JP5298347B2 - プリント配線基板及びその製造方法 - Google Patents
プリント配線基板及びその製造方法 Download PDFInfo
- Publication number
- JP5298347B2 JP5298347B2 JP2009119404A JP2009119404A JP5298347B2 JP 5298347 B2 JP5298347 B2 JP 5298347B2 JP 2009119404 A JP2009119404 A JP 2009119404A JP 2009119404 A JP2009119404 A JP 2009119404A JP 5298347 B2 JP5298347 B2 JP 5298347B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- conductor pattern
- manufacturing
- substrate body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims description 58
- 238000005530 etching Methods 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 abstract description 2
- 239000004642 Polyimide Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 239000011810 insulating material Substances 0.000 abstract description 2
- -1 polyethylene terephthalate Polymers 0.000 abstract description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 2
- 239000005020 polyethylene terephthalate Substances 0.000 abstract description 2
- 229920001721 polyimide Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000012545 processing Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000007261 regionalization Effects 0.000 description 3
- 230000008961 swelling Effects 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Description
10 基板本体
12 導体層
14 導体パターン
16 レジスト層
18 カバー絶縁層
Claims (3)
- 基板本体上の回路を形成する導体パターンの上面と両側面とが交わる両縁がR状に形成され、前記導体パターンの側面の上面から3μm下方の第1位置及び前記上面から5μm下方の第2位置を通る斜め直線と、前記上面の延長線との交点が、前記上面のR状の開始位置と1μm以上離れており、前記基板本体と前記導体パターンの上層に絶縁層と接着層を有するカバーレイが形成されていることを特徴とするプリント配線基板。
- 請求項1記載のプリント配線基板を製造するプリント配線基板の製造方法であって、基板本体上の回路を形成する導体パターンをエッチング液に曝すことによって、前記導体パターンの上面と両側面とが交わる両縁をR状に形成する工程を備えたことを特徴とするプリント配線基板の製造方法。
- 前記導体パターンは、サブトラクティブ法によって形成されることを特徴とする請求項2記載のプリント配線基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009119404A JP5298347B2 (ja) | 2009-05-18 | 2009-05-18 | プリント配線基板及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009119404A JP5298347B2 (ja) | 2009-05-18 | 2009-05-18 | プリント配線基板及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010267891A JP2010267891A (ja) | 2010-11-25 |
JP5298347B2 true JP5298347B2 (ja) | 2013-09-25 |
Family
ID=43364600
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009119404A Active JP5298347B2 (ja) | 2009-05-18 | 2009-05-18 | プリント配線基板及びその製造方法 |
Country Status (1)
Country | Link |
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JP (1) | JP5298347B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI542264B (zh) * | 2010-12-24 | 2016-07-11 | Lg伊諾特股份有限公司 | 印刷電路板及其製造方法 |
JP7323268B2 (ja) * | 2018-03-16 | 2023-08-08 | 日東電工株式会社 | 磁性配線回路基板およびその製造方法 |
JP7334558B2 (ja) * | 2019-09-25 | 2023-08-29 | 株式会社村田製作所 | インダクタ部品 |
EP4317532A1 (en) | 2021-03-25 | 2024-02-07 | Namics Corporation | Method for manufacturing laminate |
WO2022201563A1 (ja) | 2021-03-25 | 2022-09-29 | ナミックス株式会社 | 配線基板用積層体 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6147692A (ja) * | 1984-08-15 | 1986-03-08 | 株式会社日立製作所 | プリント回路板の製造方法 |
JPS62248286A (ja) * | 1986-04-21 | 1987-10-29 | 株式会社フジクラ | フレキシブルプリント配線基板 |
JP2001060745A (ja) * | 1999-08-19 | 2001-03-06 | Aisan Ind Co Ltd | 電子回路基板 |
JP2003243806A (ja) * | 2002-02-21 | 2003-08-29 | Nippon Mektron Ltd | 回路基板 |
JP2004172182A (ja) * | 2002-11-18 | 2004-06-17 | Denki Kagaku Kogyo Kk | 回路基板及びその製造方法 |
JP4391223B2 (ja) * | 2003-12-24 | 2009-12-24 | 古河電気工業株式会社 | プリント配線板の製造方法 |
JP4676411B2 (ja) * | 2006-10-12 | 2011-04-27 | 古河電気工業株式会社 | プリント配線板の製造方法 |
JP5051355B2 (ja) * | 2007-04-06 | 2012-10-17 | 日立電線株式会社 | プリント配線基板の製造方法 |
-
2009
- 2009-05-18 JP JP2009119404A patent/JP5298347B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2010267891A (ja) | 2010-11-25 |
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