TWI388656B - 熱導性聚合物組成物以及使用該組成物的物件 - Google Patents

熱導性聚合物組成物以及使用該組成物的物件 Download PDF

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Publication number
TWI388656B
TWI388656B TW097140677A TW97140677A TWI388656B TW I388656 B TWI388656 B TW I388656B TW 097140677 A TW097140677 A TW 097140677A TW 97140677 A TW97140677 A TW 97140677A TW I388656 B TWI388656 B TW I388656B
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TW
Taiwan
Prior art keywords
thermally conductive
polymer composition
conductive polymer
metal
filler
Prior art date
Application number
TW097140677A
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English (en)
Chinese (zh)
Other versions
TW200925257A (en
Inventor
金成俊
洪彰敏
Original Assignee
第一毛織股份有限公司
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Publication of TW200925257A publication Critical patent/TW200925257A/zh
Application granted granted Critical
Publication of TWI388656B publication Critical patent/TWI388656B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/041—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with metal fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/04—Polysulfides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW097140677A 2007-10-23 2008-10-23 熱導性聚合物組成物以及使用該組成物的物件 TWI388656B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070106602A KR100963673B1 (ko) 2007-10-23 2007-10-23 열전도성 수지 복합재 및 이를 이용한 성형품

Publications (2)

Publication Number Publication Date
TW200925257A TW200925257A (en) 2009-06-16
TWI388656B true TWI388656B (zh) 2013-03-11

Family

ID=40579659

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097140677A TWI388656B (zh) 2007-10-23 2008-10-23 熱導性聚合物組成物以及使用該組成物的物件

Country Status (7)

Country Link
US (1) US20100204380A1 (enExample)
EP (1) EP2203524A4 (enExample)
JP (1) JP5296085B2 (enExample)
KR (1) KR100963673B1 (enExample)
CN (1) CN101827894A (enExample)
TW (1) TWI388656B (enExample)
WO (1) WO2009054567A1 (enExample)

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KR101298739B1 (ko) * 2011-11-15 2013-08-26 한국화학연구원 형태가 다른 2종의 열전도성 필러를 포함하는 고분자 조성물 및 이의 제조방법
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CN105801076B (zh) * 2016-02-15 2017-11-10 云南科威液态金属谷研发有限公司 一种内掺低熔点合金的导电水泥及其制备方法
WO2020234481A1 (en) * 2019-05-21 2020-11-26 Sabic Global Technologies B.V. Shaped object comprising polyester and aluminium
FR3104589B1 (fr) * 2019-12-13 2022-03-25 Irt Antoine De Saint Exupery Procédé de préparation d’un matériau composite électriquement conducteur et matériau composite électriquement conducteur obtenu par un tel procédé
CN111423697A (zh) * 2020-04-09 2020-07-17 宁国中奕橡塑有限公司 一种导热性能优异的热固性复合材料及其制备方法
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Also Published As

Publication number Publication date
TW200925257A (en) 2009-06-16
JP5296085B2 (ja) 2013-09-25
US20100204380A1 (en) 2010-08-12
KR20090041081A (ko) 2009-04-28
WO2009054567A1 (en) 2009-04-30
CN101827894A (zh) 2010-09-08
JP2011500935A (ja) 2011-01-06
EP2203524A1 (en) 2010-07-07
KR100963673B1 (ko) 2010-06-15
EP2203524A4 (en) 2011-04-06

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