
US4785137A (en) * | 1984-04-30 | 1988-11-15 | Allied Corporation | Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices |
FR2572422B1 (fr) * | 1984-10-31 | 1993-03-05 | Produits Ind Cie Fse | Bain d'activation et d'affinage perfectionne pour procede de phosphatation au zinc et concentre correspondant |
AT385932B (de) * | 1985-12-13 | 1988-06-10 | Neumayer Karl | Band- bzw. drahtfoermiges material |
DE3751260T2 (de) * | 1987-04-23 | 1995-10-12 | Sumitomo Electric Industries | Mit keramik beschichtete verbindungseinheit. |
US5126210A (en) * | 1989-08-23 | 1992-06-30 | Aluminum Company Of America | Anodic phosphonic/phosphinic acid duplex coating on valve metal surface |
US5103550A (en) * | 1989-12-26 | 1992-04-14 | Aluminum Company Of America | Method of making a food or beverage container |
US5520959A (en) * | 1990-01-10 | 1996-05-28 | Henkel Corporation | Surface-treatment method for tin-plated drawn and ironed cans |
DE4005836C2 (de) * | 1990-02-23 | 1999-10-28 | Stolberger Metallwerke Gmbh | Elektrisches Steckverbinderpaar |
US5370909A (en) * | 1990-06-19 | 1994-12-06 | Henkel Corporation | Liquid composition and process for treating aluminum or tin cans to impart corrosion resistance and mobility thereto |
US5075258A (en) * | 1990-07-31 | 1991-12-24 | Motorola, Inc. | Method for plating tab leads in an assembled semiconductor package |
US5178916A (en) * | 1991-06-21 | 1993-01-12 | At&T Bell Laboratories | Process for making corrosion-resistant articles |
US5297721A (en) * | 1992-11-19 | 1994-03-29 | Fry's Metals, Inc. | No-clean soldering flux and method using the same |
US5463804A (en) * | 1994-08-31 | 1995-11-07 | Aluminum Company Of America | Coating aluminum alloy sheet to promote adhesive bonding for vehicle assemblies |
DE19510825A1 (de) * | 1995-03-24 | 1996-09-26 | Henkel Kgaa | Korrosionsschützender Reiniger für verzinnten Stahl |
WO1997018905A1 (en) * | 1995-11-20 | 1997-05-29 | Berg Technology, Inc. | Method of providing corrosion protection |
US5916695A (en) * | 1995-12-18 | 1999-06-29 | Olin Corporation | Tin coated electrical connector |
DK12497A (da) * | 1996-02-12 | 1997-08-13 | Ciba Geigy Ag | Korrisionsinhiberende overtrækssammensætninger til metaller |
US5762523A (en) * | 1996-03-27 | 1998-06-09 | Berg Technology, Inc. | Device for mounting an electrical connector on a printed circuit board |
US5849424A (en) * | 1996-05-15 | 1998-12-15 | Dowa Mining Co., Ltd. | Hard coated copper alloys, process for production thereof and connector terminals made therefrom |
JPH1046385A (ja) * | 1996-08-02 | 1998-02-17 | Daiwa Kasei Kenkyusho:Kk | 電気・電子回路部品 |
GB9725898D0 (en) * | 1997-12-08 | 1998-02-04 | Albright & Wilson | Process for treating metal surfaces |
US6183886B1 (en) * | 1998-04-03 | 2001-02-06 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
US6136460A (en) * | 1998-04-03 | 2000-10-24 | Olin Corporation | Tin coatings incorporating selected elemental additions to reduce discoloration |
US6139977A (en) * | 1998-06-10 | 2000-10-31 | Lucent Technologies Inc. | Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings |
CA2336186A1 (en) * | 1998-06-19 | 1999-12-23 | Raymond J. Colbert | Method for inhibiting stains on aluminum product surfaces |
KR100392528B1 (ko) * | 1998-09-11 | 2003-07-23 | 닛코 킨조쿠 가부시키가이샤 | 금속재료, 금속재료의 제조방법 및 금속재료를 이용한 단자 및 커넥터 |
US6171138B1 (en) * | 2000-01-28 | 2001-01-09 | Motorola, Inc. | Electrical connector for removable components |
JP2001279491A (ja) * | 2000-03-28 | 2001-10-10 | Matsushita Electric Works Ltd | 封孔処理剤 |
DE10025107A1 (de) * | 2000-05-20 | 2001-11-22 | Stolberger Metallwerke Gmbh | Elektrisch leifähiges Metallband und Steckverbinder |
DE10051486A1 (de) * | 2000-10-17 | 2002-04-25 | Henkel Kgaa | Haftvermittler für Lacke und Klebstoffe auf Metallen |
JP4270768B2 (ja) * | 2000-11-08 | 2009-06-03 | Jfeスチール株式会社 | 錫めっき鋼板及び化成処理液 |
TW463424B (en) * | 2000-12-05 | 2001-11-11 | Hon Hai Prec Ind Co Ltd | Method for producing electrical connector |
JP3537417B2 (ja) * | 2001-12-25 | 2004-06-14 | 株式会社東芝 | 半導体装置およびその製造方法 |
US6982030B2 (en) * | 2002-11-27 | 2006-01-03 | Technic, Inc. | Reduction of surface oxidation during electroplating |
-
2004
- 2004-06-03 US US10/860,678 patent/US20050268991A1/en not_active Abandoned
-
2005
- 2005-06-02 TW TW094118181A patent/TWI409362B/zh active
- 2005-06-02 CN CN2005800259655A patent/CN101001980B/zh active Active
- 2005-06-02 EP EP05757748.8A patent/EP1771603B1/en active Active
- 2005-06-02 JP JP2007515573A patent/JP5306646B2/ja active Active
- 2005-06-02 WO PCT/US2005/019395 patent/WO2005121405A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US20050268991A1 (en) | 2005-12-08 |
WO2005121405A1 (en) | 2005-12-22 |
EP1771603A1 (en) | 2007-04-11 |
EP1771603B1 (en) | 2015-05-06 |
CN101001980B (zh) | 2011-06-15 |
CN101001980A (zh) | 2007-07-18 |
TWI409362B (zh) | 2013-09-21 |
JP2008501861A (ja) | 2008-01-24 |
TW200610838A (en) | 2006-04-01 |
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