JP5305787B2 - 電子部品パッケージの製造方法 - Google Patents
電子部品パッケージの製造方法 Download PDFInfo
- Publication number
- JP5305787B2 JP5305787B2 JP2008218427A JP2008218427A JP5305787B2 JP 5305787 B2 JP5305787 B2 JP 5305787B2 JP 2008218427 A JP2008218427 A JP 2008218427A JP 2008218427 A JP2008218427 A JP 2008218427A JP 5305787 B2 JP5305787 B2 JP 5305787B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive member
- electronic component
- base material
- metal film
- component package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 40
- 239000000463 material Substances 0.000 claims description 36
- 239000011521 glass Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 9
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 238000005304 joining Methods 0.000 claims description 3
- 229910000833 kovar Inorganic materials 0.000 claims description 3
- 239000002923 metal particle Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 229910000599 Cr alloy Inorganic materials 0.000 claims 1
- 239000000788 chromium alloy Substances 0.000 claims 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 claims 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000013078 crystal Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- 229910000510 noble metal Inorganic materials 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 239000002241 glass-ceramic Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052741 iridium Inorganic materials 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 2
- 229910052762 osmium Inorganic materials 0.000 description 2
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
電子部品を載置するガラス製のベース材と、このベース材に被せるキャップ材と、ベース材に搭載させた電子部品並びにベース材の搭載した部品とは反対側に設けた外部電極を電気的に接続する導電部材とから構成し、ベース材と導電部材とを溶着された状態で研磨した後に、導電部材と電子部品を電気的に接続する接続部を形成し、外部電極側の導電部材表面に金属膜を設ける電子部品パッケージを提供する。このようにすることで、溶着時に生成した酸化膜を取り除いた後に、導電部材表面に酸化膜の成長を防ぐことができるため、電子部品と外部電極との導通を確保できる。
10 ベース材
20 導電部材
21 切削された導電部材
22 導電確保された導電部材
30 接続部
40 電子部品
50 キャップ材
60 金属膜
61 スパッタ膜
62 めっき膜
63 金属微粒子を焼成して得られる金属膜
70 外部電極
80 低融点ガラス
90 酸化膜
100 電子部品パッケージ
110 ベース部材
120 金属ピン
130 電極
140 電子部品
150 封止材
160 キャップ部材
170 低融点ガラス
180 酸化膜
Claims (3)
- ベース材に貫通孔を形成する工程と、
前記貫通孔に低融点ガラスを塗布し、導電部材を挿入して溶着する工程と、
前記ベース材から突出した前記導電部材の頭部分を含めて前記ベース材を薄く研磨して前記導電部材の頭部分を覆う絶縁膜を削除する工程と、
前記導電部材を、回路パターンを含む接続部を介して電子部品と電気的に接続する工程と、
凹状に加工したキャップ材を前記ベース材と接合する工程と、
前記導電部材の前記接続部を形成した反対側の表面に金属膜を形成する工程と、
前記金属膜を介して、前記導電部材と外部電極とを電気的に接続する工程と、
からなる、電子部品パッケージの製造方法。 - 前記導電部材は、鉄-ニッケル合金、コバール合金、鉄-ニッケル-クロム合金のいずれかであり、前記金属膜はニッケル置換型の無電解めっきを用いて製造する請求項1記載の電子部品パッケージの製造方法。
- 前記金属膜は金属微粒子を焼成する方法で製造する請求項1記載の電子部品パッケージの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008218427A JP5305787B2 (ja) | 2008-08-27 | 2008-08-27 | 電子部品パッケージの製造方法 |
TW98128501A TW201025689A (en) | 2008-08-27 | 2009-08-25 | Electronic-parts package and manufacturing method therefor |
CN200910173021.2A CN101674061B (zh) | 2008-08-27 | 2009-08-26 | 电子零件封装及用于该封装的制造方法 |
US12/547,917 US8256107B2 (en) | 2008-08-27 | 2009-08-26 | Method of manufacturing electronic-parts package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008218427A JP5305787B2 (ja) | 2008-08-27 | 2008-08-27 | 電子部品パッケージの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010056232A JP2010056232A (ja) | 2010-03-11 |
