JP5265461B2 - 結晶性変性エポキシ樹脂、エポキシ樹脂組成物及び結晶性硬化物 - Google Patents

結晶性変性エポキシ樹脂、エポキシ樹脂組成物及び結晶性硬化物 Download PDF

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Publication number
JP5265461B2
JP5265461B2 JP2009149526A JP2009149526A JP5265461B2 JP 5265461 B2 JP5265461 B2 JP 5265461B2 JP 2009149526 A JP2009149526 A JP 2009149526A JP 2009149526 A JP2009149526 A JP 2009149526A JP 5265461 B2 JP5265461 B2 JP 5265461B2
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epoxy resin
resin composition
crystalline
cured product
curing agent
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JP2009149526A
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Japanese (ja)
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JP2010043245A (ja
Inventor
浩一郎 大神
智美 福永
正史 梶
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Nippon Steel and Sumikin Chemical Co Ltd
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Nippon Steel and Sumikin Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2009149526A 2008-07-16 2009-06-24 結晶性変性エポキシ樹脂、エポキシ樹脂組成物及び結晶性硬化物 Active JP5265461B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009149526A JP5265461B2 (ja) 2008-07-16 2009-06-24 結晶性変性エポキシ樹脂、エポキシ樹脂組成物及び結晶性硬化物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008184818 2008-07-16
JP2008184818 2008-07-16
JP2009149526A JP5265461B2 (ja) 2008-07-16 2009-06-24 結晶性変性エポキシ樹脂、エポキシ樹脂組成物及び結晶性硬化物

Publications (2)

Publication Number Publication Date
JP2010043245A JP2010043245A (ja) 2010-02-25
JP5265461B2 true JP5265461B2 (ja) 2013-08-14

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JP2009149526A Active JP5265461B2 (ja) 2008-07-16 2009-06-24 結晶性変性エポキシ樹脂、エポキシ樹脂組成物及び結晶性硬化物

Country Status (3)

Country Link
JP (1) JP5265461B2 (ko)
KR (1) KR20100008771A (ko)
TW (1) TWI439480B (ko)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101139280B1 (ko) * 2012-02-10 2012-04-26 주식회사 신아티앤씨 결정성 에폭시 수지
CN104822768B (zh) 2012-11-30 2017-09-08 Lg伊诺特有限公司 环氧树脂组合物和包括使用该环氧树脂组合物的绝缘层的印刷电路板
KR101984791B1 (ko) 2012-12-12 2019-09-03 엘지이노텍 주식회사 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판
KR102012311B1 (ko) 2012-12-12 2019-08-20 엘지이노텍 주식회사 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR101973686B1 (ko) 2012-12-12 2019-08-26 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR101973685B1 (ko) 2012-12-12 2019-08-26 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR102034228B1 (ko) 2012-12-14 2019-10-18 엘지이노텍 주식회사 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판
JP7320942B2 (ja) * 2018-12-28 2023-08-04 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
JP2022007637A (ja) 2020-06-26 2022-01-13 日鉄ケミカル＆マテリアル株式会社 多価ヒドロキシ樹脂、その製造方法、及びそれを含むエポキシ樹脂組成物、並びにエポキシ樹脂硬化物
JP7502916B2 (ja) 2020-06-30 2024-06-19 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
CN112625215B (zh) * 2020-12-15 2022-12-27 中科院广州化学所韶关技术创新与育成中心 一种有机无机杂化的本征型液晶环氧树脂及其制备方法与应用
WO2024029602A1 (ja) * 2022-08-05 2024-02-08 日鉄ケミカル＆マテリアル株式会社 樹脂組成物及び硬化物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001002756A (ja) * 1999-06-23 2001-01-09 Yuka Shell Epoxy Kk エポキシ樹脂混合物および硬化性エポキシ樹脂組成物
JP2001064362A (ja) * 1999-09-01 2001-03-13 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP5127160B2 (ja) * 2006-05-19 2013-01-23 日本化薬株式会社 エポキシ樹脂、硬化性樹脂組成物、およびその硬化物

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Publication number Publication date
TW201008968A (en) 2010-03-01
TWI439480B (zh) 2014-06-01
JP2010043245A (ja) 2010-02-25
KR20100008771A (ko) 2010-01-26

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