JP2008198974A5 - - Google Patents

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Publication number
JP2008198974A5
JP2008198974A5 JP2007226126A JP2007226126A JP2008198974A5 JP 2008198974 A5 JP2008198974 A5 JP 2008198974A5 JP 2007226126 A JP2007226126 A JP 2007226126A JP 2007226126 A JP2007226126 A JP 2007226126A JP 2008198974 A5 JP2008198974 A5 JP 2008198974A5
Authority
JP
Japan
Prior art keywords
gas
processing
shearer
nanobubbles
supply unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007226126A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008198974A (ja
JP5252861B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007226126A priority Critical patent/JP5252861B2/ja
Priority claimed from JP2007226126A external-priority patent/JP5252861B2/ja
Priority to TW97101146A priority patent/TWI415694B/zh
Priority to CN2008800019551A priority patent/CN101578688B/zh
Priority to PCT/JP2008/050264 priority patent/WO2008087903A1/ja
Publication of JP2008198974A publication Critical patent/JP2008198974A/ja
Publication of JP2008198974A5 publication Critical patent/JP2008198974A5/ja
Application granted granted Critical
Publication of JP5252861B2 publication Critical patent/JP5252861B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2007226126A 2007-01-15 2007-08-31 基板の処理装置 Active JP5252861B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007226126A JP5252861B2 (ja) 2007-01-15 2007-08-31 基板の処理装置
TW97101146A TWI415694B (zh) 2007-01-15 2008-01-11 Substrate processing device and processing method thereof
CN2008800019551A CN101578688B (zh) 2007-01-15 2008-01-11 基板的处理装置以及处理方法
PCT/JP2008/050264 WO2008087903A1 (ja) 2007-01-15 2008-01-11 基板の処理装置及び処理方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007006061 2007-01-15
JP2007006061 2007-01-15
JP2007226126A JP5252861B2 (ja) 2007-01-15 2007-08-31 基板の処理装置

Publications (3)

Publication Number Publication Date
JP2008198974A JP2008198974A (ja) 2008-08-28
JP2008198974A5 true JP2008198974A5 (enExample) 2010-10-14
JP5252861B2 JP5252861B2 (ja) 2013-07-31

Family

ID=39757617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007226126A Active JP5252861B2 (ja) 2007-01-15 2007-08-31 基板の処理装置

Country Status (3)

Country Link
JP (1) JP5252861B2 (enExample)
CN (1) CN101578688B (enExample)
TW (1) TWI415694B (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153475A (ja) * 2008-12-24 2010-07-08 Sokudo Co Ltd 基板処理装置および基板処理方法
JP5666086B2 (ja) 2008-12-25 2015-02-12 ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ シリコンウェハ洗浄装置
JP2010221069A (ja) * 2009-03-19 2010-10-07 Kanto Auto Works Ltd 塗装機の洗浄方法及び塗装装置
JP5656245B2 (ja) * 2010-06-17 2015-01-21 芝浦メカトロニクス株式会社 洗浄方法及び洗浄装置
JP2012170872A (ja) * 2011-02-21 2012-09-10 Shibaura Mechatronics Corp 基板洗浄装置、基板洗浄方法、表示装置の製造装置及び表示装置の製造方法
JP2013191779A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 処理装置および処理方法
CN104898324B (zh) * 2014-03-07 2017-11-17 芝浦机械电子株式会社 接液处理装置、接液处理方法、基板处理装置及基板处理方法
KR101519630B1 (ko) * 2014-03-31 2015-05-14 (주) 에스엠씨 에칭시스템
JP6645900B2 (ja) 2016-04-22 2020-02-14 キオクシア株式会社 基板処理装置および基板処理方法
TWI648098B (zh) * 2017-11-14 2019-01-21 亞智科技股份有限公司 氣液混合機構、製程設備及氣液混合方法
CN107952741A (zh) * 2017-11-30 2018-04-24 江苏维仪工业科技有限公司 一种微纳米发生器在电镀水洗中的使用方法
WO2019156180A1 (ja) * 2018-02-09 2019-08-15 国立大学法人東京大学 難水溶性有機化合物の溶解システム、難水溶性有機化合物の溶解方法、及び匂い検出システム
CN110153057A (zh) * 2018-02-14 2019-08-23 特铨股份有限公司 基板清洗设备以及基板清洗方法
CN110045522A (zh) * 2019-03-22 2019-07-23 湖南飞优特电子科技有限公司 一种lcd制程pi粉尘污迹不良的控制装置
CN110473773B (zh) * 2019-08-22 2022-03-22 北京北方华创微电子装备有限公司 晶圆清洗方法及晶圆清洗设备
JP7265466B2 (ja) * 2019-12-17 2023-04-26 株式会社荏原製作所 レジスト除去システムおよびレジスト除去方法
JP7265467B2 (ja) * 2019-12-17 2023-04-26 株式会社荏原製作所 レジスト除去システムおよびレジスト除去方法
KR102303107B1 (ko) * 2020-03-31 2021-09-16 주식회사 디엠에스 이산화탄소 용해모듈 및 이를 포함한 기판처리장치
CN116325082B (zh) * 2020-10-23 2025-11-25 胜高股份有限公司 单片式晶圆洗涤装置的配管的洗涤方法
KR102664947B1 (ko) * 2022-01-03 2024-05-10 주식회사 하이텍환경 가압 선회방식이 적용된 마이크로 나노 버블 생성 장치
JP2024134798A (ja) * 2023-03-22 2024-10-04 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法及びその装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3397154B2 (ja) * 1997-12-30 2003-04-14 博文 大成 旋回式微細気泡発生装置
US6382601B1 (en) * 1997-12-30 2002-05-07 Hirofumi Ohnari Swirling fine-bubble generator
JP2001269631A (ja) * 2000-03-27 2001-10-02 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2004121962A (ja) * 2002-10-01 2004-04-22 National Institute Of Advanced Industrial & Technology ナノバブルの利用方法及び装置
JP2006147617A (ja) * 2004-11-16 2006-06-08 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法
JP2006179765A (ja) * 2004-12-24 2006-07-06 Dainippon Screen Mfg Co Ltd 基板処理装置およびパーティクル除去方法
US7392814B2 (en) * 2004-12-24 2008-07-01 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus and method

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