JP2011500935A5 - - Google Patents

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Publication number
JP2011500935A5
JP2011500935A5 JP2010530911A JP2010530911A JP2011500935A5 JP 2011500935 A5 JP2011500935 A5 JP 2011500935A5 JP 2010530911 A JP2010530911 A JP 2010530911A JP 2010530911 A JP2010530911 A JP 2010530911A JP 2011500935 A5 JP2011500935 A5 JP 2011500935A5
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JP
Japan
Prior art keywords
polymer composite
metal
metal filler
composite according
volume
Prior art date
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Application number
JP2010530911A
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English (en)
Japanese (ja)
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JP5296085B2 (ja
JP2011500935A (ja
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Publication date
Priority claimed from KR1020070106602A external-priority patent/KR100963673B1/ko
Application filed filed Critical
Publication of JP2011500935A publication Critical patent/JP2011500935A/ja
Publication of JP2011500935A5 publication Critical patent/JP2011500935A5/ja
Application granted granted Critical
Publication of JP5296085B2 publication Critical patent/JP5296085B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010530911A 2007-10-23 2007-12-31 熱伝導性ポリマーコンポジットおよびこれを利用した成形品 Expired - Fee Related JP5296085B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020070106602A KR100963673B1 (ko) 2007-10-23 2007-10-23 열전도성 수지 복합재 및 이를 이용한 성형품
KR10-2007-0106602 2007-10-23
PCT/KR2007/007010 WO2009054567A1 (en) 2007-10-23 2007-12-31 Thermal conductive polymer composite and article using the same

Publications (3)

Publication Number Publication Date
JP2011500935A JP2011500935A (ja) 2011-01-06
JP2011500935A5 true JP2011500935A5 (enExample) 2011-02-17
JP5296085B2 JP5296085B2 (ja) 2013-09-25

Family

ID=40579659

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010530911A Expired - Fee Related JP5296085B2 (ja) 2007-10-23 2007-12-31 熱伝導性ポリマーコンポジットおよびこれを利用した成形品

Country Status (7)

Country Link
US (1) US20100204380A1 (enExample)
EP (1) EP2203524A4 (enExample)
JP (1) JP5296085B2 (enExample)
KR (1) KR100963673B1 (enExample)
CN (1) CN101827894A (enExample)
TW (1) TWI388656B (enExample)
WO (1) WO2009054567A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210130285A1 (en) 2008-03-19 2021-05-06 Aurimmed Pharma, Inc. Novel compounds advantageous in the treatment of central nervous system diseases and disorders
US10793515B2 (en) 2008-03-19 2020-10-06 Aurimmed Pharma, Inc. Compounds advantageous in the treatment of central nervous system diseases and disorders
KR101257693B1 (ko) * 2008-11-05 2013-04-24 제일모직주식회사 전기절연성 고열전도성 수지 조성물
KR101297156B1 (ko) 2008-12-10 2013-08-21 제일모직주식회사 고성능 emi/rfi 차폐용 수지 복합재
JP5814688B2 (ja) * 2010-08-31 2015-11-17 三木ポリマー株式会社 熱伝導性樹脂組成物およびそれを含む放熱材
KR20120114048A (ko) 2011-04-06 2012-10-16 삼성정밀화학 주식회사 열전도성 고분자 복합소재 및 이를 포함하는 물품
KR101298739B1 (ko) * 2011-11-15 2013-08-26 한국화학연구원 형태가 다른 2종의 열전도성 필러를 포함하는 고분자 조성물 및 이의 제조방법
KR101380841B1 (ko) * 2012-04-19 2014-04-04 한국화학연구원 열전도성 및 내열성을 갖는 고분자 조성물의 성형품 제조방법 및 이에 의해 제조되는 열전도성 및 내열성을 갖는 고분자 조성물의 성형품
JP6037263B2 (ja) * 2012-06-08 2016-12-07 国立研究開発法人産業技術総合研究所 無機有機複合組成物
KR101917257B1 (ko) * 2013-04-12 2018-11-09 차이나 페트로리움 앤드 케미컬 코포레이션 폴리머/충전제/금속 복합 섬유 및 이의 제조 방법
US20150221578A1 (en) * 2014-02-05 2015-08-06 Infineon Technologies Ag Semiconductor package and method for producing a semiconductor
FR3034775B1 (fr) 2015-04-13 2018-09-28 Hutchinson Materiau pour le stockage thermique
FR3034771B1 (fr) 2015-04-13 2019-04-19 Hutchinson Materiaux conducteurs thermiques et/ou electriques et leur procede de preparation
CN104893289A (zh) * 2015-05-25 2015-09-09 牡丹江师范学院 一种高导电率和高导磁的新型材料
CN105038716B (zh) * 2015-07-03 2018-11-16 中国科学院理化技术研究所 一种各向异性导热材料及其制备方法
KR101709686B1 (ko) 2015-09-23 2017-02-24 이석 방열구조체용 탄소계 재료의 제조방법 및 이를 이용한 방열구조체의 제조방법
CN105801076B (zh) * 2016-02-15 2017-11-10 云南科威液态金属谷研发有限公司 一种内掺低熔点合金的导电水泥及其制备方法
WO2020234481A1 (en) * 2019-05-21 2020-11-26 Sabic Global Technologies B.V. Shaped object comprising polyester and aluminium
FR3104589B1 (fr) * 2019-12-13 2022-03-25 Irt Antoine De Saint Exupery Procédé de préparation d’un matériau composite électriquement conducteur et matériau composite électriquement conducteur obtenu par un tel procédé
CN111423697A (zh) * 2020-04-09 2020-07-17 宁国中奕橡塑有限公司 一种导热性能优异的热固性复合材料及其制备方法
CN113684006A (zh) * 2021-07-29 2021-11-23 东南大学 固液两相金属-高分子导热相变复合材料的制备方法

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127743A (ja) * 1982-01-25 1983-07-29 Aron Kasei Co Ltd 熱可塑性樹脂組成物
US4610808A (en) * 1982-07-19 1986-09-09 Mitech Corporation Conductive resinous composites
KR880011821A (ko) * 1987-03-09 1988-10-31 오오자와 히데오 도전성 수지 조성물 및 그 성형품
US5011872A (en) * 1987-12-21 1991-04-30 The Carborudum Company Thermally conductive ceramic/polymer composites
CA1334479C (en) * 1988-08-29 1995-02-21 Minoru Yoshinaka Conductive composition and method for making the same
US5232970A (en) * 1990-08-31 1993-08-03 The Dow Chemical Company Ceramic-filled thermally-conductive-composites containing fusible semi-crystalline polyamide and/or polybenzocyclobutenes for use in microelectronic applications
US5869412A (en) * 1991-08-22 1999-02-09 Minnesota Mining & Manufacturing Co. Metal fibermat/polymer composite
JP3217171B2 (ja) * 1992-04-14 2001-10-09 住友化学工業株式会社 樹脂組成物およびそれから作られた二次加工品
US5811050A (en) * 1994-06-06 1998-09-22 Gabower; John F. Electromagnetic interference shield for electronic devices
US20020108699A1 (en) * 1996-08-12 2002-08-15 Cofer Cameron G. Method for forming electrically conductive impregnated fibers and fiber pellets
JP3726169B2 (ja) * 1996-08-14 2005-12-14 松下電工株式会社 畜熱体及びその製造方法、床暖房システム
US6409942B1 (en) * 1996-11-07 2002-06-25 Carmel Olefins Ltd. Electrically conductive compositions and methods for producing same
DE69902957T2 (de) * 1998-03-10 2003-09-11 Togo Seisakusyo Corp., Aichi Leitfähige Harzzusammensetzung
JP3525071B2 (ja) * 1998-03-10 2004-05-10 株式会社東郷製作所 導電性樹脂組成物
US6863851B2 (en) * 1998-10-23 2005-03-08 Avery Dennison Corporation Process for making angstrom scale and high aspect functional platelets
EP0997496B1 (en) * 1998-10-26 2006-03-01 Toray Industries, Inc. Weldable polyamide resin compositions production thereof, and moulded products thereof
US6048919A (en) * 1999-01-29 2000-04-11 Chip Coolers, Inc. Thermally conductive composite material
FI118127B (fi) * 1999-03-04 2007-07-13 Valtion Teknillinen Sähköä johtava termoplastinen elastomeeri ja siitä valmistettu tuote
JP2000357413A (ja) * 1999-06-15 2000-12-26 Togo Seisakusho Corp 導電性樹脂組成物
JP2001338529A (ja) * 2000-05-30 2001-12-07 Togo Seisakusho Corp 導電性樹脂組成物
JP2002003829A (ja) * 2000-06-26 2002-01-09 Mitsubishi Plastics Ind Ltd 放熱材料
JP3905477B2 (ja) * 2000-10-26 2007-04-18 日本エイアンドエル株式会社 難燃電磁波シールド性熱可塑性樹脂組成物
FI117511B (fi) * 2001-04-04 2006-11-15 Premix Oy Menetelmä sähköä johtavan polymeeriseoksen valmistamiseksi ja sähköä johtava polymeeriseos
US6822018B2 (en) * 2002-02-15 2004-11-23 Delphi Technologies, Inc. Thermally-conductive electrically-insulating polymer-base material
JP2004140267A (ja) * 2002-10-18 2004-05-13 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
CN1914694B (zh) * 2003-12-12 2010-09-01 西门子公司 金属-塑料混合物及其应用和由其制备的模制体
US20050277349A1 (en) * 2004-06-15 2005-12-15 Siemens Westinghouse Power Corporation High thermal conductivity materials incorporated into resins
JP2006022130A (ja) * 2004-07-06 2006-01-26 Idemitsu Kosan Co Ltd 熱伝導性樹脂組成物及びその製造方法
US7348370B2 (en) * 2005-04-27 2008-03-25 United Technologies Corporation Metal oxides and hydroxides as corrosion inhibitor pigments for a chromate-free corrosion resistant epoxy primer
JP2006328352A (ja) 2005-04-28 2006-12-07 Idemitsu Kosan Co Ltd 絶縁性熱伝導性樹脂組成物及び成形品並びにその製造方法
JP2006328155A (ja) * 2005-05-24 2006-12-07 Idemitsu Kosan Co Ltd 絶縁性熱伝導性樹脂組成物及び成形品並びにその製造方法
WO2006132185A1 (ja) * 2005-06-06 2006-12-14 Nippon Kagaku Yakin Co., Ltd. 絶縁性熱伝導性樹脂組成物及び成形品並びにその製造方法
US7589284B2 (en) * 2005-09-12 2009-09-15 Parker Hannifin Corporation Composite polymeric material for EMI shielding
KR101372345B1 (ko) * 2006-06-30 2014-03-12 도레이 카부시키가이샤 열가소성 수지 조성물 및 그 성형품
FR2913351B1 (fr) * 2007-03-08 2010-11-26 Rhodia Recherches Et Tech Utilisation d'une betaine a titre d'agent de reduction du drainage de la mousse
EP2254962B1 (en) * 2008-03-07 2016-04-27 3M Innovative Properties Company Antistatic block copolymer pressure sensitive adhesives and articles
KR101212671B1 (ko) * 2008-12-10 2012-12-14 제일모직주식회사 Emi/rfi 차폐용 수지 복합재

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