JP5270833B2 - 液状樹脂組成物、半導体装置及びその製造方法 - Google Patents

液状樹脂組成物、半導体装置及びその製造方法 Download PDF

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Publication number
JP5270833B2
JP5270833B2 JP2006343323A JP2006343323A JP5270833B2 JP 5270833 B2 JP5270833 B2 JP 5270833B2 JP 2006343323 A JP2006343323 A JP 2006343323A JP 2006343323 A JP2006343323 A JP 2006343323A JP 5270833 B2 JP5270833 B2 JP 5270833B2
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Japan
Prior art keywords
resin composition
liquid resin
filler
liquid
composition according
Prior art date
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Application number
JP2006343323A
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English (en)
Japanese (ja)
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JP2008156383A (ja
JP2008156383A5 (enExample
Inventor
直樹 金川
靖孝 宮田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2006343323A priority Critical patent/JP5270833B2/ja
Publication of JP2008156383A publication Critical patent/JP2008156383A/ja
Priority to US12/435,639 priority patent/US8106523B2/en
Publication of JP2008156383A5 publication Critical patent/JP2008156383A5/ja
Application granted granted Critical
Publication of JP5270833B2 publication Critical patent/JP5270833B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2006343323A 2006-12-20 2006-12-20 液状樹脂組成物、半導体装置及びその製造方法 Active JP5270833B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006343323A JP5270833B2 (ja) 2006-12-20 2006-12-20 液状樹脂組成物、半導体装置及びその製造方法
US12/435,639 US8106523B2 (en) 2006-12-20 2009-05-05 Liquid resin composition, semi-conductor device, and process of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006343323A JP5270833B2 (ja) 2006-12-20 2006-12-20 液状樹脂組成物、半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008156383A JP2008156383A (ja) 2008-07-10
JP2008156383A5 JP2008156383A5 (enExample) 2009-07-23
JP5270833B2 true JP5270833B2 (ja) 2013-08-21

Family

ID=39657680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006343323A Active JP5270833B2 (ja) 2006-12-20 2006-12-20 液状樹脂組成物、半導体装置及びその製造方法

Country Status (2)

Country Link
US (1) US8106523B2 (enExample)
JP (1) JP5270833B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110105646A1 (en) * 2008-05-21 2011-05-05 Nagase Chemtex Corporation Epoxy resin composition for encapsulating electronic part
JP5259500B2 (ja) * 2009-06-10 2013-08-07 電気化学工業株式会社 非晶質シリカ質粉末およびその製造方法、用途
JP5672589B2 (ja) * 2009-06-25 2015-02-18 パナソニックＩｐマネジメント株式会社 液状エポキシ樹脂組成物
EP2825594B1 (en) 2012-04-24 2017-03-01 Dow Global Technologies LLC Epoxy resin composition for marine maintenance and repair coatings
KR102006678B1 (ko) * 2012-04-24 2019-08-02 다우 글로벌 테크놀로지스 엘엘씨 오버코팅성이 개선된 선박 유지 및 보수 코팅용 에폭시 수지 조성물
US8980026B2 (en) 2012-09-28 2015-03-17 Apple Inc. Gap seals for electronic device structures
JP6185342B2 (ja) * 2013-09-05 2017-08-23 信越化学工業株式会社 封止材積層複合体、封止後半導体素子搭載基板又は封止後半導体素子形成ウエハ、及び半導体装置の製造方法
WO2015146149A1 (ja) * 2014-03-25 2015-10-01 パナソニックＩｐマネジメント株式会社 液状樹脂組成物、硬化物、配線構造体及びこの配線構造体を用いた実装体
US9799626B2 (en) * 2014-09-15 2017-10-24 Invensas Corporation Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers
JP6772841B2 (ja) * 2015-02-05 2020-10-21 味の素株式会社 樹脂組成物
KR20170053416A (ko) 2015-11-06 2017-05-16 주식회사 엘지화학 반도체 장치 및 반도체 장치의 제조 방법
JP6901327B2 (ja) * 2017-06-12 2021-07-14 株式会社フジミインコーポレーテッド フィラー、成形体、及び放熱材料
WO2019003600A1 (ja) * 2017-06-28 2019-01-03 京セラ株式会社 封止用樹脂組成物、電子部品及び電子部品の製造方法
WO2020133494A1 (zh) * 2018-12-29 2020-07-02 广东生益科技股份有限公司 树脂组合物、预浸料、层压板、覆金属箔层压板和印刷线路板
US20250011526A1 (en) * 2021-11-17 2025-01-09 Threebond Co., Ltd. Microcapsule-type curable resin composition
JP2023127421A (ja) * 2022-03-01 2023-09-13 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

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* Cited by examiner, † Cited by third party
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US4111713A (en) * 1975-01-29 1978-09-05 Minnesota Mining And Manufacturing Company Hollow spheres
JPS58138728A (ja) * 1982-02-15 1983-08-17 Matsushita Electric Works Ltd エポキシ樹脂組成物
CA2087911C (en) * 1992-01-24 1999-06-29 Kiyoshi Abe Spherical granules of porous silica or silicate, process for the production thereof, and applications thereof
JP3143220B2 (ja) * 1992-07-07 2001-03-07 電気化学工業株式会社 充填材及びそれを用いた半導体封止用樹脂組成物
JP3454554B2 (ja) * 1993-12-28 2003-10-06 水澤化学工業株式会社 非晶質シリカ粒状体及びその製法
JPH0885719A (ja) * 1994-07-19 1996-04-02 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物及びその製造方法
JPH0841173A (ja) * 1994-07-27 1996-02-13 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物、その製造方法及びその硬化方法
JP3119104B2 (ja) * 1994-12-09 2000-12-18 信越化学工業株式会社 エポキシ樹脂組成物
JP4614214B2 (ja) * 1999-12-02 2011-01-19 信越化学工業株式会社 半導体装置素子用中空パッケージ
JP2001181479A (ja) * 1999-12-27 2001-07-03 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置
JP2002338230A (ja) * 2001-05-22 2002-11-27 Toagosei Co Ltd シリカ粒子及び樹脂組成物
JP3794349B2 (ja) * 2002-06-25 2006-07-05 松下電工株式会社 封止用液状エポキシ樹脂組成物及び半導体装置
JP2005264037A (ja) * 2004-03-19 2005-09-29 Kyocera Chemical Corp 封止用エポキシ樹脂組成物と樹脂封止型半導体装置
JP4112540B2 (ja) * 2004-08-26 2008-07-02 電気化学工業株式会社 球状無機質中空粉体の製造方法。
JP2006232950A (ja) 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP2006233016A (ja) * 2005-02-24 2006-09-07 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

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US20090261484A1 (en) 2009-10-22
US8106523B2 (en) 2012-01-31
JP2008156383A (ja) 2008-07-10

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