JP5258275B2 - 窒化物半導体装置およびその製造方法 - Google Patents
窒化物半導体装置およびその製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 70
- 150000004767 nitrides Chemical class 0.000 title claims description 69
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 150
- 239000010936 titanium Substances 0.000 claims description 70
- 238000010438 heat treatment Methods 0.000 claims description 61
- 239000010931 gold Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 27
- 229910052719 titanium Inorganic materials 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 13
- 230000003647 oxidation Effects 0.000 claims description 13
- 238000007254 oxidation reaction Methods 0.000 claims description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 12
- 239000001301 oxygen Substances 0.000 claims description 12
- 229910052760 oxygen Inorganic materials 0.000 claims description 12
- 229910052715 tantalum Inorganic materials 0.000 claims description 12
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 10
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 229910052763 palladium Inorganic materials 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 230000003064 anti-oxidating effect Effects 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims 1
- -1 nitride compound Chemical class 0.000 claims 1
- 239000003963 antioxidant agent Substances 0.000 description 22
- 230000003078 antioxidant effect Effects 0.000 description 22
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 12
- 239000007789 gas Substances 0.000 description 7
- 229910002601 GaN Inorganic materials 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 239000007772 electrode material Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 229910002704 AlGaN Inorganic materials 0.000 description 4
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 4
- 238000005253 cladding Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 238000000682 scanning probe acoustic microscopy Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 3
- 229910002091 carbon monoxide Inorganic materials 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 229910001882 dioxygen Inorganic materials 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
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- H01S5/00—Semiconductor lasers
- H01S5/04—Processes or apparatus for excitation, e.g. pumping, e.g. by electron beams
- H01S5/042—Electrical excitation ; Circuits therefor
- H01S5/0425—Electrodes, e.g. characterised by the structure
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2059—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion
- H01S5/2068—Methods of obtaining the confinement by means of particular conductivity zones, e.g. obtained by particle bombardment or diffusion obtained by radiation treatment or annealing
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2214—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
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- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
Description
Claims (7)
- 窒化物半導体から成るp型コンタクト層と、
前記p型コンタクト層上に順に形成される第1のパラジウム(Pd)膜およびタンタル(Ta)膜、ならびに前記Ta膜上部全面に形成される第2のPd膜から成るp電極と、
前記p電極上に形成されるパッド電極とを備え、
前記p電極を構成する第2のPd膜の膜厚は、50nm以上150nm以下であり、
前記パッド電極は、
前記p電極を構成する前記第2のPd膜に接して形成されるチタン(Ti)膜を含んで構成され、
前記Ti膜、タンタル(Ta)膜、もう一つのチタン(Ti)膜および金(Au)膜がこの順に前記p電極上に形成されて成るTi/Ta/Ti/Auの四層構造、または前記Ti膜、モリブデン(Mo)膜、もう一つのチタン(Ti)膜および金(Au)膜がこの順に前記p電極上に形成されて成るTi/Mo/Ti/Auの四層構造であることを特徴とする窒化物半導体装置。 - 前記p電極は、酸素原子を含み、
前記酸素原子は、前記p電極を構成するTa膜中に濃度分布がピークを有するように分布することを特徴とする請求項1に記載の窒化物半導体装置。 - 窒化物半導体から成るp型コンタクト層上に、第1のパラジウム(Pd)膜およびタンタル(Ta)膜をこの順に形成し、前記Ta膜上部全面に、前記Ta膜の酸化を防止する酸化防止膜として第2のPd膜を形成することによって、前記第1のPd膜、前記Ta膜および前記第2のPd膜から成るp電極を形成するp電極形成工程と、
形成された前記p電極を熱処理する熱処理工程と、
前記熱処理工程の後に、前記第2のPd膜の表面部を除去する除去工程と、
