JP5296085B2 - 熱伝導性ポリマーコンポジットおよびこれを利用した成形品 - Google Patents

熱伝導性ポリマーコンポジットおよびこれを利用した成形品 Download PDF

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Publication number
JP5296085B2
JP5296085B2 JP2010530911A JP2010530911A JP5296085B2 JP 5296085 B2 JP5296085 B2 JP 5296085B2 JP 2010530911 A JP2010530911 A JP 2010530911A JP 2010530911 A JP2010530911 A JP 2010530911A JP 5296085 B2 JP5296085 B2 JP 5296085B2
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JP
Japan
Prior art keywords
thermally conductive
filler
polymer composite
melting point
volume
Prior art date
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Expired - Fee Related
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JP2010530911A
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English (en)
Japanese (ja)
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JP2011500935A (ja
JP2011500935A5 (enExample
Inventor
ジュン キム，スン
ミン ホン，チャン
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Cheil Industries Inc
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Cheil Industries Inc
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Publication of JP2011500935A5 publication Critical patent/JP2011500935A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/041—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with metal fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2010530911A 2007-10-23 2007-12-31 熱伝導性ポリマーコンポジットおよびこれを利用した成形品 Expired - Fee Related JP5296085B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020070106602A KR100963673B1 (ko) 2007-10-23 2007-10-23 열전도성 수지 복합재 및 이를 이용한 성형품
KR10-2007-0106602 2007-10-23
PCT/KR2007/007010 WO2009054567A1 (en) 2007-10-23 2007-12-31 Thermal conductive polymer composite and article using the same

Publications (3)

Publication Number Publication Date
JP2011500935A JP2011500935A (ja) 2011-01-06
JP2011500935A5 JP2011500935A5 (enExample) 2011-02-17
JP5296085B2 true JP5296085B2 (ja) 2013-09-25

Family

ID=40579659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010530911A Expired - Fee Related JP5296085B2 (ja) 2007-10-23 2007-12-31 熱伝導性ポリマーコンポジットおよびこれを利用した成形品

Country Status (7)

Country Link
US (1) US20100204380A1 (enExample)
EP (1) EP2203524A4 (enExample)
JP (1) JP5296085B2 (enExample)
KR (1) KR100963673B1 (enExample)
CN (1) CN101827894A (enExample)
TW (1) TWI388656B (enExample)
WO (1) WO2009054567A1 (enExample)

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KR20120114048A (ko) 2011-04-06 2012-10-16 삼성정밀화학 주식회사 열전도성 고분자 복합소재 및 이를 포함하는 물품
KR101298739B1 (ko) * 2011-11-15 2013-08-26 한국화학연구원 형태가 다른 2종의 열전도성 필러를 포함하는 고분자 조성물 및 이의 제조방법
KR101380841B1 (ko) * 2012-04-19 2014-04-04 한국화학연구원 열전도성 및 내열성을 갖는 고분자 조성물의 성형품 제조방법 및 이에 의해 제조되는 열전도성 및 내열성을 갖는 고분자 조성물의 성형품
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US20150221578A1 (en) * 2014-02-05 2015-08-06 Infineon Technologies Ag Semiconductor package and method for producing a semiconductor
FR3034775B1 (fr) 2015-04-13 2018-09-28 Hutchinson Materiau pour le stockage thermique
FR3034771B1 (fr) 2015-04-13 2019-04-19 Hutchinson Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation
CN104893289A (zh) * 2015-05-25 2015-09-09 牡丹江师范学院 一种高导电率和高导磁的新型材料
CN105038716B (zh) * 2015-07-03 2018-11-16 中国科学院理化技术研究所 一种各向异性导热材料及其制备方法
KR101709686B1 (ko) 2015-09-23 2017-02-24 이석 방열구조체용 탄소계 재료의 제조방법 및 이를 이용한 방열구조체의 제조방법
CN105801076B (zh) * 2016-02-15 2017-11-10 云南科威液态金属谷研发有限公司 一种内掺低熔点合金的导电水泥及其制备方法
WO2020234481A1 (en) * 2019-05-21 2020-11-26 Sabic Global Technologies B.V. Shaped object comprising polyester and aluminium
FR3104589B1 (fr) * 2019-12-13 2022-03-25 Irt Antoine De Saint Exupery Procédé de préparation d’un matériau composite électriquement conducteur et matériau composite électriquement conducteur obtenu par un tel procédé
CN111423697A (zh) * 2020-04-09 2020-07-17 宁国中奕橡塑有限公司 一种导热性能优异的热固性复合材料及其制备方法
CN113684006A (zh) * 2021-07-29 2021-11-23 东南大学 固液两相金属-高分子导热相变复合材料的制备方法

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Also Published As

Publication number Publication date
TW200925257A (en) 2009-06-16
US20100204380A1 (en) 2010-08-12
KR20090041081A (ko) 2009-04-28
WO2009054567A1 (en) 2009-04-30
CN101827894A (zh) 2010-09-08
JP2011500935A (ja) 2011-01-06
EP2203524A1 (en) 2010-07-07
KR100963673B1 (ko) 2010-06-15
EP2203524A4 (en) 2011-04-06
TWI388656B (zh) 2013-03-11

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