JP4961749B2 - 半導体実装基板の製造方法 - Google Patents
半導体実装基板の製造方法 Download PDFInfo
- Publication number
- JP4961749B2 JP4961749B2 JP2006006914A JP2006006914A JP4961749B2 JP 4961749 B2 JP4961749 B2 JP 4961749B2 JP 2006006914 A JP2006006914 A JP 2006006914A JP 2006006914 A JP2006006914 A JP 2006006914A JP 4961749 B2 JP4961749 B2 JP 4961749B2
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- JP
- Japan
- Prior art keywords
- resist
- film
- photosensitive resist
- carrier film
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
2 導体層
3a、3b レジストパターン
4a、4b 金属回路パターン
5 感光性レジスト
6 キャリアフィルム
7 マスク
8 レジストパターン
9 金属回路パターン
Claims (2)
- 絶縁性基材上に導体層を有する複合材料の導体層上に断面形状が矩形形状のレジストパターンを形成し、そのレジストパターンの間に断面形状が矩形形状の金属回路パターンをめっきにより形成する半導体実装基板の製造方法であって、キャリアフィルムとカバーフィルムの間に吸光度が0.25〜0.45の範囲である感光性レジストを挟んだレジストフィルムを用い、該レジストフィルムからカバーフィルムを剥離して感光性レジストを前記導体層上に積層した後、更にキャリアフィルムを剥離して感光性レジストの表面を空気中に1〜100秒間暴露させ、その後直ちに紫外線によりキャリアフィルムを剥離せずに露光する場合に比べ1.05〜2.0倍の露光量で投影露光し、現像して断面形状が矩形形状のレジストパターンを得ることを特徴とする半導体実装基板の製造方法。
- 前記投影露光の終了から現像までの間、感光性レジストの表面上に再びキャリアフィルムを貼り付けることを特徴とする、請求項1に記載の半導体実装基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006006914A JP4961749B2 (ja) | 2006-01-16 | 2006-01-16 | 半導体実装基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006006914A JP4961749B2 (ja) | 2006-01-16 | 2006-01-16 | 半導体実装基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007189114A JP2007189114A (ja) | 2007-07-26 |
JP4961749B2 true JP4961749B2 (ja) | 2012-06-27 |
Family
ID=38344057
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2006006914A Active JP4961749B2 (ja) | 2006-01-16 | 2006-01-16 | 半導体実装基板の製造方法 |
Country Status (1)
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JP (1) | JP4961749B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114615811A (zh) * | 2020-12-07 | 2022-06-10 | 深南电路股份有限公司 | 一种高精密线路的加工方法及高精密线路板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05243217A (ja) * | 1992-02-28 | 1993-09-21 | Nec Corp | 半導体装置の製造方法 |
JPH0715113A (ja) * | 1993-06-24 | 1995-01-17 | Hitachi Ltd | プリント配線パターン形成方法 |
JPH08271714A (ja) * | 1995-03-31 | 1996-10-18 | Toppan Printing Co Ltd | カラーフィルターの製造方法 |
JP4262917B2 (ja) * | 2001-06-13 | 2009-05-13 | 旭化成エレクトロニクス株式会社 | 感光性樹脂層への露光方法 |
JP4136494B2 (ja) * | 2002-06-28 | 2008-08-20 | 旭化成ケミカルズ株式会社 | シームレススリーブ樹脂版のコーティング方法及び装置 |
JP2005221739A (ja) * | 2004-02-05 | 2005-08-18 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、フォトレジストパターンの製造法及びプリント配線板の製造法 |
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2006
- 2006-01-16 JP JP2006006914A patent/JP4961749B2/ja active Active
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Publication number | Publication date |
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JP2007189114A (ja) | 2007-07-26 |
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