TW525304B - Optoelectronic element and its production method - Google Patents

Optoelectronic element and its production method Download PDF

Info

Publication number
TW525304B
TW525304B TW090109757A TW90109757A TW525304B TW 525304 B TW525304 B TW 525304B TW 090109757 A TW090109757 A TW 090109757A TW 90109757 A TW90109757 A TW 90109757A TW 525304 B TW525304 B TW 525304B
Authority
TW
Taiwan
Prior art keywords
patent application
layer
scope
resin
epoxy resin
Prior art date
Application number
TW090109757A
Other languages
English (en)
Chinese (zh)
Inventor
Klaus Hoehn
Joerg Sorg
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Application granted granted Critical
Publication of TW525304B publication Critical patent/TW525304B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/407—Optical elements or arrangements indirectly associated with the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Lens Barrels (AREA)
  • Photovoltaic Devices (AREA)
  • Optical Couplings Of Light Guides (AREA)
TW090109757A 2000-05-12 2001-04-24 Optoelectronic element and its production method TW525304B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10023353A DE10023353A1 (de) 2000-05-12 2000-05-12 Optoelektronisches Bauelement und Verfahren zur Herstellung

Publications (1)

Publication Number Publication Date
TW525304B true TW525304B (en) 2003-03-21

Family

ID=7641836

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090109757A TW525304B (en) 2000-05-12 2001-04-24 Optoelectronic element and its production method

Country Status (7)

Country Link
US (1) US7455461B2 (enExample)
EP (1) EP1281205B1 (enExample)
JP (1) JP5273892B2 (enExample)
CN (1) CN1328798C (enExample)
DE (2) DE10023353A1 (enExample)
TW (1) TW525304B (enExample)
WO (1) WO2001086730A2 (enExample)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10118231A1 (de) 2001-04-11 2002-10-17 Heidenhain Gmbh Dr Johannes Optoelektronische Baulelmentanordnung und Verfahren zur Herstellun einer oploelektronischen Bauelementanordnung
DE10129785B4 (de) 2001-06-20 2010-03-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung
JP2004040031A (ja) * 2002-07-08 2004-02-05 Stanley Electric Co Ltd 表面実装型発光ダイオード
KR20070096020A (ko) * 2002-09-17 2007-10-01 앤터온 비.브이. 카메라 디바이스, 카메라 디바이스 제조 방법, 웨이퍼스케일 패키지 및 광학 어셈블리
US7491980B2 (en) * 2003-08-26 2009-02-17 Sumitomo Electric Industries, Ltd. Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same
FR2861217B1 (fr) * 2003-10-21 2006-03-17 St Microelectronics Sa Dispositif optique pour boitier semi-conducteur optique et procede de fabrication.
US7321161B2 (en) * 2003-12-19 2008-01-22 Philips Lumileds Lighting Company, Llc LED package assembly with datum reference feature
DE10361650A1 (de) * 2003-12-30 2005-08-04 Osram Opto Semiconductors Gmbh Optoelektronisches Modul und Verfahren zu dessen Herstellung
US7355284B2 (en) * 2004-03-29 2008-04-08 Cree, Inc. Semiconductor light emitting devices including flexible film having therein an optical element
US7279346B2 (en) * 2004-03-31 2007-10-09 Cree, Inc. Method for packaging a light emitting device by one dispense then cure step followed by another
US7517728B2 (en) * 2004-03-31 2009-04-14 Cree, Inc. Semiconductor light emitting devices including a luminescent conversion element
US8563913B2 (en) 2004-09-14 2013-10-22 Omnivision Technologies, Inc. Imaging systems having ray corrector, and associated methods
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
DE102006020529A1 (de) * 2005-08-30 2007-03-01 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
MY152857A (en) 2005-09-01 2014-11-28 Dominant Opto Tech Sdn Bhd Surface mount optoelectronic component with lens
DE102006037737A1 (de) * 2005-12-09 2007-06-14 Osram Opto Semiconductors Gmbh Optische Vorrichtung, optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung
JP4828226B2 (ja) * 2005-12-28 2011-11-30 新光電気工業株式会社 発光装置及びその製造方法
US7785489B2 (en) * 2005-12-28 2010-08-31 E.I. Du Pont De Nemours And Company Solvent formulations for solution deposition of organic materials onto low surface energy layers
AT503027B1 (de) * 2006-05-08 2007-07-15 Austria Tech & System Tech Leiterplattenelement mit optoelektronischem bauelement und licht-wellenleiter
EP2080223B8 (en) * 2006-10-31 2018-08-22 Lumileds Holding B.V. Lighting device package
TWM322104U (en) * 2007-02-09 2007-11-11 Sin Guang Li Internat Co Ltd Improved structure of solar cell plate
DE102007021904A1 (de) * 2007-02-28 2008-09-04 Osram Opto Semiconductors Gmbh Optoelektronische Vorrichtung mit Gehäusekörper
DE102007016904B4 (de) * 2007-04-10 2014-11-20 Osram Gmbh Verfahren zur Herstellung einer optoelektronischen Vorrichtung
JP5405731B2 (ja) * 2007-10-23 2014-02-05 日立コンシューマエレクトロニクス株式会社 光源モジュール
US7539366B1 (en) 2008-01-04 2009-05-26 International Business Machines Corporation Optical transceiver module
DE102008025756B4 (de) * 2008-05-29 2023-02-23 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiteranordnung
JP2009302221A (ja) 2008-06-12 2009-12-24 Nec Electronics Corp 電子装置及びその製造方法
JP2010171379A (ja) * 2008-12-25 2010-08-05 Seiko Instruments Inc 発光デバイス
DE102010024545B4 (de) 2010-06-22 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE102010046122A1 (de) 2010-09-21 2012-03-22 Osram Opto Semiconductors Gmbh Elektronisches Bauelement
DE102011114559B4 (de) * 2011-09-30 2020-06-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement umfassend eine Haftschicht, Verfahren zur Herstellung einer Haftschicht in einem optoelektronischen Bauelement und Verwendung eines Klebstoffes zur Bildung von Haftschichten in optoelektronischen Bauelementen
DE102012102476B4 (de) 2012-03-22 2022-09-08 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
KR102322336B1 (ko) * 2015-02-06 2021-11-05 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 이를 포함하는 조명 장치
DE102016223710B4 (de) * 2016-11-29 2021-01-14 Carl Zeiss Industrielle Messtechnik Gmbh Verfahren und Vorrichtung zur Herstellung einer Beleuchtungseinrichtung
JP7009477B2 (ja) 2017-06-27 2022-01-25 日本碍子株式会社 透明封止部材及びその製造方法
CN109411587B (zh) * 2018-12-10 2020-11-27 浙江单色电子科技有限公司 一种含硅胶透镜的紫光led生产方法及其紫光led

