JP5254382B2 - 完全統合イーサネット(登録商標)コネクタ - Google Patents
完全統合イーサネット(登録商標)コネクタ Download PDFInfo
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- JP5254382B2 JP5254382B2 JP2011039013A JP2011039013A JP5254382B2 JP 5254382 B2 JP5254382 B2 JP 5254382B2 JP 2011039013 A JP2011039013 A JP 2011039013A JP 2011039013 A JP2011039013 A JP 2011039013A JP 5254382 B2 JP5254382 B2 JP 5254382B2
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- Prior art keywords
- ethernet
- serial
- jack
- circuit board
- pcb
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- 238000006243 chemical reaction Methods 0.000 claims abstract description 34
- 238000004891 communication Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 16
- 230000006870 function Effects 0.000 description 10
- VLLVVZDKBSYMCG-UHFFFAOYSA-N 1,3,5-trichloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1Cl VLLVVZDKBSYMCG-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- ALFHIHDQSYXSGP-UHFFFAOYSA-N 1,2-dichloro-3-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1Cl ALFHIHDQSYXSGP-UHFFFAOYSA-N 0.000 description 8
- AIURIRUDHVDRFQ-UHFFFAOYSA-N 1,2,3,4-tetrachloro-5-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC(Cl)=C(Cl)C(Cl)=C1Cl AIURIRUDHVDRFQ-UHFFFAOYSA-N 0.000 description 6
- 238000002955 isolation Methods 0.000 description 6
- QGDKRLQRLFUJPP-UHFFFAOYSA-N 1,2,3,5-tetrachloro-4-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=C(Cl)C=C(Cl)C(Cl)=C1Cl QGDKRLQRLFUJPP-UHFFFAOYSA-N 0.000 description 5
- GOFFZTAPOOICFT-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,3-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC(Cl)=C1Cl GOFFZTAPOOICFT-UHFFFAOYSA-N 0.000 description 5
- RKUAZJIXKHPFRK-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,4-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=C(Cl)C=C(Cl)C=C1Cl RKUAZJIXKHPFRK-UHFFFAOYSA-N 0.000 description 5
- XBTHILIDLBPRPM-UHFFFAOYSA-N 2,2',4,5-tetrachlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC(Cl)=C(Cl)C=C1Cl XBTHILIDLBPRPM-UHFFFAOYSA-N 0.000 description 5
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000011324 bead Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005670 electromagnetic radiation Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- SXHLTVKPNQVZGL-UHFFFAOYSA-N 1,2-dichloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=CC=2)Cl)=C1 SXHLTVKPNQVZGL-UHFFFAOYSA-N 0.000 description 1
- DCMURXAZTZQAFB-UHFFFAOYSA-N 1,4-dichloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC=CC=2)Cl)=C1 DCMURXAZTZQAFB-UHFFFAOYSA-N 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- -1 inductors Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6658—Structural association with built-in electrical component with built-in electronic circuit on printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6691—Structural association with built-in electrical component with built-in electronic circuit with built-in signalling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/04—Connectors or connections adapted for particular applications for network, e.g. LAN connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/60—Contacts spaced along planar side wall transverse to longitudinal axis of engagement
