JP2011500935A5 - - Google Patents
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- Publication number
- JP2011500935A5 JP2011500935A5 JP2010530911A JP2010530911A JP2011500935A5 JP 2011500935 A5 JP2011500935 A5 JP 2011500935A5 JP 2010530911 A JP2010530911 A JP 2010530911A JP 2010530911 A JP2010530911 A JP 2010530911A JP 2011500935 A5 JP2011500935 A5 JP 2011500935A5
- Authority
- JP
- Japan
- Prior art keywords
- polymer composite
- metal
- metal filler
- composite according
- volume
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims 17
- 239000002184 metal Substances 0.000 claims 16
- 239000002131 composite material Substances 0.000 claims 11
- 229920000642 polymer Polymers 0.000 claims 10
- 239000000945 filler Substances 0.000 claims 9
- -1 polyethylene terephthalate Polymers 0.000 claims 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 230000008018 melting Effects 0.000 claims 3
- 238000002844 melting Methods 0.000 claims 3
- 239000002952 polymeric resin Substances 0.000 claims 3
- 229920003002 synthetic resin Polymers 0.000 claims 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 2
- 229930040373 Paraformaldehyde Natural products 0.000 claims 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 claims 2
- 239000004698 Polyethylene Substances 0.000 claims 2
- 239000004734 Polyphenylene sulfide Substances 0.000 claims 2
- 239000004743 Polypropylene Substances 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229920010524 Syndiotactic polystyrene Polymers 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- 229920002530 polyetherether ketone Polymers 0.000 claims 2
- 229920000573 polyethylene Polymers 0.000 claims 2
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims 2
- 229920006324 polyoxymethylene Polymers 0.000 claims 2
- 229920000069 polyphenylene sulfide Polymers 0.000 claims 2
- 229920001155 polypropylene Polymers 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000006104 solid solution Substances 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- MUBKMWFYVHYZAI-UHFFFAOYSA-N [Al].[Cu].[Zn] Chemical compound [Al].[Cu].[Zn] MUBKMWFYVHYZAI-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 229920001940 conductive polymer Polymers 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000011733 molybdenum Substances 0.000 claims 1
- 229910052750 molybdenum Inorganic materials 0.000 claims 1
- 229920001748 polybutylene Polymers 0.000 claims 1
- 239000010935 stainless steel Substances 0.000 claims 1
- 229910001220 stainless steel Inorganic materials 0.000 claims 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070106602A KR100963673B1 (ko) | 2007-10-23 | 2007-10-23 | 열전도성 수지 복합재 및 이를 이용한 성형품 |
| KR10-2007-0106602 | 2007-10-23 | ||
| PCT/KR2007/007010 WO2009054567A1 (en) | 2007-10-23 | 2007-12-31 | Thermal conductive polymer composite and article using the same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011500935A JP2011500935A (ja) | 2011-01-06 |
| JP2011500935A5 true JP2011500935A5 (enExample) | 2011-02-17 |
| JP5296085B2 JP5296085B2 (ja) | 2013-09-25 |
Family
ID=40579659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010530911A Expired - Fee Related JP5296085B2 (ja) | 2007-10-23 | 2007-12-31 | 熱伝導性ポリマーコンポジットおよびこれを利用した成形品 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100204380A1 (enExample) |
| EP (1) | EP2203524A4 (enExample) |
| JP (1) | JP5296085B2 (enExample) |
| KR (1) | KR100963673B1 (enExample) |
| CN (1) | CN101827894A (enExample) |
| TW (1) | TWI388656B (enExample) |
| WO (1) | WO2009054567A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20210130285A1 (en) | 2008-03-19 | 2021-05-06 | Aurimmed Pharma, Inc. | Novel compounds advantageous in the treatment of central nervous system diseases and disorders |
| US10793515B2 (en) | 2008-03-19 | 2020-10-06 | Aurimmed Pharma, Inc. | Compounds advantageous in the treatment of central nervous system diseases and disorders |
