JP5252861B2 - 基板の処理装置 - Google Patents

基板の処理装置 Download PDF

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Publication number
JP5252861B2
JP5252861B2 JP2007226126A JP2007226126A JP5252861B2 JP 5252861 B2 JP5252861 B2 JP 5252861B2 JP 2007226126 A JP2007226126 A JP 2007226126A JP 2007226126 A JP2007226126 A JP 2007226126A JP 5252861 B2 JP5252861 B2 JP 5252861B2
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Prior art keywords
gas
substrate
nanobubbles
processing
liquid
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JP2007226126A
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English (en)
Japanese (ja)
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JP2008198974A5 (enExample
JP2008198974A (ja
Inventor
明典 磯
幸伸 西部
康朝 藤森
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2007226126A priority Critical patent/JP5252861B2/ja
Priority to PCT/JP2008/050264 priority patent/WO2008087903A1/ja
Priority to CN2008800019551A priority patent/CN101578688B/zh
Priority to TW97101146A priority patent/TWI415694B/zh
Publication of JP2008198974A publication Critical patent/JP2008198974A/ja
Publication of JP2008198974A5 publication Critical patent/JP2008198974A5/ja
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Publication of JP5252861B2 publication Critical patent/JP5252861B2/ja
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  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Weting (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2007226126A 2007-01-15 2007-08-31 基板の処理装置 Active JP5252861B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007226126A JP5252861B2 (ja) 2007-01-15 2007-08-31 基板の処理装置
PCT/JP2008/050264 WO2008087903A1 (ja) 2007-01-15 2008-01-11 基板の処理装置及び処理方法
CN2008800019551A CN101578688B (zh) 2007-01-15 2008-01-11 基板的处理装置以及处理方法
TW97101146A TWI415694B (zh) 2007-01-15 2008-01-11 Substrate processing device and processing method thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007006061 2007-01-15
JP2007006061 2007-01-15
JP2007226126A JP5252861B2 (ja) 2007-01-15 2007-08-31 基板の処理装置

Publications (3)

Publication Number Publication Date
JP2008198974A JP2008198974A (ja) 2008-08-28
JP2008198974A5 JP2008198974A5 (enExample) 2010-10-14
JP5252861B2 true JP5252861B2 (ja) 2013-07-31

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ID=39757617

Family Applications (1)

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JP2007226126A Active JP5252861B2 (ja) 2007-01-15 2007-08-31 基板の処理装置

Country Status (3)

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JP (1) JP5252861B2 (enExample)
CN (1) CN101578688B (enExample)
TW (1) TWI415694B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153475A (ja) * 2008-12-24 2010-07-08 Sokudo Co Ltd 基板処理装置および基板処理方法
JP5666086B2 (ja) 2008-12-25 2015-02-12 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ シリコンウェハ洗浄装置
JP2010221069A (ja) * 2009-03-19 2010-10-07 Kanto Auto Works Ltd 塗装機の洗浄方法及び塗装装置
JP5656245B2 (ja) * 2010-06-17 2015-01-21 芝浦メカトロニクス株式会社 洗浄方法及び洗浄装置
JP2012170872A (ja) * 2011-02-21 2012-09-10 Shibaura Mechatronics Corp 基板洗浄装置、基板洗浄方法、表示装置の製造装置及び表示装置の製造方法
JP2013191779A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 処理装置および処理方法
CN104898324B (zh) * 2014-03-07 2017-11-17 芝浦机械电子株式会社 接液处理装置、接液处理方法、基板处理装置及基板处理方法
KR101519630B1 (ko) * 2014-03-31 2015-05-14 (주) 에스엠씨 에칭시스템
JP6645900B2 (ja) 2016-04-22 2020-02-14 キオクシア株式会社 基板処理装置および基板処理方法
TWI648098B (zh) * 2017-11-14 2019-01-21 亞智科技股份有限公司 氣液混合機構、製程設備及氣液混合方法
CN107952741A (zh) * 2017-11-30 2018-04-24 江苏维仪工业科技有限公司 一种微纳米发生器在电镀水洗中的使用方法
JP7580735B2 (ja) * 2018-02-09 2024-11-12 国立大学法人 東京大学 難水溶性有機化合物の溶解システム、難水溶性有機化合物の溶解方法、及び匂い検出システム
CN110153057A (zh) * 2018-02-14 2019-08-23 特铨股份有限公司 基板清洗设备以及基板清洗方法
CN110045522A (zh) * 2019-03-22 2019-07-23 湖南飞优特电子科技有限公司 一种lcd制程pi粉尘污迹不良的控制装置
CN110473773B (zh) * 2019-08-22 2022-03-22 北京北方华创微电子装备有限公司 晶圆清洗方法及晶圆清洗设备
JP7265467B2 (ja) * 2019-12-17 2023-04-26 株式会社荏原製作所 レジスト除去システムおよびレジスト除去方法
JP7265466B2 (ja) * 2019-12-17 2023-04-26 株式会社荏原製作所 レジスト除去システムおよびレジスト除去方法
KR102303107B1 (ko) * 2020-03-31 2021-09-16 주식회사 디엠에스 이산화탄소 용해모듈 및 이를 포함한 기판처리장치
WO2022085414A1 (ja) * 2020-10-23 2022-04-28 株式会社Sumco 枚葉式ウェーハ洗浄装置の配管の洗浄方法
KR102664947B1 (ko) * 2022-01-03 2024-05-10 주식회사 하이텍환경 가압 선회방식이 적용된 마이크로 나노 버블 생성 장치
JP2024134798A (ja) * 2023-03-22 2024-10-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及びその装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999033553A1 (en) * 1997-12-30 1999-07-08 Hirofumi Ohnari Swirling fine-bubble generator
JP3397154B2 (ja) * 1997-12-30 2003-04-14 博文 大成 旋回式微細気泡発生装置
JP2001269631A (ja) * 2000-03-27 2001-10-02 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2004121962A (ja) * 2002-10-01 2004-04-22 National Institute Of Advanced Industrial & Technology ナノバブルの利用方法及び装置
JP2006147617A (ja) * 2004-11-16 2006-06-08 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法
JP2006179765A (ja) * 2004-12-24 2006-07-06 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法
US7392814B2 (en) * 2004-12-24 2008-07-01 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and method

Also Published As

Publication number Publication date
CN101578688B (zh) 2011-04-13
CN101578688A (zh) 2009-11-11
TWI415694B (zh) 2013-11-21
TW200911395A (en) 2009-03-16
JP2008198974A (ja) 2008-08-28

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