JP5289703B2 - 高解像度パターンの形成方法 - Google Patents

高解像度パターンの形成方法 Download PDF

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Publication number
JP5289703B2
JP5289703B2 JP2006341983A JP2006341983A JP5289703B2 JP 5289703 B2 JP5289703 B2 JP 5289703B2 JP 2006341983 A JP2006341983 A JP 2006341983A JP 2006341983 A JP2006341983 A JP 2006341983A JP 5289703 B2 JP5289703 B2 JP 5289703B2
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JP
Japan
Prior art keywords
pattern
forming
sacrificial film
high resolution
resolution pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006341983A
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English (en)
Japanese (ja)
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JP2007298944A5 (enExample
JP2007298944A (ja
Inventor
申東崙
金東洙
金忠渙
李澤旻
▲じょ▼正大
崔秉五
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Korea Institute of Machinery and Materials KIMM
Original Assignee
Korea Institute of Machinery and Materials KIMM
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Publication date
Application filed by Korea Institute of Machinery and Materials KIMM filed Critical Korea Institute of Machinery and Materials KIMM
Publication of JP2007298944A publication Critical patent/JP2007298944A/ja
Publication of JP2007298944A5 publication Critical patent/JP2007298944A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2006341983A 2006-05-03 2006-12-19 高解像度パターンの形成方法 Expired - Fee Related JP5289703B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060039985A KR100690930B1 (ko) 2006-05-03 2006-05-03 깊은 제거를 이용하여 원하는 패턴 두께 혹은 높은종횡비를 가지는 고해상도 패턴 형성 방법
KR10-2006-0039985 2006-05-03

Publications (3)

Publication Number Publication Date
JP2007298944A JP2007298944A (ja) 2007-11-15
JP2007298944A5 JP2007298944A5 (enExample) 2009-11-05
JP5289703B2 true JP5289703B2 (ja) 2013-09-11

Family

ID=38102672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006341983A Expired - Fee Related JP5289703B2 (ja) 2006-05-03 2006-12-19 高解像度パターンの形成方法

Country Status (4)

Country Link
US (1) US7517467B2 (enExample)
JP (1) JP5289703B2 (enExample)
KR (1) KR100690930B1 (enExample)
DE (1) DE102006058559B4 (enExample)