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4173476A (en) * 1978-02-08 1979-11-06 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
JPS6260277A (ja) 1985-09-10 1987-03-16 Toshiba Corp 半導体発光装置
JPH0241662Y2 (enExample) * 1985-12-28 1990-11-06
FR2593930B1 (fr) * 1986-01-24 1989-11-24 Radiotechnique Compelec Dispositif opto-electronique pour montage en surface
DE3875149T2 (de) * 1987-03-27 1993-02-11 Fujitsu Ltd Miniaturisierter biofuehler mit miniaturisierter sauerstoffelektrode sowie sein herstellungsverfahren.
US5043716A (en) * 1988-07-14 1991-08-27 Adaptive Micro Systems, Inc. Electronic display with lens matrix
DE8812039U1 (de) * 1988-09-23 1988-12-29 Jungck, Günter, 79400 Kandern Leuchtdiodengehäuse
JP2922977B2 (ja) * 1990-04-27 1999-07-26 豊田合成株式会社 発光ダイオード
JP3214008B2 (ja) * 1991-12-27 2001-10-02 住友化学工業株式会社 表面硬化樹脂板の製造方法
JPH05186509A (ja) * 1992-01-17 1993-07-27 Mitsui Toatsu Chem Inc 塗膜の硬化方法
JP3104407B2 (ja) * 1992-06-16 2000-10-30 松下電器産業株式会社 受光部品
JPH06104461A (ja) * 1992-09-18 1994-04-15 Canon Inc 光半導体装置及びそれを用いた光情報処理装置
JPH06203771A (ja) * 1992-12-28 1994-07-22 Mitsubishi Electric Corp 表示素子
IT1265106B1 (it) 1993-07-23 1996-10-30 Solari Udine Spa Sistema ottico per diodi emettitori di luce
US5450513A (en) * 1993-08-04 1995-09-12 Corning Incorporated Silane-treated optical components
JPH07231117A (ja) * 1994-02-16 1995-08-29 Mitsubishi Electric Corp 発光素子の集光レンズ
DE4408352C2 (de) * 1994-03-12 1996-02-08 Meinhard Prof Dr Knoll Miniaturisierter stofferkennender Durchflußsensor sowie Verfahren zu seiner Herstellung
RU2131624C1 (ru) * 1994-12-09 1999-06-10 Сименс АГ Элемент на поверхностных акустических волнах и способ изготовления демпфирующей структуры для него
JPH0927643A (ja) 1995-07-13 1997-01-28 Stanley Electric Co Ltd 受光／発光素子
JPH0983018A (ja) 1995-09-11 1997-03-28 Nippon Denyo Kk 発光ダイオードユニット
CN1534803B (zh) * 1996-06-26 2010-05-26 奥斯兰姆奥普托半导体股份有限两合公司 具有发光变换元件的发光半导体器件
JP3191729B2 (ja) * 1997-07-03 2001-07-23 日本電気株式会社 光半導体モジュールとその製造方法
DE19746893B4 (de) 1997-10-23 2005-09-01 Siemens Ag Optoelektronisches Bauelement mit Wärmesenke im Sockelteil und Verfahren zur Herstellung
DE19755734A1 (de) * 1997-12-15 1999-06-24 Siemens Ag Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes
JP2000068049A (ja) * 1998-08-24 2000-03-03 Casio Comput Co Ltd 電界発光素子及びその製造方法
JP2000086746A (ja) * 1998-09-17 2000-03-28 Sumitomo Bakelite Co Ltd 紫外線硬化型樹脂組成物
JP3674819B2 (ja) * 1998-09-30 2005-07-27 富士電機ホールディングス株式会社 カラーフィルターおよび有機多色発光表示素子
DE19851139A1 (de) * 1998-11-05 2000-05-11 Basf Ag Verfahren und Vorrichtung zur Herstellung von gehärteten Lackschichten
JP2000214353A (ja) * 1999-01-26 2000-08-04 Nec Corp 低反射特性を有する受光装置
DE19918370B4 (de) * 1999-04-22 2006-06-08 Osram Opto Semiconductors Gmbh LED-Weißlichtquelle mit Linse
JP3758938B2 (ja) * 1999-06-16 2006-03-22 セイコーエプソン株式会社 光モジュール及びその製造方法並びに光伝達装置
US6478477B1 (en) * 2000-04-25 2002-11-12 Oki Electric Industry Co., Ltd Planar packaged optical module having 1st and 2nd adhesives with different glass-transition temperatures
US6642068B1 (en) * 2002-05-03 2003-11-04 Donald J. Hayes Method for producing a fiber optic switch

