JP2008156383A5 - - Google Patents

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Publication number
JP2008156383A5
JP2008156383A5 JP2006343323A JP2006343323A JP2008156383A5 JP 2008156383 A5 JP2008156383 A5 JP 2008156383A5 JP 2006343323 A JP2006343323 A JP 2006343323A JP 2006343323 A JP2006343323 A JP 2006343323A JP 2008156383 A5 JP2008156383 A5 JP 2008156383A5
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JP
Japan
Prior art keywords
thickness
heating
resin composition
liquid resin
cured
Prior art date
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Application number
JP2006343323A
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English (en)
Japanese (ja)
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JP2008156383A (ja
JP5270833B2 (ja
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Priority to JP2006343323A priority Critical patent/JP5270833B2/ja
Priority claimed from JP2006343323A external-priority patent/JP5270833B2/ja
Publication of JP2008156383A publication Critical patent/JP2008156383A/ja
Priority to US12/435,639 priority patent/US8106523B2/en
Publication of JP2008156383A5 publication Critical patent/JP2008156383A5/ja
Application granted granted Critical
Publication of JP5270833B2 publication Critical patent/JP5270833B2/ja
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JP2006343323A 2006-12-20 2006-12-20 液状樹脂組成物、半導体装置及びその製造方法 Active JP5270833B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006343323A JP5270833B2 (ja) 2006-12-20 2006-12-20 液状樹脂組成物、半導体装置及びその製造方法
US12/435,639 US8106523B2 (en) 2006-12-20 2009-05-05 Liquid resin composition, semi-conductor device, and process of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006343323A JP5270833B2 (ja) 2006-12-20 2006-12-20 液状樹脂組成物、半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008156383A JP2008156383A (ja) 2008-07-10
JP2008156383A5 true JP2008156383A5 (enExample) 2009-07-23
JP5270833B2 JP5270833B2 (ja) 2013-08-21

Family

ID=39657680

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006343323A Active JP5270833B2 (ja) 2006-12-20 2006-12-20 液状樹脂組成物、半導体装置及びその製造方法

Country Status (2)

Country Link
US (1) US8106523B2 (enExample)
JP (1) JP5270833B2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2280044A4 (en) * 2008-05-21 2015-08-19 Nagase Chemtex Corp EPOXY RESIN COMPOSITION FOR THE PACKAGING OF AN ELECTRONIC COMPONENT
JP5259500B2 (ja) * 2009-06-10 2013-08-07 電気化学工業株式会社 非晶質シリカ質粉末およびその製造方法、用途
JP5672589B2 (ja) * 2009-06-25 2015-02-18 パナソニックＩｐマネジメント株式会社 液状エポキシ樹脂組成物
BR112014025149B1 (pt) * 2012-04-24 2020-09-29 Dow Global Technologies Llc Composição curável
CN104411765B (zh) 2012-04-24 2017-08-15 陶氏环球技术有限公司 用于具有改善的再涂性的船舶维护与维修涂料的环氧树脂组合物
US8980026B2 (en) 2012-09-28 2015-03-17 Apple Inc. Gap seals for electronic device structures
JP6185342B2 (ja) * 2013-09-05 2017-08-23 信越化学工業株式会社 封止材積層複合体、封止後半導体素子搭載基板又は封止後半導体素子形成ウエハ、及び半導体装置の製造方法
WO2015146149A1 (ja) * 2014-03-25 2015-10-01 パナソニックＩｐマネジメント株式会社 液状樹脂組成物、硬化物、配線構造体及びこの配線構造体を用いた実装体
US9799626B2 (en) * 2014-09-15 2017-10-24 Invensas Corporation Semiconductor packages and other circuit modules with porous and non-porous stabilizing layers
WO2016125664A1 (ja) * 2015-02-05 2016-08-11 味の素株式会社 樹脂組成物
KR20170053416A (ko) 2015-11-06 2017-05-16 주식회사 엘지화학 반도체 장치 및 반도체 장치의 제조 방법
JP6901327B2 (ja) * 2017-06-12 2021-07-14 株式会社フジミインコーポレーテッド フィラー、成形体、及び放熱材料
WO2019003600A1 (ja) * 2017-06-28 2019-01-03 京セラ株式会社 封止用樹脂組成物、電子部品及び電子部品の製造方法
CN111757911B (zh) * 2018-12-29 2023-02-28 广东生益科技股份有限公司 树脂组合物、预浸料、层压板、覆金属箔层压板和印刷线路板
WO2023090026A1 (ja) * 2021-11-17 2023-05-25 株式会社スリーボンド マイクロカプセル型硬化性樹脂組成物
JP2023127421A (ja) * 2022-03-01 2023-09-13 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4111713A (en) * 1975-01-29 1978-09-05 Minnesota Mining And Manufacturing Company Hollow spheres
JPS58138728A (ja) * 1982-02-15 1983-08-17 Matsushita Electric Works Ltd エポキシ樹脂組成物
CA2087911C (en) * 1992-01-24 1999-06-29 Kiyoshi Abe Spherical granules of porous silica or silicate, process for the production thereof, and applications thereof
JP3143220B2 (ja) * 1992-07-07 2001-03-07 電気化学工業株式会社 充填材及びそれを用いた半導体封止用樹脂組成物
JP3454554B2 (ja) * 1993-12-28 2003-10-06 水澤化学工業株式会社 非晶質シリカ粒状体及びその製法
JPH0885719A (ja) * 1994-07-19 1996-04-02 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物及びその製造方法
JPH0841173A (ja) * 1994-07-27 1996-02-13 Matsushita Electric Works Ltd 液状エポキシ樹脂組成物、その製造方法及びその硬化方法
JP3119104B2 (ja) * 1994-12-09 2000-12-18 信越化学工業株式会社 エポキシ樹脂組成物
JP4614214B2 (ja) * 1999-12-02 2011-01-19 信越化学工業株式会社 半導体装置素子用中空パッケージ
JP2001181479A (ja) * 1999-12-27 2001-07-03 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及び半導体装置
JP2002338230A (ja) * 2001-05-22 2002-11-27 Toagosei Co Ltd シリカ粒子及び樹脂組成物
JP3794349B2 (ja) * 2002-06-25 2006-07-05 松下電工株式会社 封止用液状エポキシ樹脂組成物及び半導体装置
JP2005264037A (ja) * 2004-03-19 2005-09-29 Kyocera Chemical Corp 封止用エポキシ樹脂組成物と樹脂封止型半導体装置
JP4112540B2 (ja) * 2004-08-26 2008-07-02 電気化学工業株式会社 球状無機質中空粉体の製造方法。
JP2006232950A (ja) 2005-02-23 2006-09-07 Matsushita Electric Works Ltd 封止用液状エポキシ樹脂組成物、半導体装置及びその製造方法
JP2006233016A (ja) * 2005-02-24 2006-09-07 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置

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