- H01R24/62—Sliding engagements with one side only, e.g. modular jack coupling devices
- H01R24/64—Sliding engagements with one side only, e.g. modular jack coupling devices for high frequency, e.g. RJ 45
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
Description
本発明は一般にイーサネット(登録商標)ポート、並びに、このようなポートと関連するシリアル・トゥ・イーサネット(登録商標)変換に関する。特に、本発明は、断面形状を縮小し、かつ、製造コストと複雑さとを低減するためにイーサネット(登録商標)ジャック内に完全に収納されるシリアル・トゥ・イーサネット(登録商標)変換器の組立て構造および方法に関する。さらに、シリアル・トゥ・イーサネット(登録商標)変換器には汎用プログラムが可能な入出力用ピン(PIO)も含まれる。これらのPIOを用いて、マイクロコントローラを持たないデバイスの制御を行い、このようなデバイスからデータの読み出しを行うようにすることも可能である。この一体型RJ-45/変換器デバイスは、知能が足りない(マイクロコントローラを持たない)電子デバイス用の完全なモジュラ型イーサネット(登録商標)インタフェースとして使用することが可能である。
れかの態様をとる。メーカーはイーサネット(登録商標)−シリアル変換用モジュラ型システムの提供を試みてきたが、すべての例で、変換と関連する電子回路がRJ-45ジャッ
クハウジングの外側のPCB基板に取り付けられていた。RJ-45ジャックの標準的配
置構成並びに付随する電子回路部品とに起因して、周知のシステムでは、クリティカルな限られた空間を占める極めて大きな設置面積が必要となる。
リード線を通じてこのLEDを制御した。組み込まれたLED部品の1例が米国特許出願第4,978,317号に記載されている。該特許の要旨は本願明細書で参照により援用される。公知の素子において、メーカーはシリアルから−イーサネット(登録商標)への完全な変換に必要なすべての部品を標準的ジャックハウジング内に配置することはできなかった。この点に関して、メーカーは、完全なシリアル・トゥ・イーサネット(登録商標)変換機能を備えたモジュラ型RJ-45ジャックの提供を行うことはできなかった。
本発明はシリアル・トゥ・イーサネット(登録商標)モジュラ型変換用ジャック、並びに、同変換用ジャックの組立て製造方法に関する。本発明の実施形態では、シリアル・トゥ・イーサネット(登録商標)変換用電子部品は小型化され、RJ-45ジャック内に完全に
収納される。コントローラハードウェア、磁気部品ハードウェアおよびファームウェアを含む(但しこれらに限定されるものではない)、シリアルからイーサネット(登録商標)への変換に必要なすべての部品が上記ハードウェアおよびファームウェアと共に含まれる。制御用通信機能が、メモリ、電圧レギュレータおよび監視回路を含むICパッケージと、小型化された周辺機器チップとの中へ組み込まれ、さらに、上記制御用通信機能はジャックのハウジング内の1または2以上のPCB上に設けられる。本発明の変換用ジャックは基板メモリ上に十分な部品をさらに備え、それによって必要なすべての制御用ファームウェアが変換器内に含まれることになる。制御機能と監視機能、並びに、PIOピンの追加により、非インテリジェントデバイス(RS232シリアルデータを用いて作動できない)とのイーサネット(登録商標)接続機能を追加する措置も講じられる。IC間制御(I2C)、シリアル周辺機器用インタフェース(SPI)、コントローラエリアネットワーク(CAN)、ProfiBus、ユニバーサルシリアルバス(USB)、デュアルポートメモリ)(但しこれらに限定されるものではない)などの組み込まれたマイクロコントローラの機能に起因して、わずかな変更によりその他の通信用インタフェースを追加することも可能である。これは、イーサネット(登録商標)と他の多くのインタフェース間でモジュールが変換器として機能できることを意味するものである。
商標)変換の完了に必要なすべての電気部品を収納する隔離された内部チャンバも備える
。接続ポートの電気的コンタクト部と通常の電気的通信を行っている状態で、第1、第2および第3の回路基板にはシリアル・トゥ・イーサネット(登録商標)回路部品が一括して組み込まれる。第1および第2の回路基板は内部チャンバ内に略水平な平行関係に配置される。第3の回路基板は、第1と第2の回路基板に対して略垂直に配置され、前記第1と第2の回路基板と構造的に接続され、さらに、前記第1と第2の回路基板に対して構造上の支持部材が設けられる。第3の回路基板はさらに前記第1と第2の回路基板を電気的に相互に接続する。
添付図面と関連して以下に記載するような詳細な説明は、本発明の一般に好ましい実施形態についての説明を意図するものであって、本発明の唯一の実施形態を表すものではない。本発明に対する種々の変更が様々な実施形態に含まれてもよく、このような変更は本発明の精神と範囲内に含まれるものであることを理解されたい。
クト22には、差込プラグ(図示せず)と係合するためにスプリング付勢が設けられる。
登録商標)変換の完成に必要な電子回路部品が一括して組み込まれている。PCB42に
は、絶縁変圧器と、同相チョークと、終端抵抗器と、(ESDおよび電圧サージ用の)高電圧放電コンデンサとを含む(但しこれらに限定されるものではない)回路の磁気部品部が含まれる。この実施構成では、PCB48は単に電気的相互接続を行うためにのみ使用されているが、必要な場合、回路部品用とし使用することも可能である。