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US7644512B1 (en) * 2006-01-18 2010-01-12 Akrion, Inc. Systems and methods for drying a rotating substrate
US8053168B2 (en) * 2006-12-19 2011-11-08 Palo Alto Research Center Incorporated Printing plate and system using heat-decomposable polymers
JP4873160B2 (ja) * 2007-02-08 2012-02-08 トヨタ自動車株式会社 接合方法
DE102007007183A1 (de) * 2007-02-14 2008-08-21 Man Roland Druckmaschinen Ag Verfahren zur Herstellung von Druckformen
US20090107546A1 (en) * 2007-10-29 2009-04-30 Palo Alto Research Center Incorporated Co-extruded compositions for high aspect ratio structures
US8013300B2 (en) * 2008-06-20 2011-09-06 Carl Zeiss Nts, Llc Sample decontamination
US8200106B2 (en) * 2009-06-11 2012-06-12 Canon Kabushiki Kaisha Image forming apparatus with image forming condition control feature based on difference in patch densities
KR100969172B1 (ko) * 2009-06-22 2010-07-14 한국기계연구원 마스크 템플릿을 이용한 미세패턴 형성방법
CN102741694B (zh) * 2009-12-16 2014-12-24 霍夫曼-拉罗奇有限公司 借助于受保护的分析物的控释来检测测试元件中酶的分解
WO2012160468A1 (en) * 2011-05-23 2012-11-29 Koninklijke Philips Electronics N.V. Fabrication apparatus for fabricating a patterned layer
GB2508915A (en) * 2012-12-14 2014-06-18 Mahle Int Gmbh A thrust washer for a sliding bearing
JP6434029B2 (ja) * 2013-09-06 2018-12-05 ソルベイ スペシャルティ ポリマーズ イタリー エス．ピー．エー． 導電性アセンブリ
JP2017531306A (ja) * 2014-08-01 2017-10-19 ウェスタン・ミシガン・ユニバーシティ・リサーチ・ファウンデイションＷｅｓｔｅｒｎ Ｍｉｃｈｉｇａｎ Ｕｎｉｖｅｒｓｉｔｙ Ｒｅｓｅａｒｃｈ Ｆｏｕｎｄａｔｉｏｎ 自立式電子デバイス
KR102467762B1 (ko) * 2014-08-27 2022-11-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 전기적 다층 라미네이션 전사 필름
KR101654519B1 (ko) * 2015-04-14 2016-09-06 서울대학교 산학협력단 나노스케일 3차원 구조 제작 장치 및 방법
EP3362189B1 (en) 2015-10-15 2024-12-04 Board of Regents, The University of Texas System Versatile process for depositing thin films
EP3159740B1 (de) * 2015-10-22 2018-08-01 Flint Group Germany GmbH Verfahren zu generativen herstellung von reliefdruckformen
JP6678430B2 (ja) * 2015-11-06 2020-04-08 株式会社Ｎｂｃメッシュテック スクリーン印刷による薄膜細線パターンの形成方法
CN105293937A (zh) * 2015-11-29 2016-02-03 杭州柳茶医药科技有限公司 一种防水玻璃及其制作工艺
EP4235750A3 (en) * 2016-02-15 2023-09-06 Newport Corporation Method of selectively varying the wetting characteristics of a surface
US10746612B2 (en) 2016-11-30 2020-08-18 The Board Of Trustees Of Western Michigan University Metal-metal composite ink and methods for forming conductive patterns
KR102402471B1 (ko) * 2020-12-22 2022-05-26 주식회사 셀코스 표면 코팅의 균일도 향상을 위한 코팅 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69132442T2 (de) 1990-01-25 2001-05-03 Dai Nippon Insatsu K.K., Tokio/Tokyo Verfahren und material zum bilden von texturierten dicken filmartigen mustern
US6756181B2 (en) * 1993-06-25 2004-06-29 Polyfibron Technologies, Inc. Laser imaged printing plates
JPH0722732A (ja) * 1993-06-30 1995-01-24 Sumitomo Metal Ind Ltd 微細配線の形成方法
US6074893A (en) * 1993-09-27 2000-06-13 Sumitomo Metal Industries, Ltd. Process for forming fine thick-film conductor patterns
JPH0794848A (ja) * 1993-09-27 1995-04-07 Sumitomo Kinzoku Ceramics:Kk 導体層パターンの形成方法
JP3971489B2 (ja) 1997-08-26 2007-09-05 太陽インキ製造株式会社 ガラスペースト組成物及びそれを用いたプラズマディスプレイパネルの背面板の製造方法
JP3686749B2 (ja) 1997-11-04 2005-08-24 太陽インキ製造株式会社 パターン状無機質焼成被膜及びプラズマディスプレイパネルの製造方法
KR100660384B1 (ko) * 1998-03-17 2006-12-21 세이코 엡슨 가부시키가이샤 표시장치의 제조방법
JPH11297213A (ja) * 1998-04-09 1999-10-29 Dainippon Printing Co Ltd プラズマディスプレイパネル用蛍光面とその形成方法
JP2000260309A (ja) * 1999-03-05 2000-09-22 Matsushita Electric Ind Co Ltd ガス放電パネルの製造方法
JP3982231B2 (ja) * 2001-10-19 2007-09-26 セイコーエプソン株式会社 カラーフィルタの製造方法とカラーフィルタ及び液晶装置並びに電子機器
JP2005285616A (ja) * 2004-03-30 2005-10-13 Seiko Epson Corp 薄膜形成方法、電気光学装置の製造方法、カラーフィルタの製造方法および液滴吐出装置
JP2006024695A (ja) * 2004-07-07 2006-01-26 Nec Lcd Technologies Ltd ナノ粒子インクを用いた配線形成方法
US20080318008A1 (en) * 2004-09-03 2008-12-25 Koninklijke Philips Electronics, Nv Method and Apparatus for Application of a Pattern, Element and Device Provided with Such a Pattern
JP2006073450A (ja) * 2004-09-06 2006-03-16 Idemitsu Kosan Co Ltd 色変換基板及びその製造方法並びに有機ｅｌ表示装置
US8796583B2 (en) * 2004-09-17 2014-08-05 Eastman Kodak Company Method of forming a structured surface using ablatable radiation sensitive material

Also Published As

Publication number Publication date
DE102006058559B4 (de) 2012-12-06
KR100690930B1 (ko) 2007-03-09
US7517467B2 (en) 2009-04-14
US20070259474A1 (en) 2007-11-08
JP2007298944A (ja) 2007-11-15
DE102006058559A1 (de) 2007-11-15

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