Also Published As

Publication number Publication date
WO2001086730A2 (de) 2001-11-15
DE10023353A1 (de) 2001-11-29
EP1281205B1 (de) 2008-02-06
CN1328798C (zh) 2007-07-25
JP2004512670A (ja) 2004-04-22
US7455461B2 (en) 2008-11-25
JP5273892B2 (ja) 2013-08-28
US20030185526A1 (en) 2003-10-02
CN1439175A (zh) 2003-08-27
DE50113565D1 (de) 2008-03-20
EP1281205A2 (de) 2003-02-05
WO2001086730A3 (de) 2002-06-27

Similar Documents

Publication Publication Date Title
TW525304B (en) Optoelectronic element and its production method
US20150155453A1 (en) Optoelectronic chip-on-board module
EP2194586A1 (en) Semiconductor device and method for manufacturing the same
CN1255646A (zh) 制造光学组件的方法
CN104347610B (zh) 嵌入式led器件及其制作方法和发光设备
WO2018121103A1 (zh) 一种紫外led封装方法
CN202305857U (zh) 大口径花岗岩玻璃复合式球面与非球面反射镜
CN102593332A (zh) 一种led发光器件及其制作方法
JP4307897B2 (ja) 接合方法、接合装置及び該接合装置を用いた部品接合装置
KR100994278B1 (ko) 광학 소자, 광출사 장치 및 광학 소자의 제조 방법
CN102169946A (zh) 一种led照明装置及其制造方法
CN100442096C (zh) 基于相干光辐射的固化封装光电转换组件的设备及其方法
CN113540959B (zh) 一种边发射半导体激光器封装结构及其制作方法
TW201248927A (en) Optoelectronic semiconductor component
CN113025252A (zh) 开环光纤陀螺光纤环绕制用紫外固化胶粘剂及其使用方法
TW200849674A (en) Method of manufacturing a luminance diode chip luminance diode chip
JP2007139877A (ja) 光モジュールの製造方法および光モジュール
JP5607936B2 (ja) 光学部品の製造方法
CN113523565A (zh) 一种带金属环的透镜焊接方法
Pröller Dual-curing adhesives for fast cycle times and high-precision alignment of components
KR20180119452A (ko) 유리계 렌즈 조립형 led 램프 광원모듈
CN213501310U (zh) 一种耐高温性能好的单晶硅片
CN208000930U (zh) 一种用于光伏组件串间距和片间距上的压敏型增益膜
JP2006203156A (ja) 光発電パネル及びその製造方法
JPH08320402A (ja) 接合光学素子及びその保持装置

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees