JP5273892B2 - オプトエレクトロニック素子及びその製造方法 - Google Patents

オプトエレクトロニック素子及びその製造方法 Download PDF

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Publication number
JP5273892B2
JP5273892B2 JP2001582847A JP2001582847A JP5273892B2 JP 5273892 B2 JP5273892 B2 JP 5273892B2 JP 2001582847 A JP2001582847 A JP 2001582847A JP 2001582847 A JP2001582847 A JP 2001582847A JP 5273892 B2 JP5273892 B2 JP 5273892B2
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Japan
Prior art keywords
optical member
layer
transparent
resin
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2001582847A
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English (en)
Japanese (ja)
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JP2004512670A5 (enExample
JP2004512670A (ja
Inventor
ヘーン クラウス
ゾルク イェルク
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Publication of JP2004512670A5 publication Critical patent/JP2004512670A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP2001582847A 2000-05-12 2001-05-11 オプトエレクトロニック素子及びその製造方法 Expired - Lifetime JP5273892B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10023353A DE10023353A1 (de) 2000-05-12 2000-05-12 Optoelektronisches Bauelement und Verfahren zur Herstellung
DE10023353.8 2000-05-12
PCT/DE2001/001820 WO2001086730A2 (de) 2000-05-12 2001-05-11 Optoelektronisches bauelement und verfahren zur herstellung

Publications (3)

Publication Number Publication Date
JP2004512670A JP2004512670A (ja) 2004-04-22
JP2004512670A5 JP2004512670A5 (enExample) 2005-01-27
JP5273892B2 true JP5273892B2 (ja) 2013-08-28

Family

ID=7641836

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001582847A Expired - Lifetime JP5273892B2 (ja) 2000-05-12 2001-05-11 オプトエレクトロニック素子及びその製造方法

Country Status (7)

Country Link
US (1) US7455461B2 (enExample)
EP (1) EP1281205B1 (enExample)
JP (1) JP5273892B2 (enExample)
CN (1) CN1328798C (enExample)
DE (2) DE10023353A1 (enExample)
TW (1) TW525304B (enExample)
WO (1) WO2001086730A2 (enExample)

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DE102008025756B4 (de) * 2008-05-29 2023-02-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiteranordnung
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DE102010046122A1 (de) 2010-09-21 2012-03-22 Osram Opto Semiconductors Gmbh Elektronisches Bauelement
DE102011114559B4 (de) * 2011-09-30 2020-06-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement umfassend eine Haftschicht, Verfahren zur Herstellung einer Haftschicht in einem optoelektronischen Bauelement und Verwendung eines Klebstoffes zur Bildung von Haftschichten in optoelektronischen Bauelementen
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KR102322336B1 (ko) * 2015-02-06 2021-11-05 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 이를 포함하는 조명 장치
DE102016223710B4 (de) * 2016-11-29 2021-01-14 Carl Zeiss Industrielle Messtechnik Gmbh Verfahren und Vorrichtung zur Herstellung einer Beleuchtungseinrichtung
JP7009477B2 (ja) 2017-06-27 2022-01-25 日本碍子株式会社 透明封止部材及びその製造方法
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Also Published As

Publication number Publication date
WO2001086730A2 (de) 2001-11-15
DE10023353A1 (de) 2001-11-29
EP1281205B1 (de) 2008-02-06
CN1328798C (zh) 2007-07-25
JP2004512670A (ja) 2004-04-22
US7455461B2 (en) 2008-11-25
US20030185526A1 (en) 2003-10-02
TW525304B (en) 2003-03-21
CN1439175A (zh) 2003-08-27
DE50113565D1 (de) 2008-03-20
EP1281205A2 (de) 2003-02-05
WO2001086730A3 (de) 2002-06-27

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