JP5293211B2 - 静電チャックおよび静電チャックの製造方法 - Google Patents

静電チャックおよび静電チャックの製造方法 Download PDF

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Publication number
JP5293211B2
JP5293211B2 JP2009006147A JP2009006147A JP5293211B2 JP 5293211 B2 JP5293211 B2 JP 5293211B2 JP 2009006147 A JP2009006147 A JP 2009006147A JP 2009006147 A JP2009006147 A JP 2009006147A JP 5293211 B2 JP5293211 B2 JP 5293211B2
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JP
Japan
Prior art keywords
electrostatic chuck
resin
covering portion
protrusion
flat
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2009006147A
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English (en)
Japanese (ja)
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JP2010165805A (ja
JP2010165805A5 (enExample
Inventor
裕明 堀
健志 内村
宏樹 松井
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Toto Ltd
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Toto Ltd
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Priority to JP2009006147A priority Critical patent/JP5293211B2/ja
Priority to TW099100929A priority patent/TWI427735B/zh
Priority to PCT/JP2010/050353 priority patent/WO2010082606A1/ja
Publication of JP2010165805A publication Critical patent/JP2010165805A/ja
Publication of JP2010165805A5 publication Critical patent/JP2010165805A5/ja
Application granted granted Critical
Publication of JP5293211B2 publication Critical patent/JP5293211B2/ja
Expired - Fee Related legal-status Critical Current
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    • H10P72/7614—
    • H10P72/72—

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2009006147A 2009-01-14 2009-01-14 静電チャックおよび静電チャックの製造方法 Expired - Fee Related JP5293211B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009006147A JP5293211B2 (ja) 2009-01-14 2009-01-14 静電チャックおよび静電チャックの製造方法
TW099100929A TWI427735B (zh) 2009-01-14 2010-01-14 Electrostatic chuck and electrostatic chuck manufacturing method
PCT/JP2010/050353 WO2010082606A1 (ja) 2009-01-14 2010-01-14 静電チャックおよび静電チャックの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009006147A JP5293211B2 (ja) 2009-01-14 2009-01-14 静電チャックおよび静電チャックの製造方法

Publications (3)

Publication Number Publication Date
JP2010165805A JP2010165805A (ja) 2010-07-29
JP2010165805A5 JP2010165805A5 (enExample) 2012-03-01
JP5293211B2 true JP5293211B2 (ja) 2013-09-18

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JP2009006147A Expired - Fee Related JP5293211B2 (ja) 2009-01-14 2009-01-14 静電チャックおよび静電チャックの製造方法

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Country Link
JP (1) JP5293211B2 (enExample)
TW (1) TWI427735B (enExample)
WO (1) WO2010082606A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020106521A1 (en) * 2018-11-19 2020-05-28 Entegris, Inc. Electrostatic chuck with charge dissipation coating

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5458050B2 (ja) 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
US9620478B2 (en) 2011-11-18 2017-04-11 Apple Inc. Method of fabricating a micro device transfer head
US8794501B2 (en) 2011-11-18 2014-08-05 LuxVue Technology Corporation Method of transferring a light emitting diode
US8573469B2 (en) 2011-11-18 2013-11-05 LuxVue Technology Corporation Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer
US8349116B1 (en) * 2011-11-18 2013-01-08 LuxVue Technology Corporation Micro device transfer head heater assembly and method of transferring a micro device
CN102799064B (zh) * 2012-08-21 2014-03-26 郑州大学 一种金属图形直接压印转移掩模板基板静电场力分离装置
JP6449294B2 (ja) * 2013-12-06 2019-01-09 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 予熱部材をセルフセンタリングするための装置
US9460950B2 (en) * 2013-12-06 2016-10-04 Applied Materials, Inc. Wafer carrier for smaller wafers and wafer pieces
KR20190010748A (ko) * 2014-06-23 2019-01-30 니혼도꾸슈도교 가부시키가이샤 정전 척
JP2018206993A (ja) * 2017-06-06 2018-12-27 日本特殊陶業株式会社 基板保持部材およびその製造方法
JP7083080B2 (ja) * 2018-01-11 2022-06-10 株式会社日立ハイテク プラズマ処理装置
JP7308254B2 (ja) * 2018-02-19 2023-07-13 日本特殊陶業株式会社 保持装置
EP3846334B1 (en) * 2019-09-11 2025-02-19 Creative Technology Corporation Attachment/detachment device
JP7606917B2 (ja) * 2021-04-16 2024-12-26 日本特殊陶業株式会社 保持装置
JP7718902B2 (ja) * 2021-08-06 2025-08-05 株式会社フェローテックマテリアルテクノロジーズ ウエハ支持体
JP2025103535A (ja) 2023-12-27 2025-07-09 新東工業株式会社 ブラシ研磨装置、及びウエハ保持装置の製造方法
JP2025150530A (ja) * 2024-03-27 2025-10-09 住友大阪セメント株式会社 静電チャック装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0643629B2 (ja) * 1987-01-22 1994-06-08 日本真空技術株式会社 静電チャック部品の製造方法
JP2001060618A (ja) * 1999-08-20 2001-03-06 Canon Inc 基板吸着保持方法、基板吸着保持装置および該基板吸着保持装置を用いた露光装置ならびにデバイスの製造方法
JP4094262B2 (ja) * 2001-09-13 2008-06-04 住友大阪セメント株式会社 吸着固定装置及びその製造方法
JP3847198B2 (ja) * 2002-03-27 2006-11-15 京セラ株式会社 静電チャック
JP2006287210A (ja) * 2005-03-07 2006-10-19 Ngk Insulators Ltd 静電チャック及びその製造方法
TW200735254A (en) * 2006-03-03 2007-09-16 Ngk Insulators Ltd Electrostatic chuck and producing method thereof
JP4987682B2 (ja) * 2007-04-16 2012-07-25 ソニー株式会社 音声チャットシステム、情報処理装置、音声認識方法およびプログラム
CN101802998B (zh) * 2007-09-11 2014-07-30 佳能安内华股份有限公司 静电夹具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020106521A1 (en) * 2018-11-19 2020-05-28 Entegris, Inc. Electrostatic chuck with charge dissipation coating

Also Published As

Publication number Publication date
JP2010165805A (ja) 2010-07-29
TW201034114A (en) 2010-09-16
WO2010082606A1 (ja) 2010-07-22
TWI427735B (zh) 2014-02-21

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