装置62は、本発明でコントローラブロックが必要とする第2の印加電圧を出力する。シリアルデータはPCB10ピン64を介してコントローラブロック間を往来して外部装置へ伝送される。(PCB10ピン64を介して接続された)フロー制御ラインとハンドシェイクラインとは、シリアルデータ列の制御に用いられる標準的信号である。コントローラブロックは、PCB10ピン64を介して接続するPIOラインを通じて外部装置との通信を行うことができる。図5に図示のような部品が具体的に特定されてはいるが、シリアル・トゥ・イーサネット(登録商標)変換機能の制御を完成するいずれの制御回路も本発明により想定されていると理解されたい。
クのコンタクト72aを通じてイーサネット(登録商標)ケーブルと接続する。着信するイーサネット(登録商標)信号はコンタクト72cを通ってジャックの中へ入り、同相チョーク80を通り抜ける。これによってデバイスの中へ伝導されるスプリアス同相ノイズが低減する。信号は絶縁変圧器76を通り抜け、ピン52と26との中を通って制御ボード50へ達する。絶縁変圧器74と76のセンタタップ70bと70cは、制御ボード50上の送受信回路における適正なDCバイアスレベルの設定に利用される。またこれらのセンタタップはピン52と26とを介して制御ボード50とも接続されている。
としては使用されない。これらのコンタクトはマッチングレジスタ82cと82d並びにコンデンサ84を介してアースと終端され、ノイズとDCトランジェントとの低減が図られる。コンタクト72aと72cに存在する、イーサネット(登録商標)ケーブルのDCトランジェント(“ESD”)は抵抗器82aと82bとを介してアースヘ放電を行うことにより低減される。
Claims (1)
- オープンキャビティと内部チャンバとを含むハウジングを備えたモジュラ型通信用ジャックであって、
前記オープンキャビティと前記内部チャンバとは隔離され、
前記オープンキャビティは複数の電気的コンタクトのアレイを収容し、
前記内部チャンバは、互いに電気的に連通かつ離間する少なくとも2つの回路基板を収容し、
前記少なくとも2つの回路基板の総面積は、シリアル・トゥ・イーサネット(登録商標)変換を完了する複数の回路部品を一括して組み込むのに十分な面積であり、
前記少なくとも2つの回路基板の少なくとも1つが前記オープンキャビティと前記内部チャンバとが共有する壁と直交する平面内において、前記コンタクトの端部を形成する少なくとも2つのピン間に狭持される、モジュラ型通信用ジャック。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/122,867 | 2002-04-15 | ||
US10/122,867 US6881096B2 (en) | 2002-04-15 | 2002-04-15 | Compact serial-to-ethernet conversion port |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008287207A Division JP2009026776A (ja) | 2002-04-15 | 2008-11-07 | 完全統合イーサネット(登録商標)コネクタ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011129534A JP2011129534A (ja) | 2011-06-30 |
JP2011129534A5 JP2011129534A5 (ja) | 2012-03-29 |
JP5254382B2 true JP5254382B2 (ja) | 2013-08-07 |
Family
ID=28790634
Family Applications (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003586971A Withdrawn JP2005522854A (ja) | 2002-04-15 | 2003-04-08 | 完全統合イーサネット(登録商標)コネクタ |
JP2008130187A Pending JP2008210816A (ja) | 2002-04-15 | 2008-05-16 | 完全統合イーサネット(登録商標)コネクタ |
JP2008130186A Pending JP2008258173A (ja) | 2002-04-15 | 2008-05-16 | 完全統合イーサネット(登録商標)コネクタ |
JP2008287207A Pending JP2009026776A (ja) | 2002-04-15 | 2008-11-07 | 完全統合イーサネット(登録商標)コネクタ |
JP2011039013A Expired - Lifetime JP5254382B2 (ja) | 2002-04-15 | 2011-02-24 | 完全統合イーサネット(登録商標)コネクタ |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003586971A Withdrawn JP2005522854A (ja) | 2002-04-15 | 2003-04-08 | 完全統合イーサネット(登録商標)コネクタ |
JP2008130187A Pending JP2008210816A (ja) | 2002-04-15 | 2008-05-16 | 完全統合イーサネット(登録商標)コネクタ |
JP2008130186A Pending JP2008258173A (ja) | 2002-04-15 | 2008-05-16 | 完全統合イーサネット(登録商標)コネクタ |
JP2008287207A Pending JP2009026776A (ja) | 2002-04-15 | 2008-11-07 | 完全統合イーサネット(登録商標)コネクタ |
Country Status (11)
Country | Link |
---|---|
US (2) | US6881096B2 (ja) |
EP (1) | EP1500168B1 (ja) |
JP (5) | JP2005522854A (ja) |
CN (2) | CN100413152C (ja) |
AT (1) | ATE418168T1 (ja) |
AU (1) | AU2003221679A1 (ja) |