前記除去工程の後に、前記第2のPd膜上に、パッド電極を形成するパッド電極形成工程とを備え、
前記p電極形成工程では、前記第2のPd膜を50nm以上150nm以下の膜厚に形成し、
前記パッド電極形成工程では、前記第2のPd膜に接してチタン(Ti)膜を形成し、前記Ti膜、タンタル(Ta)膜、もう一つのチタン(Ti)膜および金(Au)膜がこの順に前記p電極上に形成されて成るTi/Ta/Ti/Auの四層構造、または前記Ti膜、モリブデン(Mo)膜、もう一つのチタン(Ti)膜および金(Au)膜がこの順に前記p電極上に形成されて成るTi/Mo/Ti/Auの四層構造のパッド電極を形成することを特徴とする窒化物半導体装置の製造方法。 - 前記熱処理工程では、熱処理温度が400℃以上500℃以下の範囲で前記p電極を熱処理することを特徴とする請求項3に記載の窒化物半導体装置の製造方法。
- 前記熱処理工程では、酸素濃度が10%以上50%以下の雰囲気下で前記p電極を熱処理することを特徴とする請求項3または4に記載の窒化物半導体装置の製造方法。
- 前記p電極形成工程では、前記第1のPd膜、前記Ta膜および前記第2のPd膜のうち、少なくとも1つの成膜を、雰囲気中の酸素濃度をコントロールして行うことを特徴とする請求項3〜5のいずれか1つに記載の窒化物半導体装置の製造方法。
- 前記除去工程では、前記第2のPd膜の表面部を、エッチングによって除去することを特徴とする請求項3〜6のいずれか1つに記載の窒化物半導体装置の製造方法。
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JP2007317070A JP5258275B2 (ja) | 2007-12-07 | 2007-12-07 | 窒化物半導体装置およびその製造方法 |
TW097141563A TWI416602B (zh) | 2007-12-07 | 2008-10-29 | Nitride semiconductor device and manufacturing method thereof |
US12/327,874 US7795738B2 (en) | 2007-12-07 | 2008-12-04 | Nitride semiconductor device |
CN2008101780236A CN101452899B (zh) | 2007-12-07 | 2008-12-08 | 氮化物半导体装置及其制造方法 |
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JP2007317070A JP5258275B2 (ja) | 2007-12-07 | 2007-12-07 | 窒化物半導体装置およびその製造方法 |
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JP2009141195A JP2009141195A (ja) | 2009-06-25 |
JP5258275B2 true JP5258275B2 (ja) | 2013-08-07 |
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US (1) | US7795738B2 (ja) |
JP (1) | JP5258275B2 (ja) |
CN (1) | CN101452899B (ja) |
TW (1) | TWI416602B (ja) |
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JP5258272B2 (ja) | 2007-11-30 | 2013-08-07 | 三菱電機株式会社 | 窒化物半導体装置およびその製造方法 |
JP5639626B2 (ja) * | 2012-01-13 | 2014-12-10 | シャープ株式会社 | 半導体発光素子及び電極成膜方法 |
JP5556830B2 (ja) * | 2012-02-21 | 2014-07-23 | 住友電気工業株式会社 | 半導体装置、及び、半導体装置の作製方法 |
DE102016125857B4 (de) | 2016-12-29 | 2022-05-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleiterlaserdiode |
CN107527974B (zh) * | 2017-08-16 | 2019-06-25 | 天津三安光电有限公司 | 一种利于焊线的led电极结构 |
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JP3292044B2 (ja) * | 1996-05-31 | 2002-06-17 | 豊田合成株式会社 | p伝導形3族窒化物半導体の電極パッド及びそれを有した素子及び素子の製造方法 |
JP3557791B2 (ja) * | 1996-06-18 | 2004-08-25 | 豊田合成株式会社 | 3族窒化物半導体の電極及びその電極を有した素子 |
JPH11298040A (ja) * | 1998-04-10 | 1999-10-29 | Sharp Corp | 半導体発光素子及びその製造方法 |
JP3427732B2 (ja) * | 1998-06-17 | 2003-07-22 | 日亜化学工業株式会社 | 窒化物半導体素子の製造方法 |
JP2001015852A (ja) * | 1999-04-26 | 2001-01-19 | Sharp Corp | p型のIII族窒化物半導体層上の電極構造とその形成方法 |
JP2003046127A (ja) * | 2001-05-23 | 2003-02-14 | Sanyo Electric Co Ltd | 窒化物系半導体発光素子 |
JP3812366B2 (ja) * | 2001-06-04 | 2006-08-23 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子の製造方法 |
JP3765246B2 (ja) | 2001-06-06 | 2006-04-12 | 豊田合成株式会社 | Iii族窒化物系化合物半導体発光素子の製造方法 |
JP2003031895A (ja) * | 2001-07-13 | 2003-01-31 | Sharp Corp | 半導体発光装置およびその製造方法 |
CN100502060C (zh) * | 2003-02-19 | 2009-06-17 | 日亚化学工业株式会社 | 氮化物半导体元件 |
US7250631B2 (en) * | 2003-10-14 | 2007-07-31 | Nichia Corporation | Semiconductor laser having protruding portion |
KR100585919B1 (ko) * | 2004-01-15 | 2006-06-01 | 학교법인 포항공과대학교 | 질화갈륨계 ⅲⅴ족 화합물 반도체 소자 및 그 제조방법 |
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WO2006120908A1 (ja) * | 2005-05-02 | 2006-11-16 | Nichia Corporation | 窒化物系半導体素子及びその製造方法 |
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JP4868821B2 (ja) * | 2005-10-21 | 2012-02-01 | 京セラ株式会社 | 窒化ガリウム系化合物半導体及び発光素子 |
JP4952534B2 (ja) * | 2007-11-20 | 2012-06-13 | 三菱電機株式会社 | 窒化物半導体発光素子の製造方法 |
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CN101452899B (zh) | 2010-12-08 |
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US20090146308A1 (en) | 2009-06-11 |
US7795738B2 (en) | 2010-09-14 |
JP2009141195A (ja) | 2009-06-25 |
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