JP5305787B2 true JP5305787B2 (ja) | 2013-10-02 |
Family
ID=41725184
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008218427A Expired - Fee Related JP5305787B2 (ja) | 2008-08-27 | 2008-08-27 | 電子部品パッケージの製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8256107B2 (ja) |
JP (1) | JP5305787B2 (ja) |
CN (1) | CN101674061B (ja) |
TW (1) | TW201025689A (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5642436B2 (ja) * | 2010-07-01 | 2014-12-17 | セイコーインスツル株式会社 | 電子デバイス、電子機器及び電子デバイスの製造方法 |
JP5432077B2 (ja) * | 2010-07-08 | 2014-03-05 | セイコーインスツル株式会社 | 貫通電極付きガラス基板の製造方法及び電子部品の製造方法 |
JP5466102B2 (ja) * | 2010-07-08 | 2014-04-09 | セイコーインスツル株式会社 | 貫通電極付きガラス基板の製造方法及び電子部品の製造方法 |
JP2012029166A (ja) * | 2010-07-26 | 2012-02-09 | Seiko Instruments Inc | パッケージ、パッケージの製造方法、圧電振動子、発振器 |
JP5603166B2 (ja) * | 2010-08-23 | 2014-10-08 | セイコーインスツル株式会社 | 電子デバイス、電子機器及び電子デバイスの製造方法 |
US9006958B2 (en) * | 2011-08-31 | 2015-04-14 | Kyocera Crystal Device Corporation | Piezoelectric device |
US20130155629A1 (en) * | 2011-12-19 | 2013-06-20 | Tong Hsing Electronic Industries, Ltd. | Hermetic Semiconductor Package Structure and Method for Manufacturing the same |
JP5798932B2 (ja) * | 2012-01-10 | 2015-10-21 | セイコーインスツル株式会社 | 電子部品パッケージの製造方法 |
JP5939801B2 (ja) * | 2012-01-10 | 2016-06-22 | セイコーインスツル株式会社 | 電子部品パッケージの製造方法 |
JP6247006B2 (ja) * | 2013-01-23 | 2017-12-13 | セイコーインスツル株式会社 | 電子デバイス、発振器及び電子デバイスの製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
JPH11302034A (ja) | 1998-04-21 | 1999-11-02 | Nec Kansai Ltd | ガラス−セラミック複合体およびそれを用いたフラットパッケージ型圧電部品 |
JP2002084159A (ja) * | 2000-09-06 | 2002-03-22 | Daishinku Corp | 表面実装型圧電振動子 |
JP4030285B2 (ja) * | 2001-10-10 | 2008-01-09 | 株式会社トクヤマ | 基板及びその製造方法 |
JP2003209198A (ja) * | 2001-11-09 | 2003-07-25 | Nippon Sheet Glass Co Ltd | 電子部品パッケージ |
CN2562352Y (zh) * | 2002-06-19 | 2003-07-23 | 亚洲电子光科技股份有限公司 | 电子零件封装座 |
JP4699704B2 (ja) * | 2003-03-18 | 2011-06-15 | 日本特殊陶業株式会社 | 配線基板 |
JP2005130371A (ja) * | 2003-10-27 | 2005-05-19 | Seiko Epson Corp | 圧電デバイス用パッケージおよび圧電デバイス |
JP4349622B2 (ja) * | 2004-03-03 | 2009-10-21 | エヌイーシー ショット コンポーネンツ株式会社 | 薄型金属パッケージの製造方法 |
JP2006156435A (ja) * | 2004-11-25 | 2006-06-15 | Shinko Electric Ind Co Ltd | 配線基板の製造方法 |
JP2007228443A (ja) * | 2006-02-25 | 2007-09-06 | Seiko Instruments Inc | 電子部品及びその製造方法、圧電デバイス及びその製造方法、電波時計並びに電子機器 |
JP2007250805A (ja) * | 2006-03-16 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 表面実装型気密端子 |
JP4793099B2 (ja) * | 2006-05-31 | 2011-10-12 | 日立電線株式会社 | 光モジュール |
-
2008
- 2008-08-27 JP JP2008218427A patent/JP5305787B2/ja not_active Expired - Fee Related
-
2009
- 2009-08-25 TW TW98128501A patent/TW201025689A/zh unknown
- 2009-08-26 US US12/547,917 patent/US8256107B2/en not_active Expired - Fee Related
- 2009-08-26 CN CN200910173021.2A patent/CN101674061B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8256107B2 (en) | 2012-09-04 |
JP2010056232A (ja) | 2010-03-11 |
CN101674061A (zh) | 2010-03-17 |
TW201025689A (en) | 2010-07-01 |
CN101674061B (zh) | 2015-09-30 |
US20100053918A1 (en) | 2010-03-04 |
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