DE (1) | DE60325346D1 (ja) |
HK (1) | HK1073535A1 (ja) |
MY (1) | MY127302A (ja) |
TW (1) | TW550860B (ja) |
WO (1) | WO2003090317A1 (ja) |
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US7309260B2 (en) * | 2002-04-15 | 2007-12-18 | Lantronix, Inc. | Wireless communication module |
US7225247B2 (en) * | 2002-10-17 | 2007-05-29 | Intel Corporation | Serial port redirection using a management controller |
JPWO2005003980A1 (ja) * | 2003-07-01 | 2007-09-20 | 株式会社ティアンドデイ | 多目的半導体集積回路装置 |
TWM244622U (en) * | 2003-07-22 | 2004-09-21 | Via Tech Inc | Socket structure for use between main board and external signal line and main board structure |
US8271620B2 (en) * | 2003-11-13 | 2012-09-18 | Lantronix, Inc. | Communication protocol converter and method of protocol conversion |
US8010789B2 (en) | 2003-11-13 | 2011-08-30 | Lantronix, Inc. | Secure data transfer using an embedded system |
US7701092B1 (en) | 2003-12-19 | 2010-04-20 | Avaya, Inc. | Connector module with embedded power-over-ethernet voltage isolation and method |
US7445507B1 (en) * | 2003-12-19 | 2008-11-04 | Nortel Networks Limited | Connector module with embedded physical layer support and method |
US7182649B2 (en) | 2003-12-22 | 2007-02-27 | Panduit Corp. | Inductive and capacitive coupling balancing electrical connector |
US7179131B2 (en) * | 2004-02-12 | 2007-02-20 | Panduit Corp. | Methods and apparatus for reducing crosstalk in electrical connectors |
TW200529498A (en) * | 2004-02-24 | 2005-09-01 | Delta Electronics Inc | Connector module |
CN102082367B (zh) | 2004-03-12 | 2013-11-20 | 泛达公司 | 减小电连接器中串扰的方法及装置 |
US7153168B2 (en) * | 2004-04-06 | 2006-12-26 | Panduit Corp. | Electrical connector with improved crosstalk compensation |
FR2868872A1 (fr) * | 2004-04-09 | 2005-10-14 | Itt Mfg Enterprises Inc | Element de connexion comportant un dispositif integre de commutation simultanee de plusieurs voies de signaux |
GB0414007D0 (en) * | 2004-06-23 | 2004-07-28 | Ibm | A connector |
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AU2003221679A1 (en) | 2003-11-03 |
TW550860B (en) | 2003-09-01 |
CN100413152C (zh) | 2008-08-20 |
EP1500168B1 (en) | 2008-12-17 |
CN1663078A (zh) | 2005-08-31 |
JP2008258173A (ja) | 2008-10-23 |
US7018242B2 (en) | 2006-03-28 |
US20030194908A1 (en) | 2003-10-16 |
US6881096B2 (en) | 2005-04-19 |
US20050136731A1 (en) | 2005-06-23 |
EP1500168A4 (en) | 2006-06-21 |
JP2008210816A (ja) | 2008-09-11 |
ATE418168T1 (de) | 2009-01-15 |
MY127302A (en) | 2006-11-30 |
WO2003090317A1 (en) | 2003-10-30 |
JP2005522854A (ja) | 2005-07-28 |
DE60325346D1 (de) | 2009-01-29 |
EP1500168A1 (en) | 2005-01-26 |
CN100594636C (zh) | 2010-03-17 |
JP2009026776A (ja) | 2009-02-05 |
JP2011129534A (ja) | 2011-06-30 |
HK1073535A1 (en) | 2005-10-07 |
CN101188334A (zh) | 2008-05-28 |
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