| KR101257693B1 (ko) * | 2008-11-05 | 2013-04-24 | 제일모직주식회사 | 전기절연성 고열전도성 수지 조성물 |
| KR101297156B1 (ko) | 2008-12-10 | 2013-08-21 | 제일모직주식회사 | 고성능 emi/rfi 차폐용 수지 복합재 |
| JP5814688B2 (ja) * | 2010-08-31 | 2015-11-17 | 三木ポリマー株式会社 | 熱伝導性樹脂組成物およびそれを含む放熱材 |
| KR20120114048A (ko) | 2011-04-06 | 2012-10-16 | 삼성정밀화학 주식회사 | 열전도성 고분자 복합소재 및 이를 포함하는 물품 |
| KR101298739B1 (ko) * | 2011-11-15 | 2013-08-26 | 한국화학연구원 | 형태가 다른 2종의 열전도성 필러를 포함하는 고분자 조성물 및 이의 제조방법 |
| KR101380841B1 (ko) * | 2012-04-19 | 2014-04-04 | 한국화학연구원 | 열전도성 및 내열성을 갖는 고분자 조성물의 성형품 제조방법 및 이에 의해 제조되는 열전도성 및 내열성을 갖는 고분자 조성물의 성형품 |
| JP6037263B2 (ja) * | 2012-06-08 | 2016-12-07 | 国立研究開発法人産業技術総合研究所 | 無機有機複合組成物 |
| KR101917257B1 (ko) * | 2013-04-12 | 2018-11-09 | 차이나 페트로리움 앤드 케미컬 코포레이션 | 폴리머/충전제/금속 복합 섬유 및 이의 제조 방법 |
| US20150221578A1 (en) * | 2014-02-05 | 2015-08-06 | Infineon Technologies Ag | Semiconductor package and method for producing a semiconductor |
| FR3034775B1 (fr) | 2015-04-13 | 2018-09-28 | Hutchinson | Materiau pour le stockage thermique |
| FR3034771B1 (fr) | 2015-04-13 | 2019-04-19 | Hutchinson | Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation |
| CN104893289A (zh) * | 2015-05-25 | 2015-09-09 | 牡丹江师范学院 | 一种高导电率和高导磁的新型材料 |
| CN105038716B (zh) * | 2015-07-03 | 2018-11-16 | 中国科学院理化技术研究所 | 一种各向异性导热材料及其制备方法 |
| KR101709686B1 (ko) | 2015-09-23 | 2017-02-24 | 이석 | 방열구조체용 탄소계 재료의 제조방법 및 이를 이용한 방열구조체의 제조방법 |
| CN105801076B (zh) * | 2016-02-15 | 2017-11-10 | 云南科威液态金属谷研发有限公司 | 一种内掺低熔点合金的导电水泥及其制备方法 |
| WO2020234481A1 (en) * | 2019-05-21 | 2020-11-26 | Sabic Global Technologies B.V. | Shaped object comprising polyester and aluminium |
| FR3104589B1 (fr) * | 2019-12-13 | 2022-03-25 | Irt Antoine De Saint Exupery | Procédé de préparation d’un matériau composite électriquement conducteur et matériau composite électriquement conducteur obtenu par un tel procédé |
| CN111423697A (zh) * | 2020-04-09 | 2020-07-17 | 宁国中奕橡塑有限公司 | 一种导热性能优异的热固性复合材料及其制备方法 |
| CN113684006A (zh) * | 2021-07-29 | 2021-11-23 | 东南大学 | 固液两相金属-高分子导热相变复合材料的制备方法 |
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| JPS58127743A (ja) * | 1982-01-25 | 1983-07-29 | Aron Kasei Co Ltd | 熱可塑性樹脂組成物 |
| US4610808A (en) * | 1982-07-19 | 1986-09-09 | Mitech Corporation | Conductive resinous composites |
| KR880011821A (ko) * | 1987-03-09 | 1988-10-31 | 오오자와 히데오 | 도전성 수지 조성물 및 그 성형품 |
| US5011872A (en) * | 1987-12-21 | 1991-04-30 | The Carborudum Company | Thermally conductive ceramic/polymer composites |
| CA1334479C (en) * | 1988-08-29 | 1995-02-21 | Minoru Yoshinaka | Conductive composition and method for making the same |
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| JP3525071B2 (ja) * | 1998-03-10 | 2004-05-10 | 株式会社東郷製作所 | 導電性樹脂組成物 |
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| KR101372345B1 (ko) * | 2006-06-30 | 2014-03-12 | 도레이 카부시키가이샤 | 열가소성 수지 조성물 및 그 성형품 |
| FR2913351B1 (fr) * | 2007-03-08 | 2010-11-26 | Rhodia Recherches Et Tech | Utilisation d'une betaine a titre d'agent de reduction du drainage de la mousse |
| EP2254962B1 (en) * | 2008-03-07 | 2016-04-27 | 3M Innovative Properties Company | Antistatic block copolymer pressure sensitive adhesives and articles |
| KR101212671B1 (ko) * | 2008-12-10 | 2012-12-14 | 제일모직주식회사 | Emi/rfi 차폐용 수지 복합재 |
-
2007
- 2007-10-23 KR KR1020070106602A patent/KR100963673B1/ko not_active Expired - Fee Related
- 2007-12-31 EP EP07860787A patent/EP2203524A4/en not_active Withdrawn
- 2007-12-31 WO PCT/KR2007/007010 patent/WO2009054567A1/en not_active Ceased
- 2007-12-31 JP JP2010530911A patent/JP5296085B2/ja not_active Expired - Fee Related
- 2007-12-31 CN CN200780101161A patent/CN101827894A/zh active Pending
-
2008
- 2008-10-23 TW TW097140677A patent/TWI388656B/zh not_active IP Right Cessation
-
2010
- 2010-04-21 US US12/764,305 patent/US20100204380A1/en not_active Abandoned